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Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress

Journal of materials research, 2019-08, Vol.34 (16), p.2775-2788

2019

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Morphological evolution and growth kinetics of Kirkendall voids in binary alloy system during deformation process—Phase field crystal simulation study

Transactions of Nonferrous Metals Society of China, 2017-03, Vol.27 (3), p.599-607

2017

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Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.2134-2141

2018

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Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation

2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.260-265

2015

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Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.264-270

2016

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Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading

2015 16th International Conference on Electronic Packaging Technology (ICEPT), 2015, p.301-306

2015

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3D Finite Element Simulation Study of Chip Stacking Structure Considering Different Numbers of Stacked Dies and the Effects of Underfill and Intermetallic Compound Layer of Micro-joints

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1405-1411

2021

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Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration

2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, p.361-366

2018

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Three-Dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.410-416

2019

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Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling

2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, p.1-7

2018

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Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient

2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, p.376-382

2018

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Microstructure Simulation and Thermo-Mechanical Behavior Analysis of Copper Filled Through Silicon Vias Using Coupled Phase Field and Finite Element Methods

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1668-1674

2017

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Coupled phase field and finite element modeling of void evolution and physical property change of micro flip-chip solder joints under electromigration and elastic stress field

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.1631-1636

2017

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Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method

2017 18th International Conference on Electronic Packaging Technology (ICEPT), 2017, p.1617-1622

2017

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Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure

2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016, p.947-952

2016

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Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient

2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016, p.953-957

2016

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Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects

2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016, p.836-840

2016

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Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects

2014 15th International Conference on Electronic Packaging Technology, 2014, p.641-645

2014

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A STUDY ON OXIDATIVE STRESS IN LEAD-EXPOSED WORKERS

Journal of Toxicology and Environmental Health, Part A, 1999-06, Vol.57 (3), p.161-172

1999

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Aspherical Oscillation of Two Interacting Bubbles in an Ultrasound Field

Chinese physics letters, 2012-07, Vol.29 (7), p.74701-1-074701-3

2012

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Febrile seizures are associated with mutation of seizure-related (SEZ) 6, a brain-specific gene

Journal of neuroscience research, 2007-01, Vol.85 (1), p.166-172

2007

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二元合金体系形变过程中Kirkendall空洞形貌演化和生长动力学的晶体相场法研究

中国有色金属学报（英文版）, 2017, Vol.27 (3), p.599-607

2017

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抒写人间最忠诚的诗行——评大型文献电视纪录片《忠诚》

Qiu shi (Beijing, China), 2010 (21), p.62-62

梁水宝

2010

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Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress

Morphological evolution and growth kinetics of Kirkendall voids in binary alloy system during deformation process—Phase field crystal simulation study

Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods

Morphological evolution and migration behavior of the microvoid in Sn/Cu interconnects under electrical field studied by phase-field simulation

Phase Field Simulation of Segregation of the Bi-Riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing

Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic compound layer of Sn/Cu soldering system under cyclic loading

3D Finite Element Simulation Study of Chip Stacking Structure Considering Different Numbers of Stacked Dies and the Effects of Underfill and Intermetallic Compound Layer of Micro-joints

Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration

Three-Dimensional Simulation of the Thermo-Mechanical Interaction between the Micro-Bump Joints and Cu Protrusion in Cu-Filled TSVs of the High Bandwidth Memory (HBM) Structure

Interaction effects between the preferred growth of β-Sn grains and thermo-mechanical response in microbump interconnects under thermal cycling

Phase field study of the combined effects of electromigration and thermomigration on phase segregation and physical properties of Sn58Bi solder joints under electric current stressing coupled with temperature gradient

Microstructure Simulation and Thermo-Mechanical Behavior Analysis of Copper Filled Through Silicon Vias Using Coupled Phase Field and Finite Element Methods

Coupled phase field and finite element modeling of void evolution and physical property change of micro flip-chip solder joints under electromigration and elastic stress field

Microstructure simulation and thermo-mechanical behavior analysis of Cu-filled through silicon vias (TSVs) using combined Monte Carlo and finite element method

Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure

Phase field simulation of morphological evolution and migration of the microvoid in small scale solder interconnects driven by temperature gradient

Phase field simulation of the microstructural evolution and electromigration-induced phase segregation in line-type Cu/Sn-Bi/Cu solder interconnects

Phase field simulation of Kirkendall voids at the interface of microscale Sn/Cu system lead-free interconnects

A STUDY ON OXIDATIVE STRESS IN LEAD-EXPOSED WORKERS

Aspherical Oscillation of Two Interacting Bubbles in an Ultrasound Field

Febrile seizures are associated with mutation of seizure-related (SEZ) 6, a brain-specific gene

二元合金体系形变过程中Kirkendall空洞形貌演化和生长动力学的晶体相场法研究

抒写人间最忠诚的诗行——评大型文献电视纪录片《忠诚》

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