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Characterisation of dissimilar joints in laser welding of steel–kovar, copper–steel and copper–aluminium

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2004-06, Vol.374 (1), p.224-233

2004

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Failure investigation of a fractured vent line

Engineering failure analysis, 2021-06, Vol.124, p.105331, Article 105331

2021

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Surface integrity when machining age hardened Inconel 718 with coated carbide cutting tools

International journal of machine tools & manufacture, 2004-11, Vol.44 (14), p.1481-1491

2004

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Residual stress and surface roughness when facing age hardened Inconel 718 with CBN and ceramic cutting tools

International journal of machine tools & manufacture, 2004-07, Vol.44 (9), p.879-887

2004

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Influence of microstructure on ultraprecision grinding of cemented carbides

International journal of machine tools & manufacture, 2004-04, Vol.44 (5), p.533-543

2004

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Image segmentation and analysis for porosity measurement

Journal of materials processing technology, 2007-10, Vol.192, p.391-396

2007

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Planar nanogrinding of a fine grained WC-Co composite for an optical surface finish

International journal of advanced manufacturing technology, 2005-10, Vol.26 (7-8), p.766-773

2005

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Project management methodology requirements for use in undergraduate engineering research projects

2008 4th IEEE International Conference on Management of Innovation and Technology, 2008, p.311-316

2008

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Educating engineers in the art, science and practice of project management: - A new course

2008 4th IEEE International Conference on Management of Innovation and Technology, 2008, p.317-322

2008

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Stress effect on growth of IMCs at interfaces between Sn-Ag-Cu lead free solder and Cu substrate

2005 7th Electronic Packaging Technology Conference, 2005, Vol.2, p.6 pp.

2005

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Combating the erosion of manufacturing - a partnership product design, development and deployment strategy (P2D3)

2004 IEEE International Engineering Management Conference (IEEE Cat. No.04CH37574), 2004, Vol.3, p.1037-1041 Vol.3

2004

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Effect of stress on interfacial intermetallic compound development of Sn-Ag-Cu lead-free solder joint on Au/Ni/Cu substrate

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971), 2004, p.414-419

2004

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Characterisation of dissimilar joints in laser welding of steel–kovar, copper–steel and copper–aluminium

Failure investigation of a fractured vent line

Surface integrity when machining age hardened Inconel 718 with coated carbide cutting tools

Residual stress and surface roughness when facing age hardened Inconel 718 with CBN and ceramic cutting tools

Influence of microstructure on ultraprecision grinding of cemented carbides

Image segmentation and analysis for porosity measurement

Planar nanogrinding of a fine grained WC-Co composite for an optical surface finish

Project management methodology requirements for use in undergraduate engineering research projects

Educating engineers in the art, science and practice of project management: - A new course

Stress effect on growth of IMCs at interfaces between Sn-Ag-Cu lead free solder and Cu substrate

Combating the erosion of manufacturing - a partnership product design, development and deployment strategy (P2D3)

Effect of stress on interfacial intermetallic compound development of Sn-Ag-Cu lead-free solder joint on Au/Ni/Cu substrate

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