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Effect of lapping slurry on critical cutting depth of spinel

Applied surface science, 2015-08, Vol.347, p.849-855

2015

Volltextzugriff (PDF)

Analysis on the Action of Oxidant in Chemical Mechanical Polishing of 304 Ultra-Thin Stainless Steel

Materials Science Forum, 2017-03, Vol.893, p.234-239

2017

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Influence of Lapping Parameters on 6H-SiC Crystal Substrate (0001) C Surface Based on Diamond Particle

Advanced materials research, 2012-09, Vol.565, p.237-242

2012

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The Design of Double Strand Silk Semi-Automatic Machine

Advanced materials research, 2011, Vol.156-157, p.1393-1396

2011

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Study on Slurry of Chemical Mechanical Polishing 304 Stainless Steel Based on Ferric Chloride and Oxalic Acid

Materials Science Forum, 2016-07, Vol.861, p.102-107

2016

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Pitch Angle Control of UAV Based on L1Adaptive Control Law

2020 35th Youth Academic Annual Conference of Chinese Association of Automation (YAC), 2020, p.68-72

2020

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Study on the Influence of pH on MRR Based on Acidic Slurry in CMP of 304 Stainless Steel

Advanced Materials Research, 2016-01, Vol.1136, p.327-332

2016

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Design of Detection System of Temperature Signal on Polishing Interface in CMP Semiconductor Material of SiC Crystal Substrate

Advanced materials research, 2013, Vol.703, p.287-290

2013

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Study of the Slurry in CMP 304 Ultra-Thin Stainless Steel Surface

Advanced materials research, 2014-10, Vol.1027, p.235-239

2014

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Study on Slurry of SiC Crystal Substrate (0001) C Surface in CMP Based on Silica Sol (SiO2 Abrasive)

Advanced materials research, 2014-06, Vol.983, p.214-217

2014

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Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

Materials science forum, 2004-01, Vol.471-472, p.362-368

2004

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Design of Lapping Paste in Lapping 304 Ultra-Thin Stainless Steel Sheet

Advanced materials research, 2014-10, Vol.1027, p.93-96

2014

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Analysis of Chemical Action of Oxidants in Chemical Mechanical Polishing of SiC Crystal Substrate

Advanced materials research, 2014-10, Vol.1027, p.213-216

2014

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A Chemism Analysis of Alkali in the Chemical Mechnical Polishing Process of SiC Substrate

Advanced materials research, 2014-10, Vol.1027, p.208-212

2014

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Analysis on the Influence of Oxidant in CMP of Ultra-Thin Stainless Steel

Advanced materials research, 2014-10, Vol.1027, p.167-170

2014

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Study on Process Parameters in CMP Ultra-Thin Stainless Steel Sheet

Advanced materials research, 2014-10, Vol.1027, p.58-62

2014

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Study on Fixed-Abrasive Lapping SiC Crystal Substrate Based on Diamond Particle

Advanced materials research, 2014-09, Vol.1017, p.520-525

2014

Volltextzugriff (PDF)

Study on the Preparation Technology of Fixed Abrasive Polishing Pad in Chemical Mechanical Polishing

Applied Mechanics and Materials, 2014-08, Vol.602-605 (Advanced Manufacturing and Information Engineering, Intelligent Instrumentation and Industry Development), p.485-488

2014

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Study on the Surface Characteristics of Polishing Pad Used in Chemical Mechanical Polishing

Advanced materials research, 2010, Vol.102-104, p.724-728

2010

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Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior

Materials science forum, 2012, Vol.704-705, p.313-317

2012

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Study on Chemical Mechanical Polishing Parameters of 6H-SiC Crystal Substrate Based on Diamond Abrasive

Advanced materials research, 2013, Vol.797, p.261-265

2013

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Design of CMP Slurry in CMP SiC Crystal Substrate (0001) Si Surface Based on Alumina (Al2O3) Abrasive

Advanced materials research, 2013, Vol.703, p.90-93

2013

Volltextzugriff (PDF)

Study on Material Removal Rate of CMP 6H-SiC Crystal Substrate (0001) C Surface Based on Abrasive Alumina (Al2O3)

Advanced materials research, 2012, Vol.497, p.250-255

2012

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Study on Characteristic of Abrasives in Chemical Mechanical Polishing of Silicon Wafer

Advanced materials research, 2010, Vol.102-104, p.658-662

2010

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Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process

Advanced materials research, 2010, Vol.135, p.90-95

2010

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1 – 25 von 631

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Effect of lapping slurry on critical cutting depth of spinel

Analysis on the Action of Oxidant in Chemical Mechanical Polishing of 304 Ultra-Thin Stainless Steel

Influence of Lapping Parameters on 6H-SiC Crystal Substrate (0001) C Surface Based on Diamond Particle

The Design of Double Strand Silk Semi-Automatic Machine

Study on Slurry of Chemical Mechanical Polishing 304 Stainless Steel Based on Ferric Chloride and Oxalic Acid

Pitch Angle Control of UAV Based on L1Adaptive Control Law

Study on the Influence of pH on MRR Based on Acidic Slurry in CMP of 304 Stainless Steel

Design of Detection System of Temperature Signal on Polishing Interface in CMP Semiconductor Material of SiC Crystal Substrate

Study of the Slurry in CMP 304 Ultra-Thin Stainless Steel Surface

Study on Slurry of SiC Crystal Substrate (0001) C Surface in CMP Based on Silica Sol (SiO2 Abrasive)

Investigation on Material Removal Rate in Rotation Grinding for Large-Scale Silicon Wafer

Design of Lapping Paste in Lapping 304 Ultra-Thin Stainless Steel Sheet

Analysis of Chemical Action of Oxidants in Chemical Mechanical Polishing of SiC Crystal Substrate

A Chemism Analysis of Alkali in the Chemical Mechnical Polishing Process of SiC Substrate

Analysis on the Influence of Oxidant in CMP of Ultra-Thin Stainless Steel

Study on Process Parameters in CMP Ultra-Thin Stainless Steel Sheet

Study on Fixed-Abrasive Lapping SiC Crystal Substrate Based on Diamond Particle

Study on the Preparation Technology of Fixed Abrasive Polishing Pad in Chemical Mechanical Polishing

Study on the Surface Characteristics of Polishing Pad Used in Chemical Mechanical Polishing

Analysis on Contact Forms of Interface in Wafer CMP Based on Lubricating Behavior

Study on Chemical Mechanical Polishing Parameters of 6H-SiC Crystal Substrate Based on Diamond Abrasive

Design of CMP Slurry in CMP SiC Crystal Substrate (0001) Si Surface Based on Alumina (Al2O3) Abrasive

Study on Material Removal Rate of CMP 6H-SiC Crystal Substrate (0001) C Surface Based on Abrasive Alumina (Al2O3)

Study on Characteristic of Abrasives in Chemical Mechanical Polishing of Silicon Wafer

Study on Friction Force Distribution on Silicon Wafer Surface in CMP Process

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