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Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure

Materials & design, 2020-10, Vol.195, p.109065, Article 109065

2020

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Direct bonding of CMP-Cu films by surface activated bonding (SAB) method

Journal of materials science, 2005-06, Vol.40 (12), p.3149-3154

2005

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Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding ot Cu, SiO sub(2), and Polyimide at 150 degree C and Atmospheric Pressure

Journal of electronic materials, 2012-09, Vol.41 (8), p.2274-2280

2012

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Metasurface Quantum Well Photodetectors with Broadened Photoresponse Using a Patchwork of Cavities within a Subwavelength Period

2020 Fourteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials), 2020, p.219-221

2020

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Bumpless interconnect through ultrafine Cu electrodes by means of surface-activated bonding (SAB) method

IEEE transactions on advanced packaging, 2006-05, Vol.29 (2), p.218-226

2006

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Study on Hybrid Au-Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-04, Vol.3 (4), p.558-565

2013

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Bumpless Interconnect of 6-μm-Pitch Cu Electrodes at Room Temperature

IEEE transactions on advanced packaging, 2008-08, Vol.31 (3), p.473-478

2008

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Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment

2011 International Symposium on Advanced Packaging Materials (APM), 2011, p.220-225

2011

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Bumpless interconnect of Cu electrodes in millions-pins level

56th Electronic Components and Technology Conference 2006, 2006, p.4 pp.

2006

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Vapor-assisted hybrid bonding of inorganic/organic substrates for 3D hetero integration

2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012, p.59-59

2012

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A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics : Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation Process

2019 International Conference on Electronics Packaging (ICEP), 2019, p.117-122

2019

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Room-temperature direct bonding of CMP-Cu film for bumpless interconnection

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220), 2001, p.755-760

2001

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A Single Bonding Process for Diverse Organic-Inorganic Integration in IoT Devices

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.235-242

2019

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Homo/heterogeneous bonding of Cu, SiO2, and polyimide by low temperature vapor-assisted surface activation method

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.32-36

2011

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Room temperature bonding of ultra-fine pitch and low-profiled Cu electrodes for bump-less interconnect

53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.848-852

2003

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Hybrid bonding of organic/inorganic substrates in ambient air for eco-friendly 3D integration of microelectronics

2012 Electronics Goes Green 2012, 2012, p.1-6

2012

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Modified diffusion bond process for chemical mechanical polishing (CMP)-Cu at 150°C in ambient air

2009 59th Electronic Components and Technology Conference, 2009, p.365-369

2009

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Bumpless interconnect of 6-μm pitch Cu electrodes at room temperature

2008 58th Electronic Components and Technology Conference, 2008, p.1405-1409

2008

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UV/vapor-assisted hybrid bonding technology as a tool for future nanopackaging

2012 12th IEEE International Conference on Nanotechnology (IEEE-NANO), 2012, p.1-5

2012

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Direct interconnection of chemical mechanical polishing (CMP)-cu thin films at 150°c in ambient air

2009 European Microelectronics and Packaging Conference, 2009, p.1-5

2009

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Hybrid Au-underfill resin bonding with lock-and-key structure

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.258-262

2012

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Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI

2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012, p.81-81

2012

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Low temperature Au-Au flip chip bonding with VUV/O3 treatment for 3D integration

2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, 2012, p.171-171

2012

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Low temperature Au-Au bonding with VUV/O3 treatment

2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International, 2012, p.1-5

2012

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Bumpless Interconnect of 6- \mum-Pitch Cu Electrodes at Room Temperature

IEEE transactions on advanced packaging, 2008-08, Vol.31 (3), p.473-478

2008

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Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure

Direct bonding of CMP-Cu films by surface activated bonding (SAB) method

Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding ot Cu, SiO sub(2), and Polyimide at 150 degree C and Atmospheric Pressure

Metasurface Quantum Well Photodetectors with Broadened Photoresponse Using a Patchwork of Cavities within a Subwavelength Period

Bumpless interconnect through ultrafine Cu electrodes by means of surface-activated bonding (SAB) method

Study on Hybrid Au-Underfill Resin Bonding Method With Lock-and-Key Structure for 3-D Integration

Bumpless Interconnect of 6-μm-Pitch Cu Electrodes at Room Temperature

Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment

Bumpless interconnect of Cu electrodes in millions-pins level

Vapor-assisted hybrid bonding of inorganic/organic substrates for 3D hetero integration

A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics : Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation Process

Room-temperature direct bonding of CMP-Cu film for bumpless interconnection

A Single Bonding Process for Diverse Organic-Inorganic Integration in IoT Devices

Homo/heterogeneous bonding of Cu, SiO2, and polyimide by low temperature vapor-assisted surface activation method

Room temperature bonding of ultra-fine pitch and low-profiled Cu electrodes for bump-less interconnect

Hybrid bonding of organic/inorganic substrates in ambient air for eco-friendly 3D integration of microelectronics

Modified diffusion bond process for chemical mechanical polishing (CMP)-Cu at 150°C in ambient air

Bumpless interconnect of 6-μm pitch Cu electrodes at room temperature

UV/vapor-assisted hybrid bonding technology as a tool for future nanopackaging

Direct interconnection of chemical mechanical polishing (CMP)-cu thin films at 150°c in ambient air

Hybrid Au-underfill resin bonding with lock-and-key structure

Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI

Low temperature Au-Au flip chip bonding with VUV/O3 treatment for 3D integration

Low temperature Au-Au bonding with VUV/O3 treatment

Bumpless Interconnect of 6- \mum-Pitch Cu Electrodes at Room Temperature

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