Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...
Sortiert nach
    Datensatz exportieren als...
  • BibTeX
Carbonization behavior of polyoxadiazole fibers and films
Journal of materials science, 1999, Vol.34 (24), p.6015-6025
1999
Link zum Volltext
Verfügbarkeit prüfen
    Datensatz exportieren als...
  • BibTeX
Fundamental Limits of Organic Packages and Boards and the Need for Novel Ceramic Boards for Next Generation Electronic Packaging
Journal of electroceramics, 2004-07, Vol.13 (1-3), p.417-422
2004
Link zum Volltext
Verfügbarkeit prüfen
    Datensatz exportieren als...
  • BibTeX
Evaluation of alternative materials for system-on-package (SOP) substrates
IEEE transactions on components and packaging technologies, 2004-12, Vol.27 (4), p.694-701
2004
    Datensatz exportieren als...
  • BibTeX
Carbonization behavior of polyoxidiazole fibers and films
Journal of materials science, 1999-12, Vol.34 (24), p.6015-6025
1999
Link zum Volltext
Verfügbarkeit prüfen
    Datensatz exportieren als...
  • BibTeX
Selection and evaluation of materials for future system-on-package (SOP) substrate
2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001, p.1193-1197
2001
    Datensatz exportieren als...
  • BibTeX
Evaluation of liquid crystal polymers for high performance SOP application
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345), 2002, p.676-680
2002
    Datensatz exportieren als...
  • BibTeX
In-situ stress and warpage measurements to investigate reliability of flip-chip on board assembly without underfill
53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.148-155
2003
    Datensatz exportieren als...
  • BibTeX
Delamination issues in integration of highly filled polymer-ceramic nanocomposite films on MCM-L compatible substrates
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000, p.1681-1685
2000
    Datensatz exportieren als...
  • BibTeX
Evaluation of low stress dielectrics for board application
53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.136-141
2003
    Datensatz exportieren als...
  • BibTeX
Liquid crystal polymers (LCP) for high performance SOP applications
2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617), 2002, p.249-253
2002
    Datensatz exportieren als...
  • BibTeX
The role of stiff base substrates in warpage reduction for future high-density-wiring requirements
2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617), 2002, p.221-225
2002
    Datensatz exportieren als...
  • BibTeX
Reliability assessment of high density multi-layer board assembly using shadow Moire and luminescence spectroscopy
4th Electronics Packaging Technology Conference, 2002, 2002, p.126-132
2002
Open Access
    Datensatz exportieren als...
  • BibTeX
MORPHOLOGICAL STUDY ON CARBON FIBERS AND FILMS DERIVED FROM POLYOXADIAZOLE
Sen'i Gakkaishi, 1992/08/10, Vol.48(8), pp.379-383
1992
Link zum Volltext
Verfügbarkeit prüfen
    Datensatz exportieren als...
  • BibTeX
Alien chromosome substitution of durum wheat: substitution of the chromosome e7 of Elytrigia elongata for chromosome 4A of Steward durum
Idengaku zasshi, 1984, Vol.59 (2), p.141-153
1984
Link zum Volltext
Verfügbarkeit prüfen
Open Access
    Datensatz exportieren als...
  • BibTeX
Alien chromosome substitution of durum wheat: Substitution of the chromosome e7 of Elytrigia elongata for chromosome 4A of Stewart durum
The Japanese Journal of Genetics, 1984, Vol.59(2), pp.141-153
1984
Link zum Volltext
Verfügbarkeit prüfen
1 – 15 von 15
Suche als RSS-Feed
Suchergebnisse filtern
Filter anzeigen