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Extracellular Vesicles of GMSCs Alleviate Aging-Related Cell Senescence

Journal of dental research, 2021-03, Vol.100 (3), p.283-292

2021

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Exogenous salicylic acid ameliorates waterlogging stress damages and improves photosynthetic efficiency and antioxidative defense system in waxy corn

Photosynthetica, 2021-01, Vol.59 (1), p.84-94

2021

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Exogenous melatonin ameliorates salinity-induced oxidative stress and improves photosynthetic capacity in sweet corn seedlings

Photosynthetica, 2021-06, Vol.59 (2), p.327-336

2021

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DPSC-Derived Extracellular Vesicles Promote Rat Jawbone Regeneration

Journal of dental research, 2023-03, Vol.102 (3), p.313-321

2023

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Identification of Novel Non-Protein Coding RNAs (ncRNAs) in Staphylococcus haemolyticus Biofilm

International journal of cardiology, 2019-12, Vol.297, p.30-30

2019

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Dynamic Thresholding Fully Automated sea ice extraction and classification methods based on multi-source remote-sensing data in the Yellow sea and Bohai sea regions

Advances in space research, 2024-09, Vol.74 (5), p.2092-2116

2024

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Multidrug resistant gram-negative bacilli as predominant bacteremic pathogens in liver transplant recipients

Transplant infectious disease, 2009-10, Vol.11 (5), p.405-412

2009

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An improved methodology for determining temperature dependent moduli of underfill encapsulants

IEEE transactions on components and packaging technologies, 2000-09, Vol.23 (3), p.434-439

2000

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Linker length affects expression and bioactivity of the onconase fusion protein in Pichia pastoris

Genetics and molecular research, 2015-12, Vol.14 (4), p.19360-19370

2015

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Reserve Assessment and Potential Exploitation of Tidal Energy in Shanghai's Sea Area of China

Energy sources. Part A, Recovery, utilization, and environmental effects, 2015-01, Vol.37 (9), p.938-946

2015

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Two-Photon Imaging in Living Brain Slices

Methods (San Diego, Calif.), 1999-06, Vol.18 (2), p.231-239

1999

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Development of no-flow underfill materials for lead-free solder bumped flip-chip applications

IEEE transactions on components and packaging technologies, 2001-03, Vol.24 (1), p.59-66

2001

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Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications

IEEE transactions on components and packaging technologies, 1999-06, Vol.22 (2), p.141-151

1999

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Admissible control for a class of switched and descriptor systems with impulsive effects

2009 Chinese Control and Decision Conference, 2009, p.4045-4049

2009

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Mechanism and Key Controlling Technology of Water Inrush in Tunnel Construction

2011

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High performance no-flow underfills for low-cost flip-chip applications: material characterization

IEEE transactions on components, packaging, and manufacturing technology. Part A, 1998-09, Vol.21 (3), p.450-458

1998

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Study of Grey Rough Set Model Based on Tolerance Relation

2006 9th International Conference on Control, Automation, Robotics and Vision, 2006, p.1-6

2006

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Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.117-124

1998

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High performance no flow underfills for low-cost flip-chip applications

1997 Proceedings 47th Electronic Components and Technology Conference, 1997, p.850-858

1997

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Characterization of a no-flow underfill encapsulant during the solder reflow process

1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.1253-1259

1998

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Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 1999, p.770-776

1999

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Study on the correlation of flip-chip reliability with mechanical properties of no-flow underfill materials

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507), 2000, p.271-277

2000

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Development of the wafer level compressive-flow underfill process and its required materials

1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 1999, p.961-966

1999

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Development of no-flow underfill materials for lead-free solder bumped flip-chip applications

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.00TH8507), 2000, p.278-284

2000

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Development and characterization of imidazole derivative cured bisphenol A epoxy materials for flip-chip underfill applications

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405), 1999, p.317-324

1999

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Extracellular Vesicles of GMSCs Alleviate Aging-Related Cell Senescence

Exogenous salicylic acid ameliorates waterlogging stress damages and improves photosynthetic efficiency and antioxidative defense system in waxy corn

Exogenous melatonin ameliorates salinity-induced oxidative stress and improves photosynthetic capacity in sweet corn seedlings

DPSC-Derived Extracellular Vesicles Promote Rat Jawbone Regeneration

Identification of Novel Non-Protein Coding RNAs (ncRNAs) in Staphylococcus haemolyticus Biofilm

Dynamic Thresholding Fully Automated sea ice extraction and classification methods based on multi-source remote-sensing data in the Yellow sea and Bohai sea regions

Multidrug resistant gram-negative bacilli as predominant bacteremic pathogens in liver transplant recipients

An improved methodology for determining temperature dependent moduli of underfill encapsulants

Linker length affects expression and bioactivity of the onconase fusion protein in Pichia pastoris

Reserve Assessment and Potential Exploitation of Tidal Energy in Shanghai's Sea Area of China

Two-Photon Imaging in Living Brain Slices

Development of no-flow underfill materials for lead-free solder bumped flip-chip applications

Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications

Admissible control for a class of switched and descriptor systems with impulsive effects

Mechanism and Key Controlling Technology of Water Inrush in Tunnel Construction

High performance no-flow underfills for low-cost flip-chip applications: material characterization

Study of Grey Rough Set Model Based on Tolerance Relation

Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications

High performance no flow underfills for low-cost flip-chip applications

Characterization of a no-flow underfill encapsulant during the solder reflow process

Recent advances in the development of no-flow underfill encapsulants-a practical approach towards the actual manufacturing application

Study on the correlation of flip-chip reliability with mechanical properties of no-flow underfill materials

Development of the wafer level compressive-flow underfill process and its required materials

Development of no-flow underfill materials for lead-free solder bumped flip-chip applications

Development and characterization of imidazole derivative cured bisphenol A epoxy materials for flip-chip underfill applications

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