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Policy-Based Reinforcement Learning for Through Silicon Via Array Design in High-Bandwidth Memory Considering Signal Integrity
IEEE transactions on electromagnetic compatibility, 2024-02, Vol.66 (1), p.256-269
2024
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Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer
IEEE transactions on electromagnetic compatibility, 2021-10, Vol.63 (5), p.1562-1573
2021
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Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via
IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-01, Vol.9 (1), p.107-121
2019
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Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure
IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-01, Vol.12 (1), p.100-110
2022
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Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme
IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-11, Vol.11 (11), p.1955-1970
2021
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Signal and power integrity (SI/PI) analysis of heterogeneous integration using embedded multi-die interconnect bridge (EMIB) technology for high bandwidth memory (HBM)
2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017, p.1-3
2017
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Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network
IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-07, Vol.11 (7), p.1122-1136
2021
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Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices
IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-11, Vol.12 (11), p.1748-1756
2022
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Signal Integrity Design and Analysis of 3-D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing
IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-05, Vol.10 (5), p.858-869
2020
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High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test
IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-12, Vol.8 (12), p.2152-2162
2018
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Measurement, Simulation and Mathematical Estimation of Magnetic Field Shielding Effectiveness of Sputtered Shielding Materials using Spiral Coils
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018, p.47-51
2018
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Design and Measurement of a 28 GHz Glass Band Pass Filter based on Glass Interposers for 5G Applications
2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, p.1-3
2019
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Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface
2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2021, p.1-3
2021
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Deterministic Policy Gradient-based Reinforcement Learning for DDR5 Memory Signaling Architecture Optimization considering Signal Integrity
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2022, p.1-3
2022
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Policy Gradient Reinforcement Learning-based Optimal Decoupling Capacitor Design Method for 2.5-D/3-D ICs using Transformer Network
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2020, p.1-3
2020
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A Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2022, p.1-3
2022
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Signal Integrity and Power Leakage Optimization for 3D X-Point Memory Operation using Reinforcement Learning
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2022, p.1-3
2022
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Deep Reinforcement Learning-based Through Silicon Via (TSV) Array Design Optimization Method considering Crosstalk
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2020, p.1-3
2020
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Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2021, p.1-3
2021
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Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2019, p.1-3
2019
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Modeling and Verification of 3-Dimensional Resistive Storage Class Memory with High Speed Circuits for Core Operation
2019 IEEE Asia-Pacific Microwave Conference (APMC), 2019, p.694-696
2019
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Power Integrity Comparison of Off-chip, On-interposer, On-chip Voltage Regulators in 2.5D/3D ICs
2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, p.1-3
2019
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Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs
2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2020, p.1-3
2020
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Modeling and Signal Integrity Analysis of 3D XPoint Memory Cells and Interconnections with Memory Size Variations During Read Operation
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI), 2018, p.223-227
2018
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Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference using Memristor Crossbar Array considering Signal Integrity
2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI), 2020, p.417-421
2020
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