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Relationship between spacing of eutectic colonies and tensile properties of transient directionally solidified Al-Ni eutectic alloy

Journal of alloys and compounds, 2018-02, Vol.733, p.59-68

2018

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Comparing the roles of Sb and Bi on microstructures and application properties of the Al-15% Si alloy

Journal of alloys and compounds, 2021-10, Vol.878, p.160343, Article 160343

2021

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Origin of the time-dependent corrosion behavior of biodegradable Mg-Si-Zn alloys in simulated body fluid

Corrosion science, 2024-08, Vol.237, p.112326, Article 112326

2024

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High cooling rate cells, dendrites, microstructural spacings and microhardness in a directionally solidified Al–Mg–Si alloy

Journal of alloys and compounds, 2015-07, Vol.636, p.145-149

2015

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Thermal analysis during solidification of an Al–Cu eutectic alloy: interrelation of thermal parameters, microstructure and hardness

Journal of thermal analysis and calorimetry, 2019-08, Vol.137 (3), p.983-996

2019

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Tensile properties and related microstructural aspects of hypereutectic Al-Si alloys directionally solidified under different melt superheats and transient heat flow conditions

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-02, Vol.685, p.235-243

2017

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Tailoring microstructure and tensile properties of Mg-Si alloys varying solidification cooling rate and Si content

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2021-09, Vol.825, p.141905, Article 141905

2021

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Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys

Journal of alloys and compounds, 2017-01, Vol.691, p.600-605

2017

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Solidification, α-Al morphologies, and tensile properties of low-Sc modified Al-Mg alloys

Materials characterization, 2023-12, Vol.206, p.113416, Article 113416

2023

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Dendritic Growth, Solidification Thermal Parameters, and Mg Content Affecting the Tensile Properties of Al-Mg-1.5 Wt Pct Fe Alloys

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2017-04, Vol.48 (4), p.1841-1855

2017

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Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution

Corrosion science, 2014-03, Vol.80, p.71-81

2014

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Evaluating grain size, dendritic scale, and tensile properties of a NbB-inoculated 6201 alloy using solidification rate

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2022-02, Vol.835, p.142680, Article 142680

2022

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Towards a morphological control of Mg2Si and superior tensile properties of high-Zn Mg-0.6Si (-Zn) alloys

Materials letters, 2021-09, Vol.299, p.130084, Article 130084

2021

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Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

Materials characterization, 2016-04, Vol.114, p.30-42

2016

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Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn–Cu solder alloy

Electrochimica acta, 2011-10, Vol.56 (24), p.8891-8899

2011

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Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: Related effects on the matrix micromorphology, nature of intermetallics and tensile properties

Journal of alloys and compounds, 2017-11, Vol.723, p.1039-1052

2017

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Microstructural development during transient directional solidification of hypermonotectic Al–Bi alloys

Materials & Design, 2010-12, Vol.31 (10), p.4584-4591

2010

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The role of eutectic colonies in the tensile properties of a Sn–Zn eutectic solder alloy

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2020-03, Vol.776, p.138959, Article 138959

2020

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Effect of Aging on Dendritic Array, Ag3Sn Spacing, and Hardness of a Sn-2Ag-0.7Cu Solder Alloy

Journal of electronic materials, 2022-08, Vol.51 (8), p.4640-4648

2022

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Combined growth of α-Al and Bi in a Al-Bi-Cu monotectic alloy analyzed by in situ X-ray radiography

Journal of crystal growth, 2020-04, Vol.536, p.125592, Article 125592

2020

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Microstructural development and mechanical properties of hypereutectic Sn―Cu solder alloys

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2013-04, Vol.568, p.195-201

2013

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Microstructural development of hypoeutectic Zn–(10–40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness

Journal of alloys and compounds, 2015-10, Vol.647, p.989-996

2015

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Effects of cobalt and solidification cooling rate on intermetallic phases and tensile properties of a -Cu, -Zn, -Fe containing Al-Si alloy

International journal of advanced manufacturing technology, 2020-03, Vol.107 (1-2), p.717-730

2020

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Interconnection of Zn content, macrosegregation, dendritic growth, nature of intermetallics and hardness in directionally solidified Mg–Zn alloys

Journal of alloys and compounds, 2016-03, Vol.662, p.1-10

2016

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Laser resolidification of Al-5Mg-0.1Sc alloy: Growth of cells and banded structures

Journal of alloys and compounds, 2024-02, Vol.973, p.172889, Article 172889

2024

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Relationship between spacing of eutectic colonies and tensile properties of transient directionally solidified Al-Ni eutectic alloy

Comparing the roles of Sb and Bi on microstructures and application properties of the Al-15% Si alloy

Origin of the time-dependent corrosion behavior of biodegradable Mg-Si-Zn alloys in simulated body fluid

High cooling rate cells, dendrites, microstructural spacings and microhardness in a directionally solidified Al–Mg–Si alloy

Thermal analysis during solidification of an Al–Cu eutectic alloy: interrelation of thermal parameters, microstructure and hardness

Tensile properties and related microstructural aspects of hypereutectic Al-Si alloys directionally solidified under different melt superheats and transient heat flow conditions

Tailoring microstructure and tensile properties of Mg-Si alloys varying solidification cooling rate and Si content

Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys

Solidification, α-Al morphologies, and tensile properties of low-Sc modified Al-Mg alloys

Dendritic Growth, Solidification Thermal Parameters, and Mg Content Affecting the Tensile Properties of Al-Mg-1.5 Wt Pct Fe Alloys

Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution

Evaluating grain size, dendritic scale, and tensile properties of a NbB-inoculated 6201 alloy using solidification rate

Towards a morphological control of Mg2Si and superior tensile properties of high-Zn Mg-0.6Si (-Zn) alloys

Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu,Ag) solder alloys

Microstructure, corrosion behaviour and microhardness of a directionally solidified Sn–Cu solder alloy

Directional solidification of a Sn-0.2Ni solder alloy in water-cooled copper and steel molds: Related effects on the matrix micromorphology, nature of intermetallics and tensile properties

Microstructural development during transient directional solidification of hypermonotectic Al–Bi alloys

The role of eutectic colonies in the tensile properties of a Sn–Zn eutectic solder alloy

Effect of Aging on Dendritic Array, Ag3Sn Spacing, and Hardness of a Sn-2Ag-0.7Cu Solder Alloy

Combined growth of α-Al and Bi in a Al-Bi-Cu monotectic alloy analyzed by in situ X-ray radiography

Microstructural development and mechanical properties of hypereutectic Sn―Cu solder alloys

Microstructural development of hypoeutectic Zn–(10–40)wt%Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness

Effects of cobalt and solidification cooling rate on intermetallic phases and tensile properties of a -Cu, -Zn, -Fe containing Al-Si alloy

Interconnection of Zn content, macrosegregation, dendritic growth, nature of intermetallics and hardness in directionally solidified Mg–Zn alloys

Laser resolidification of Al-5Mg-0.1Sc alloy: Growth of cells and banded structures

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