UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints

Materials & design, 2020-07, Vol.192, p.108726, Article 108726

2020

Volltextzugriff (PDF)

Constrained Predictor-Corrector Entry Guidance

Journal of guidance, control, and dynamics, 2010-07, Vol.33 (4), p.1273-1281

2010

Volltextzugriff (PDF)

Growth behaviors of intermetallic compound layers in Cu/Al joints brazed with Zn–22Al and Zn–22Al–0.05Ce filler metals

Materials in engineering, 2013-10, Vol.51, p.907-915

2013

Volltextzugriff (PDF)

Design and solderability characterization of novel Au–30Ga solder for high-temperature packaging

Journal of materials science. Materials in electronics, 2020-02, Vol.31 (3), p.2514-2522

2020

Volltextzugriff (PDF)

Effect of hydrogen content in ER5183 welding wire on the tensile strength and fracture morphology of Al–Mg MIG weld

Vacuum, 2019-08, Vol.166, p.218-225

2019

Volltextzugriff (PDF)

The reliability of lead-free solder joint subjected to special environment: a review

Journal of materials science. Materials in electronics, 2019-05, Vol.30 (10), p.9065-9086

2019

Volltextzugriff (PDF)

The impact of oxygen content on the reliability of Au-20Sn solder hermetic package

Vacuum, 2020-11, Vol.181, p.109754, Article 109754

2020

Volltextzugriff (PDF)

Microstructural evolution and shear performance of AuSn20 solder joint under gamma-ray irradiation and thermal cycling

Journal of materials science. Materials in electronics, 2020-05, Vol.31 (9), p.7200-7210

2020

Volltextzugriff (PDF)

Effect of extreme thermal shocking on the reliability of Sn50Pb49Sb1/Cu solder joint

Journal of materials science. Materials in electronics, 2020, Vol.31 (2), p.1421-1429

2020

Volltextzugriff (PDF)

Influences of Sn on Properties of Ag-Based and Cu-Based Brazing Filler Metals

Crystals (Basel), 2021-11, Vol.11 (11), p.1403

2021

Volltextzugriff (PDF)

Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking

Journal of materials science. Materials in electronics, 2020-04, Vol.31 (7), p.5731-5737

2020

Volltextzugriff (PDF)

Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packaging

Journal of materials science. Materials in electronics, 2017-07, Vol.28 (14), p.10230-10244

2017

Volltextzugriff (PDF)

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

Applied sciences, 2019-05, Vol.9 (10), p.2044

2019

Volltextzugriff (PDF)

Reliability studies of Cu/Al joints brazed with Zn–Al–Ce filler metals

Materials in engineering, 2012-12, Vol.42, p.156-163

2012

Volltextzugriff (PDF)

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint

Polymers, 2024-09, Vol.16 (18), p.2597

2024

Volltextzugriff (PDF)

Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package

Journal of materials science. Materials in electronics, 2020, Vol.31 (2), p.1411-1420

2020

Volltextzugriff (PDF)

Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints

Polymers, 2023-10, Vol.15 (20), p.4168

2023

Volltextzugriff (PDF)

Study on the Oscillating Phenomenon of Welding Pool with Different Penetration States in Short-Circuiting GMAW

Applied sciences, 2023-05, Vol.13 (11), p.6370

2023

Volltextzugriff (PDF)

Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin

Polymers, 2022-12, Vol.14 (23), p.5303

2022

Volltextzugriff (PDF)

Compressive behavior of the SiC-NWs/MCF composites with a designed double-nest microstructure

Journal of materials science, 2020-04, Vol.55 (10), p.4170-4178

2020

Volltextzugriff (PDF)

Study on Microstructure and Properties of 12Ag–Cu–Zn–Sn Cadmium-Free Filler Metals with Trace In Addition

Crystals (Basel), 2021-05, Vol.11 (5), p.557

2021

Volltextzugriff (PDF)

A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

Journal of materials science. Materials in electronics, 2010-05, Vol.21 (5), p.421-440

2010

Volltextzugriff (PDF)

Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy

Crystals (Basel), 2022-07, Vol.12 (7), p.924

2022

Volltextzugriff (PDF)

Rapid Generation of Accurate Entry Landing Footprints

Journal of guidance, control, and dynamics, 2010-05, Vol.33 (3), p.756-767

2010

Volltextzugriff (PDF)

Enhancement on the high-temperature joint reliability and corrosion resistance of Sn–0.3Ag–0.7Cu low-Ag solder contributed by Al2O3 Nanoparticles (0.12 wt%)

Journal of materials science. Materials in electronics, 2018-12, Vol.29 (23), p.19663-19677

2018

Volltextzugriff (PDF)

1 – 25 von 198

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(175)
Mit Volltextzugriff
(170)

Publikationsform

Sprache

Englisch
(194)
Chinesisch
(4)

Erscheinungsjahr

n.n

Thema

Science & Technology
(152)
Technology
(124)
Materials Science
(110)
Materials Science, Multidisciplinary
(102)
Physical Sciences
(81)
Microstructure
(65)
Engineering
(55)
Mechanical Properties
(49)
Physics
(49)
Physics, Applied
(44)
Chemistry And Materials Science
(36)
Engineering, Electrical & Electronic
(35)
Intermetallic Compounds
(35)
Alloys
(33)
Characterization And Evaluation Of Materials
(33)
Optical And Electronic Materials
(30)
Solders
(30)
Metallurgy & Metallurgical Engineering
(29)
Shear Strength
(28)
Physics, Condensed Matter
(26)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

... seit 30 Tagen
(1)
... seit 90 Tagen
(2)

Menü

Weitere Dienste

Einstellungen

New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints

Constrained Predictor-Corrector Entry Guidance

Growth behaviors of intermetallic compound layers in Cu/Al joints brazed with Zn–22Al and Zn–22Al–0.05Ce filler metals

Design and solderability characterization of novel Au–30Ga solder for high-temperature packaging

Effect of hydrogen content in ER5183 welding wire on the tensile strength and fracture morphology of Al–Mg MIG weld

The reliability of lead-free solder joint subjected to special environment: a review

The impact of oxygen content on the reliability of Au-20Sn solder hermetic package

Microstructural evolution and shear performance of AuSn20 solder joint under gamma-ray irradiation and thermal cycling

Effect of extreme thermal shocking on the reliability of Sn50Pb49Sb1/Cu solder joint

Influences of Sn on Properties of Ag-Based and Cu-Based Brazing Filler Metals

Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking

Effect of Pr addition on properties and Sn whisker growth of Sn–0.3Ag–0.7Cu low-Ag solder for electronic packaging

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

Reliability studies of Cu/Al joints brazed with Zn–Al–Ce filler metals

Study on Thermal Cycling Reliability of Epoxy-Enhanced SAC305 Solder Joint

Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package

Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints

Study on the Oscillating Phenomenon of Welding Pool with Different Penetration States in Short-Circuiting GMAW

Microstructure and Shear Behaviour of Sn-3.0Ag-0.5Cu Composite Solder Pastes Enhanced by Epoxy Resin

Compressive behavior of the SiC-NWs/MCF composites with a designed double-nest microstructure

Study on Microstructure and Properties of 12Ag–Cu–Zn–Sn Cadmium-Free Filler Metals with Trace In Addition

A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy

Rapid Generation of Accurate Entry Landing Footprints

Enhancement on the high-temperature joint reliability and corrosion resistance of Sn–0.3Ag–0.7Cu low-Ag solder contributed by Al2O3 Nanoparticles (0.12 wt%)

Suchergebnisse filtern