UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders

Journal of alloys and compounds, 2016-02, Vol.657, p.400-407

2016

Volltextzugriff (PDF)

Clinical decision analysis in the management of displaced mid-shaft clavicle fractures: the patient's perspective

Injury extra, 2010-12, Vol.41 (12), p.159-159

2010

Volltextzugriff (PDF)

Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2003-06, Vol.351 (1), p.190-199

2003

Volltextzugriff (PDF)

Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages

Microelectronics and reliability, 2017-11, Vol.78, p.355-361

2017

Volltextzugriff (PDF)

Strain patterns in three different femoral interlocking nail-bone units: A biomechanical comparative study

Injury extra, 2008-05, Vol.39 (5), p.164-164

2008

Volltextzugriff (PDF)

Current concepts on management of cuff tear

Journal of clinical orthopaedics and trauma, 2022-05, Vol.28, p.101808, Article 101808

2022

Volltextzugriff (PDF)

Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders

Soldering & surface mount technology, 2001-01, Vol.13 (1), p.7-18

2001

Volltextzugriff (PDF)

Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre-strained eutectic Sn-3.5Ag solder joints

Soldering & surface mount technology, 2006-01, Vol.18 (1), p.19-28

2006

Volltextzugriff (PDF)

Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

Soldering & surface mount technology, 2003-12, Vol.15 (3), p.21-26

2003

Volltextzugriff (PDF)

Intermetallic morphology around Ni particles in Sn-3.5Ag solder

Soldering & surface mount technology, 2002-08, Vol.14 (2), p.11-17

2002

Volltextzugriff (PDF)

Effect of strain on whisker growth in matte tin

Soldering & surface mount technology, 2008-02, Vol.20 (1), p.4-7

2008

Volltextzugriff (PDF)

Microstructural features contributing to enhanced behaviour of Sn-Ag based solder joints

Soldering & surface mount technology, 2005-01, Vol.17 (1), p.33-39

2005

Volltextzugriff (PDF)

Lead-free solders: materials reliability for electronics (Wiley series in materials for electronic and optoelectronic applications)

Subramanian, K.N

1, 2012

Volltextzugriff (PDF)

Creep behaviour of composite lead-free electronic solder joints

Soldering & surface mount technology, 2003-01, Vol.15 (1), p.39-42

2003

Volltextzugriff (PDF)

Effects of Pb contamination on the eutectic Sn-Ag solder joint

Soldering & surface mount technology, 2001-01, Vol.13 (2), p.26-29

2001

Volltextzugriff (PDF)

Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn–Ag based solder joints

Microelectronics and reliability, 2007, Vol.47 (1), p.118-131

2007

Volltextzugriff (PDF)

Effects of internal stresses on the thermomechanical behavior of Sn-based solder joints

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2006-04, Vol.421 (1), p.46-56

2006

Volltextzugriff (PDF)

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Journal of materials research, 2007-11, Vol.22 (11), p.3265-3272

2007

Volltextzugriff (PDF)

Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

Journal of materials research, 2005-02, Vol.20 (2), p.364-374

2005

Volltextzugriff (PDF)

Effect of cold rolling on the tensile properties of (Al 2O 3) p/Al composites

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 1992-12, Vol.159 (1), p.43-50

1992

Volltextzugriff (PDF)

Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of prestrained eutectic Sn3.5Ag solder joints

Soldering & surface mount technology, 2006-01, Vol.18 (1), p.19-28

2006

Volltextzugriff (PDF)

Microstructural features contributing to enhanced behaviour of SnAg based solder joints

Soldering & surface mount technology, 2005-03, Vol.17 (1), p.33-39

2005

Volltextzugriff (PDF)

Foreword

Journal of electronic materials, 2008, Vol.37 (1), p.1-1

2008

Volltextzugriff (PDF)

Foreword

Journal of electronic materials, 2008-01, Vol.37 (1), p.1-1

2008

Volltextzugriff (PDF)

Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2000-06, Vol.285 (1), p.25-34

2000

Volltextzugriff (PDF)

1 – 25 von 103

Menü

Weitere Dienste

Einstellungen

Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders

Clinical decision analysis in the management of displaced mid-shaft clavicle fractures: the patient's perspective

Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions

Electrochemical studies of Pd-doped Cu and Pd-doped Cu-Al intermetallics for understanding corrosion behavior in wire-bonding packages

Strain patterns in three different femoral interlocking nail-bone units: A biomechanical comparative study

Current concepts on management of cuff tear

Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders

Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of pre-strained eutectic Sn-3.5Ag solder joints

Mechanical characterization of Sn-3.5Ag solder joints at various temperatures

Intermetallic morphology around Ni particles in Sn-3.5Ag solder

Effect of strain on whisker growth in matte tin

Microstructural features contributing to enhanced behaviour of Sn-Ag based solder joints

Lead-free solders: materials reliability for electronics (Wiley series in materials for electronic and optoelectronic applications)

Creep behaviour of composite lead-free electronic solder joints

Effects of Pb contamination on the eutectic Sn-Ag solder joint

Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn–Ag based solder joints

Effects of internal stresses on the thermomechanical behavior of Sn-based solder joints

Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints

Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

Effect of cold rolling on the tensile properties of (Al 2O 3) p/Al composites

Roles of imposed cyclic strain amplitude and cyclic strain rate on the stress relaxation behaviour of prestrained eutectic Sn3.5Ag solder joints

Microstructural features contributing to enhanced behaviour of SnAg based solder joints

Foreword

Foreword

Quantification of creep strain distribution in small crept lead-free in-situ composite and non composite solder joints

Suchergebnisse filtern