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Microelectronics and reliability, 2017-05, Vol.72, p.80-84
2017
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2018 IEEE Symposium on VLSI Technology, 2018, p.215-216
- Lo, H.C.
- Choi, D.
- Hu, Y.
- Shen, Y.
- Qi, Y.
- Peng, J.
- Zhou, D.
- Mohan, M.
- Yong, C.
- Zhan, H.
- Wei, H.
- He, X.
- Kang, D.
- Sirman, A.
- Wang, Y.
- Zang, H.
- Mun, S.Y.
- Vinslava, A.
- Chen, W.H.
- Gaire, C.
- Liu, J.
- Dou, X.
- Shi, Y.
- Zhao, P.
- Zhu, B.
- Jha, A.
- Zhang, X.
- Wan, X.
- Lavigne, E.
- Kyono, C.
- Togo, M.
- Versaggi, J.
- Yu, H.
- Hu, O.
- Lee, J.G.
- Samavedam, S. B.
- Sohn, D.K.
2018
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2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2019, p.1-4
2019
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IEEE transactions on components and packaging technologies, 2009-12, Vol.32 (4), p.838-848
2009
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IEEE transactions on components and packaging technologies, 2009-12, Vol.32 (4), p.838
2009
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2009 IEEE International Reliability Physics Symposium, 2009, p.613-618
2009
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European journal of surgical oncology, 2006-03, Vol.32 (2), p.162-167
2006
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2008 IEEE International Reliability Physics Symposium, 2008, p.126-131
2008
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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2009, p.719-722
2009
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2009 IEEE International Interconnect Technology Conference, 2009, p.92-94
2009
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2008 58th Electronic Components and Technology Conference, 2008, p.1031-1035
2008
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2008 10th Electronics Packaging Technology Conference, 2008, p.613-619
2008
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2006 International Symposium on VLSI Design, Automation and Test, 2006, p.1-2
2006
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Cities, 2018-12, Vol.82, p.27-34
2018
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Latin American journal of solids and structures, 2018-10, Vol.15 (10)
2018
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Thin solid films, 2012-10, Vol.521, p.245-248
2012
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Journal of adolescent health, 2019-11, Vol.65 (5), p.651-659
- Bartlett, Adam W.
- Lumbiganon, Pagakrong
- Kurniati, Nia
- Sudjaritruk, Tavitiya
- Mohamed, Thahira J.
- Hansudewechakul, Rawiwan
- Ly, Penh S.
- Truong, Khanh H.
- Puthanakit, Thanyawee
- Nguyen, Lam V.
- Chokephaibulkit, Kulkanya
- Do, Viet C.
- Kumarasamy, Nagalingeswaran
- Nik Yusoff, Nik Khairulddin
- Fong, Moy S.
- Watu, Dewi K.
- Nallusamy, Revathy
- Sohn, Annette H.
- Law, Matthew G.
- Ly, P.S.
- Khol, V.
- Tucker, J.
- Kumarasamy, N.
- Chandrasekaran, E.
- Wati, D.K.
- Vedaswari, D.
- Ramajaya, I.B.
- Kurniati, N.
- Muktiarti, D.
- Fong, S.M.
- Lim, M.
- Daut, F.
- Nik Yusoff, N.K.
- Mohamad, P.
- Mohamed, T.J.
- Drawis, M.R.
- Nallusamy, R.
- Chan, K.C.
- Sudjaritruk, T.
- Sirisanthana, V.
- Aurpibul, L.
- Hansudewechakul, R.
- Ounchanum, P.
- Denjanta, S.
- Kongphonoi, A.
- Lumbiganon, P.
- Kosalaraksa, P.
- Tharnprisan, P.
- Udomphanit, T.
- Jourdain, G.
- Puthanakit, T.
- Anugulruengkit, S.
- Jantarabenjakul, W.
- Nadsasarn, R.
- Chokephaibulkit, K.
- Lapphra, K.
- Phongsamart, W.
- Sricharoenchai, S.
- Truong, K.H.
- Du, Q.T.
- Nguyen, C.H.
- Do, V.C.
- Ha, T.M.
- An, V.T.
- Nguyen, L.V.
- Khu, D.T.K.
- Pham, A.N.
- Nguyen, L.T.
- Le, O.N.
- Sohn, A.H.
- Ross, J.L.
- Sethaputra, C.
- Law, M.G.
- Kariminia, A.
2019
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IEEE transactions on communications, 2006-07, Vol.54 (7), p.1277-1288
2006
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Intermetallics, 2010-03, Vol.18 (3), p.342-347
2010
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Intermetallics, 2010-02, Vol.18 (2), p.254-258
2010
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Intermetallics, 2009, Vol.17 (1), p.11-16
2009
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IEEE transactions on reliability, 2005-03, Vol.54 (1), p.123-132
2005
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Journal of Asian earth sciences, 2003-05, Vol.21 (7), p.781-793
2003
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Alcheringa (Sydney), 2001-01, Vol.25 (1), p.53-68
2001
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