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IEEE transactions on electron devices, 2024-04, Vol.71 (4), p.2810-2814
2024
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IEEE transactions on electron devices, 2021-12, Vol.68 (12), p.6112-6117
2021
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The FASEB journal, 2023-12, Vol.37 (12), p.e23274-n/a
2023
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IEEE transactions on electron devices, 2019-04, Vol.66 (4), p.1741-1746
2019
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Applied sciences, 2021-09, Vol.11 (17), p.7867
2021
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Electronics (Basel), 2021-11, Vol.10 (21), p.2632
2021
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Electronics (Basel), 2021-08, Vol.10 (15), p.1828
2021
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Microelectronics and reliability, 2024-07, Vol.158, p.115419, Article 115419
2024
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IEEE journal of the Electron Devices Society, 2019, Vol.7, p.382-387
2019
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Biochemical and biophysical research communications, 2024-04, Vol.706, p.149747-149747, Article 149747
2024
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Electronics (Basel), 2020-11, Vol.9 (11), p.1775
2020
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Nuclear Engineering and Technology, 2023, 55(8), , pp.2823-2834
2023
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ACS applied electronic materials, 2024-02, Vol.6 (2), p.1087-1093
2024
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Memories - Materials, Devices, Circuits and Systems, 2023-10, Vol.5, p.100073, Article 100073
2023
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Fusion engineering and design, 2017-11, Vol.124, p.572-577
2017
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펄프종이기술, 2016, 48(3), , pp.14-22
2016
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Nuclear engineering and technology, 2023, Vol.55 (8), p.2823-2834
2023
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2021 IEEE Region 10 Symposium (TENSYMP), 2021, p.1-4
2021
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Journal of the Korean Physical Society, 2009, 54(5), , pp.1873-1878
2009
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The International journal of pressure vessels and piping, 2020-01, Vol.179, p.103943, Article 103943
2020
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Fatigue & fracture of engineering materials & structures, 2019-04, Vol.42 (4), p.775-791
2019
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Fusion engineering and design, 2020-12, Vol.161, p.111888, Article 111888
2020
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Fusion engineering and design, 2019-09, Vol.146, p.1872-1876
2019
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The International journal of pressure vessels and piping, 2021-08, Vol.192, p.104429, Article 104429
2021
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Fusion engineering and design, 2019-09, Vol.146, p.2209-2213
2019
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