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Physics in medicine & biology, 2016-05, Vol.61 (9), p.3521-3535
2016
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Radiotherapy and oncology, 2014, Vol.111, p.S68-S68
2014
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Radiotherapy and oncology, 2013-03, Vol.106, p.S297-S297
2013
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Physica medica, 2013-06, Vol.29, p.e9-e9
2013
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1830
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Pharmaceutical research, 2018-12, Vol.35 (12), p.227-12, Article 227
2018
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IEEE transactions on electron devices, 2019-12, Vol.66 (12), p.5387-5392
2019
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Free radical research, 2014-10, Vol.48 (10), p.1218-1231
2014
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Dose-response, 2017-10, Vol.15 (4), p.1559325817746558-1559325817746558
2017
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Toxicology letters, 2016-10, Vol.259, p.S160-S160
2016
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IEEE transactions on electron devices, 2019-12, Vol.66 (12), p.5387-5392
2019
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BIO Web of Conferences, 2019, Vol.14, p.6006
2019
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2016 IEEE Symposium on VLSI Technology, 2016, p.1-2
- Veloso, A.
- Parvais, B.
- Matagne, P.
- Simoen, E.
- Huynh-Bao, T.
- Paraschiv, V.
- Vecchio, E.
- Devriendt, K.
- Rosseel, E.
- Ercken, M.
- Chan, B. T.
- Delvaux, C.
- Altamirano-Sanchez, E.
- Versluijs, J. J.
- Tao, Z.
- Suhard, S.
- Brus, S.
- Sibaja-Hernandez, A.
- Waldron, N.
- Lagrain, P.
- Richard, O.
- Bender, H.
- Chasin, A.
- Kaczer, B.
- Ivanov, T.
- Ramesh, S.
- De Meyer, K.
- Ryckaert, J.
- Collaert, N.
- Thean, A.
2016
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2019 Symposium on VLSI Technology, 2019, p.T92-T93
2019
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Toxicology (Amsterdam), 2006-10, Vol.227 (3), p.227-239
2006
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Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 2009-06, Vol.267 (11), p.1931-1935
2009
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2011 Symposium on VLSI Technology - Digest of Technical Papers, 2011, p.34-35
- Veloso, A.
- Ragnarsson, L.-A
- Cho, M. J.
- Devriendt, K.
- Kellens, K.
- Sebaai, F.
- Suhard, S.
- Brus, S.
- Crabbe, Y.
- Schram, T.
- Rohr, E.
- Paraschiv, V.
- Eneman, G.
- Kauerauf, T.
- Dehan, M.
- Hong, S.-H
- Yamaguchi, S.
- Takeoka, S.
- Higuchi, Y.
- Tielens, H.
- Van Ammel, A.
- Favia, P.
- Bender, H.
- Franquet, A.
- Conard, T.
- Li, X.
- Pey, K.-L
- Struyf, H.
- Mertens, P.
- Absil, P. P.
- Horiguchi, N.
- Hoffmann, T.
2011
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Chemical communications (Cambridge, England), 2005-08 (30), p.3835-3837
2005
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2019 International 3D Systems Integration Conference (3DIC), 2019, p.1-6
2019
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019, p.1-6
2019
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Development of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring
2016
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2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1255-1259
2012
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ChemInform, 2005-12, Vol.36 (49), p.no-no
2005
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