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Fast and Accurate Machine Learning Inverse Lithography Using Physics Based Feature Maps and Specially Designed DCNN

Journal of microelectronic manufacturing, 2020-12, Vol.3 (4), p.1-8

2020

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Fast and Robust DCNN Based Lithography SEM Image Contour Extraction Models

Journal of microelectronic manufacturing, 2021-03, Vol.4 (1), p.1-8

2021

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Challenges of 22 nm and beyond CMOS technology

Science China. Information sciences, 2009-09, Vol.52 (9), p.1491-1533

2009

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A Unified Machine Learning Through Focus Resist 3-D Structure Model

IEEE transactions on semiconductor manufacturing, 2024-02, Vol.37 (1), p.59-66

2024

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Can optical proximity correction solution be learned? The learning limit and a general learning framework

Journal of Micro/Nanopatterning, Materials, and Metrology, 2022-10, Vol.21 (4)

2022

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DNA conformational dynamics in polymer solutions above and below the entanglement limit

Analytical chemistry (Washington), 1995-03, Vol.67 (6), p.1132-1138

1995

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Machine learning virtual SEM metrology and SEM-based OPC model methodology

Journal of Micro/Nanopatterning, Materials, and Metrology, 2021-10, Vol.20 (4)

2021

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Dynamics of DNA during Pulsed Field Electrophoresis in Entangled and Dilute Polymer Solutions

Analytical chemistry (Washington), 1995-09, Vol.67 (18), p.3219-3222

1995

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Studies of Photo Resist Profile Improvement in 28 nm Implanting Layer’s Lithography Process without BARC

ECS transactions, 2014, Vol.60 (1), p.191-198

2014

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The Mask 3D Effect on 2D Pattern Shape Fidelity, a Simulation Study

ECS transactions, 2014, Vol.60 (1), p.243-250

2014

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An Investigation on OPC Model Coverage to Improve CD Uniformity

ECS transactions, 2014, Vol.60 (1), p.219-224

2014

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The characterization of photoresist shrinkage difference in X-Y directions with CDSEM metrology

2016 China Semiconductor Technology International Conference (CSTIC), 2016, p.1-4

2016

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OPC Model Calibration Accuracy Improvement by Using Mask 3D Model

ECS transactions, 2014, Vol.60 (1), p.187-190

2014

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DOF and Coherence Optimization in Sub-32 nm Contact Lithography

ECS transactions, 2012, Vol.44 (1), p.257-265

2012

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The Impact of the Use of Strongly Absorbing Etch Hard Masks and Shallow Topography to Alignment Signal Strength in 28 nm Technology Nodes and Beyond

ECS transactions, 2012, Vol.44 (1), p.233-240

2012

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Intensity dependent geminate recombination in water

Chemical physics letters, 1991-10, Vol.185 (1), p.47-52

1991

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Femtosecond studies of electron photodetachment from an iodide ion in solution: The trapped electron

Chemical physics letters, 1990-06, Vol.169 (3), p.165-171

1990

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Study on Abnormal Intra-Field CD Uniformity in Exposure Scan Direction

ECS transactions, 2014, Vol.60 (1), p.205-212

2014

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Substrate effect on CD Control for Ion Implantation Layer Lithography Beyond 45 nm Node

ECS transactions, 2013, Vol.52 (1), p.177-182

2013

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Improvement of Contact OPC Model Accuracy by Using Corner Chopping

ECS transactions, 2013, Vol.52 (1), p.187-191

2013

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Mask Corner Chopping Strategy Optimization and Its Impact on Random 2D Logic Pattern OPC Recipe Accuracy

ECS transactions, 2014, Vol.60 (1), p.159-164

2014

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SRAF Optimization for sub-40nm Technology Node Contact Patterning

ECS transactions, 2012, Vol.44 (1), p.283-290

2012

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Limitation of Layout Correction on Improvement of OPC Model Calibration

ECS transactions, 2013, Vol.52 (1), p.267-272

2013

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Limit of Line End Shortening Correction under Single Exposure in 193 nm Immersion Lithography

ECS transactions, 2011, Vol.34 (1), p.269-275

2011

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The Effects of Nominal Process Focus Definition on the OPC Model

ECS transactions, 2012-01, Vol.44 (1), p.241-247

2012

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Fast and Accurate Machine Learning Inverse Lithography Using Physics Based Feature Maps and Specially Designed DCNN

Fast and Robust DCNN Based Lithography SEM Image Contour Extraction Models

Challenges of 22 nm and beyond CMOS technology

A Unified Machine Learning Through Focus Resist 3-D Structure Model

Can optical proximity correction solution be learned? The learning limit and a general learning framework

DNA conformational dynamics in polymer solutions above and below the entanglement limit

Machine learning virtual SEM metrology and SEM-based OPC model methodology

Dynamics of DNA during Pulsed Field Electrophoresis in Entangled and Dilute Polymer Solutions

Studies of Photo Resist Profile Improvement in 28 nm Implanting Layer’s Lithography Process without BARC

The Mask 3D Effect on 2D Pattern Shape Fidelity, a Simulation Study

An Investigation on OPC Model Coverage to Improve CD Uniformity

The characterization of photoresist shrinkage difference in X-Y directions with CDSEM metrology

OPC Model Calibration Accuracy Improvement by Using Mask 3D Model

DOF and Coherence Optimization in Sub-32 nm Contact Lithography

The Impact of the Use of Strongly Absorbing Etch Hard Masks and Shallow Topography to Alignment Signal Strength in 28 nm Technology Nodes and Beyond

Intensity dependent geminate recombination in water

Femtosecond studies of electron photodetachment from an iodide ion in solution: The trapped electron

Study on Abnormal Intra-Field CD Uniformity in Exposure Scan Direction

Substrate effect on CD Control for Ion Implantation Layer Lithography Beyond 45 nm Node

Improvement of Contact OPC Model Accuracy by Using Corner Chopping

Mask Corner Chopping Strategy Optimization and Its Impact on Random 2D Logic Pattern OPC Recipe Accuracy

SRAF Optimization for sub-40nm Technology Node Contact Patterning

Limitation of Layout Correction on Improvement of OPC Model Calibration

Limit of Line End Shortening Correction under Single Exposure in 193 nm Immersion Lithography

The Effects of Nominal Process Focus Definition on the OPC Model

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