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Vital Signs: Health Care–Associated Legionnaires’ Disease Surveillance Data From 20 States and a Large Metropolitan Area—United States, 2015

American journal of transplantation, 2017-08, Vol.17 (8), p.2215-2220

2017

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Synergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets

Microelectronic engineering, 2012-04, Vol.92, p.9-14

2012

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Photoresist removal process by hydrogen radicals generated by W catalyst

Thin solid films, 2008-01, Vol.516 (5), p.847-849

2008

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Rare and Emerging Viral Infections in Transplant Recipients

Clinical infectious diseases, 2013-10, Vol.57 (8), p.1182-1188

2013

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Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

Microelectronic engineering, 2012-04, Vol.92, p.9-14

2012

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Influences of atomic hydrogen on porous low- k dielectric for 45-nm node

Thin solid films, 2007-04, Vol.515 (12), p.5031-5034

2007

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Assessment of oxLDL, anti-oxLDL antibodies and lipoprotein-associated phospholipase A2 as cardiovascular risk markers in obese adolescents with and without T1DM

Bulletin of the Faculty of Pharmacy, 2017-12, Vol.55 (2), p.325-331

2017

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Quantitative trait loci and candidate genes underlying genotype by environment interaction in the response of Arabidopsis thaliana to drought

Plant, cell and environment, 2015-03, Vol.38 (3), p.585-599

2015

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La progettazione psicosociale nei progetti del Sistema di Accoglienza e Integrazione/SAIUn modello di intervento

Rivista di psicologia dell'emergenza e dell'assistenza umanitaria, 2023-01 (28), p.32-80

2023

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Ultralow resistance W/poly-Si gate CMOS technology using amorphous-Si/TiN buffer layer

IEEE transactions on electron devices, 2002-02, Vol.49 (2), p.295-300

2002

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Total Performance of 32-nm-Node Ultralow- k /Cu Dual-Damascene Interconnects Featuring Short-TAT Silylated Porous Silica (k = \hbox)

IEEE transactions on electron devices, 2010-11, Vol.57 (11), p.2821-2830

2010

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Quantitative trait loci and candidate genes underlying genotype by environment interaction in the response of A rabidopsis thaliana to drought

Plant, cell and environment, 2015-03, Vol.38 (3), p.585-599

2015

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Evaluation of isolated starter lactic acid bacteria in Ras cheese ripening and flavour development

Food chemistry, 2007, Vol.104 (3), p.1192-1199

2007

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Ultrathin pore-seal film by plasma enhanced chemical vapor deposition SiCH from tetramethylsilane

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2005-11, Vol.23 (6), p.2522-2525

2005

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The role of lactic acid bacteria in accelerated cheese ripening

FEMS microbiology reviews, 1993, Vol.12 (1), p.239-251

El Soda, Morsi A.

1993

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Resistance to antiretrovirals in HIV-infected pregnant women

Journal of clinical virology, 2009-05, Vol.45 (1), p.39-42

2009

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Etch-Byproduct Pore Sealing for Atomic-Layer-Deposited-TaN Deposition on Porous Low-k Film

Japanese Journal of Applied Physics, 2005-10, Vol.44 (10R), p.7430

2005

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Feasibility study of 70nm pitch Cu/porous low-k D/D integration featuring EUV lithography toward 22nm generation

2009 IEEE International Electron Devices Meeting (IEDM), 2009, p.1-4

2009

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Design impact study of wiring size and barrier metal on device performance toward 22 nm-node featuring EUV lithography

2009 IEEE International Interconnect Technology Conference, 2009, p.14-16

2009

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Rep-PCR characterization and biochemical selection of lactic acid bacteria isolated from the Delta area of Egypt

International journal of food microbiology, 2008, Vol.128 (3), p.417-423

2008

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Analysis and estimation of generator settings for frequency response in the WAPP interconnected system

2017 IEEE PES PowerAfrica, 2017, p.180-185

2017

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Chemical Variation of Chromian Spinel Compositions in a Serpentinized Peridotites: Implications for Evolution of the Neoproterozoic Ophiolites

Acta geologica Sinica (Beijing), 2016-10, Vol.90 (s1), p.210-210

English ed., 2016

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Pore-sealing by etch-byproduct followed by ALD-Ta adhesion layer for Cu/porous low-k interconnects

Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729), 2004, p.39-41

2004

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Short-term load forecasting: A power-regression approach

2014 International Conference on Probabilistic Methods Applied to Power Systems (PMAPS), 2014, p.1-6

2014

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Novel via Chain Structure for Failure Analysis at 65 nm-Node Fixing OPC Using Inner and Outer via Chain Dummy Patterns

IEICE transactions on electronics, 2005-05, Vol.E88-C (5), p.796-803

NASUNO, T.

2005

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Vital Signs: Health Care–Associated Legionnaires’ Disease Surveillance Data From 20 States and a Large Metropolitan Area—United States, 2015

Synergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets

Photoresist removal process by hydrogen radicals generated by W catalyst

Rare and Emerging Viral Infections in Transplant Recipients

Synergistic combinations of dielectrics and metallization process technology to achieve 22nm interconnect performance targets

Influences of atomic hydrogen on porous low- k dielectric for 45-nm node

Assessment of oxLDL, anti-oxLDL antibodies and lipoprotein-associated phospholipase A2 as cardiovascular risk markers in obese adolescents with and without T1DM

Quantitative trait loci and candidate genes underlying genotype by environment interaction in the response of Arabidopsis thaliana to drought

La progettazione psicosociale nei progetti del Sistema di Accoglienza e Integrazione/SAIUn modello di intervento

Ultralow resistance W/poly-Si gate CMOS technology using amorphous-Si/TiN buffer layer

Total Performance of 32-nm-Node Ultralow- k /Cu Dual-Damascene Interconnects Featuring Short-TAT Silylated Porous Silica (k = \hbox)

Quantitative trait loci and candidate genes underlying genotype by environment interaction in the response of A rabidopsis thaliana to drought

Evaluation of isolated starter lactic acid bacteria in Ras cheese ripening and flavour development

Ultrathin pore-seal film by plasma enhanced chemical vapor deposition SiCH from tetramethylsilane

The role of lactic acid bacteria in accelerated cheese ripening

Resistance to antiretrovirals in HIV-infected pregnant women

Etch-Byproduct Pore Sealing for Atomic-Layer-Deposited-TaN Deposition on Porous Low-k Film

Feasibility study of 70nm pitch Cu/porous low-k D/D integration featuring EUV lithography toward 22nm generation

Design impact study of wiring size and barrier metal on device performance toward 22 nm-node featuring EUV lithography

Rep-PCR characterization and biochemical selection of lactic acid bacteria isolated from the Delta area of Egypt

Analysis and estimation of generator settings for frequency response in the WAPP interconnected system

Chemical Variation of Chromian Spinel Compositions in a Serpentinized Peridotites: Implications for Evolution of the Neoproterozoic Ophiolites

Pore-sealing by etch-byproduct followed by ALD-Ta adhesion layer for Cu/porous low-k interconnects

Short-term load forecasting: A power-regression approach

Novel via Chain Structure for Failure Analysis at 65 nm-Node Fixing OPC Using Inner and Outer via Chain Dummy Patterns

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