UB Paderborn / Katalog / Suche / in CDI

Electrical/Mechanical Modeling, Reliability Assessment, and Fabrication of FlexConnects: A MEMS-Based Compliant Chip-to-Substrate Interconnect

Journal of microelectromechanical systems, 2009-04, Vol.18 (2), p.322-331

2009

Volltextzugriff (PDF)

Magnetically actuated peel test for thin films

Thin solid films, 2012-03, Vol.520 (11), p.3987-3993

2012

Volltextzugriff (PDF)

Design and Fabrication of FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects

IEEE transactions on components and packaging technologies, 2008-12, Vol.31 (4), p.816-823

2008

Volltextzugriff (PDF)

Microcontact Spring Reliability: Design Against Interfacial Fracture

IEEE transactions on components and packaging technologies, 2009-03, Vol.32 (1), p.197-206

2009

Volltextzugriff (PDF)

An integrated process modeling methodology and module for sequential multilayered substrate fabrication using a coupled cure-thermal-stress analysis approach

IEEE transactions on electronics packaging manufacturing, 2002-10, Vol.25 (4), p.326-334

2002

Volltextzugriff (PDF)

Numerical modeling of interfacial delamination propagation in a novel peripheral array package

IEEE transactions on components and packaging technologies, 2001-06, Vol.24 (2), p.256-264

2001

Volltextzugriff (PDF)

Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

IEEE transactions on components and packaging technologies, 2007-03, Vol.30 (1), p.152-162

2007

Volltextzugriff (PDF)

Study of coupled thermal electric behavior of compliant micro-spring interconnects for next generation probing applications

IEEE transactions on components and packaging technologies, 2003-06, Vol.26 (2), p.407-415

2003

Volltextzugriff (PDF)

FEM modeling of temperature distribution of a flip-chip no-flow underfill package during solder reflow process

IEEE transactions on electronics packaging manufacturing, 2004-01, Vol.27 (1), p.86-93

2004

Volltextzugriff (PDF)

Interfacial fracture toughness for delamination growth prediction in a novel peripheral array package

IEEE transactions on components and packaging technologies, 2001-06, Vol.24 (2), p.265-270

2001

Volltextzugriff (PDF)

Methodology for Modeling Substrate Warpage Using Copper Trace Pattern Implementation

IEEE transactions on advanced packaging, 2009-11, Vol.32 (4), p.740-745

2009

Volltextzugriff (PDF)

Experimental and numerical investigation of microvia reliability

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2002, p.932-939

2002

Volltextzugriff (PDF)

Predictive Model Development for Life Prediction of PBGA Packages With SnAgCu Solder Joints

IEEE transactions on components and packaging technologies, 2010-03, Vol.33 (1), p.84-97

2010

Volltextzugriff (PDF)

Development of virtual reliability methodology for area-array devices used in implantable and automotive applications

IEEE transactions on components and packaging technologies, 2000-09, Vol.23 (3), p.452-461

2000

Volltextzugriff (PDF)

Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: modeling and evaluation

IEEE transactions on advanced packaging, 2003-11, Vol.26 (4), p.441-446

2003

Volltextzugriff (PDF)

Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times

Experimental mechanics, 2008-06, Vol.48 (3), p.355-365

2008

Volltextzugriff (PDF)

Low-K Dielectric Compatible Wafer-Level Compliant Chip-to-Substrate Interconnects

IEEE transactions on advanced packaging, 2008-02, Vol.31 (1), p.22-32

2008

Volltextzugriff (PDF)

Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: experimental characterization

IEEE transactions on advanced packaging, 2003-11, Vol.26 (4), p.447-452

2003

Volltextzugriff (PDF)

Correction to "High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles"

IEEE transactions on electronics packaging manufacturing, 2000-04, Vol.23 (2), p.148-148

2000

Volltextzugriff (PDF)

Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

2009 59th Electronic Components and Technology Conference, 2009, p.624-629

2009

Volltextzugriff (PDF)

Thermal Aging Reliability of Package-Level Polymer Optical Waveguides

IEEE transactions on advanced packaging, 2008-05, Vol.31 (2), p.410-416

2008

Volltextzugriff (PDF)

Design optimization of one-turn helix: a novel compliant off-chip interconnect

IEEE transactions on advanced packaging, 2003-05, Vol.26 (2), p.106-112

2003

Volltextzugriff (PDF)

β-Helix: A lithography-based compliant off-chip interconnect

IEEE transactions on components and packaging technologies, 2003-09, Vol.26 (3), p.582-590

2003

Volltextzugriff (PDF)

Coupled thermal electric-modeling of flexible nanospring interconnects for high-performance probing

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001, p.721-729

2001

Volltextzugriff (PDF)

Effect of material and geometry parameters on the thermo-mechanical reliability of flip-chip assemblies

ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208), 1998, p.193-200

1998

Volltextzugriff (PDF)

Menü

Weitere Dienste

Einstellungen

Electrical/Mechanical Modeling, Reliability Assessment, and Fabrication of FlexConnects: A MEMS-Based Compliant Chip-to-Substrate Interconnect

Magnetically actuated peel test for thin films

Design and Fabrication of FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate Interconnects

Microcontact Spring Reliability: Design Against Interfacial Fracture

An integrated process modeling methodology and module for sequential multilayered substrate fabrication using a coupled cure-thermal-stress analysis approach

Numerical modeling of interfacial delamination propagation in a novel peripheral array package

Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

Study of coupled thermal electric behavior of compliant micro-spring interconnects for next generation probing applications

FEM modeling of temperature distribution of a flip-chip no-flow underfill package during solder reflow process

Interfacial fracture toughness for delamination growth prediction in a novel peripheral array package

Methodology for Modeling Substrate Warpage Using Copper Trace Pattern Implementation

Experimental and numerical investigation of microvia reliability

Predictive Model Development for Life Prediction of PBGA Packages With SnAgCu Solder Joints

Development of virtual reliability methodology for area-array devices used in implantable and automotive applications

Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: modeling and evaluation

Using Carrier Fringes to Study the High Temperature Deformation Behavior of a BGA Package Under Extended Dwell Times

Low-K Dielectric Compatible Wafer-Level Compliant Chip-to-Substrate Interconnects

Investigation of interfacial delamination of a copper-epoxy interface under monotonic and cyclic loading: experimental characterization

Correction to "High-temperature, low-modulus adhesive attach for large-area thin-film processing on silicon and alumina tiles"

Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)

Thermal Aging Reliability of Package-Level Polymer Optical Waveguides

Design optimization of one-turn helix: a novel compliant off-chip interconnect

β-Helix: A lithography-based compliant off-chip interconnect

Coupled thermal electric-modeling of flexible nanospring interconnects for high-performance probing

Effect of material and geometry parameters on the thermo-mechanical reliability of flip-chip assemblies

Suchergebnisse filtern