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Damage based fatigue criterion for solders in electronic packaging

IEEE transactions on components and packaging technologies, 2005-09, Vol.28 (3), p.435-440

Shengmin Wen, Shengmin Wen

2005

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Constitutive and damage model for a lead-free solder

Journal of electronic materials, 2001-09, Vol.30 (9), p.1190-1196

2001

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Cu Pillar flip chip assembly: Chip attach process failure mode study

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1231-1234

2014

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Surface displacements and energy release rates for constant stress drop slip zones in joined elastic quarter spaces

Journal of Geophysical Research: Solid Earth, 2000-08, Vol.105 (B8), p.19111-19119

2000

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Effective package-on-package warpage DOE design with analytical method

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.813-816

2013

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Flip chip assembly with advanced RDL technology

2013 14th International Conference on Electronic Packaging Technology, 2013, p.57-59

2013

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Constitutive model and numerical analysis for high lead solders

IEEE transactions on components and packaging technologies, 2004-12, Vol.27 (4), p.718-723

2004

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Organic Substrate Technologies for Fingerprint Sensors

IMAPS other content, 2019-03, Vol.2019 (DPC), p.1082-1094

Wen, Shengmin

2019

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Evaluation of raw substrate variation from different suppliers and processes and their impact on package warpage

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.1406-1411

2012

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Enhancing overall system functionality and performance with the right packaging solutions

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012, p.19-24

2012

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A constitutive model for a high lead solder

IEEE transactions on components and packaging technologies, 2002-03, Vol.25 (1), p.23-31

2002

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Strip grinding introduction for thin PoP

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1361-1365

2014

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A study on an Ultra Thin PoP using through mold via technology

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1547-1551

2011

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A fatigue theory for solders

2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167), 2001, p.120-127

2001

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Cu Pillar Bump Design Parameters for Flip Chip Integration

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.211-216

2021

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PoP Package Warpage Contributors' Characterization and Impact Analysis

International Symposium on Microelectronics, 2012-01, Vol.2012 (1), p.1034-1037

Wen, Shengmin

2012

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Genome-scale detection of hypermethylated CpG islands in circulating cell-free DNA of hepatocellular carcinoma patients

Cell research, 2015-11, Vol.25 (11), p.1250-1264

2015

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Thermomechanical fatigue life prediction for several solders

Wen, Shengmin

2001

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Adopt Advanced RDL Rule to Apply Flip Chip Technology for Next Generation Si Node: Feasibility Study

IMAPS other content, 2013-01, Vol.2013 (DPC), p.1-11

2013

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Damage Characterization and its Incorporation into the Constitutive Model for Several Solders in Electronic Packaging

International journal of damage mechanics, 2002-10, Vol.11 (4), p.355-366

2002

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Damage based fatigue criterion for solders in electronic packaging

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004, Vol.2, p.184-191 Vol.2

2004

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Constitutive model and numerical analysis for high lead solder interconnects

The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543), 2004, Vol.2, p.153-159 Vol.2

2004

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Monolithic nanoporous Ni Fe alloy by dealloying laser processed Ni Fe Al as electrocatalyst toward oxygen evolution reaction

International journal of hydrogen energy, 2018-08, Vol.43 (32), p.15234-15244

2018

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The Application of Convolutional Neural Networks (CNNs) to Recognize Defects in 3D-Printed Parts

Materials, 2021-05, Vol.14 (10), p.2575

2021

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Active Fault Exploration and Seismic Hazard Assessment in Fuzhou City

Earthquake research in China, 2005, Vol.19 (3), p.224-239

Zhu Jinfang Huang Zonglin Xu Xiwei Zheng Rongzhang Fang Shengmin Bai Denghai Wang Guangcai Min Wei Wen Xueze Han Zhujun

2005

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Damage based fatigue criterion for solders in electronic packaging

Constitutive and damage model for a lead-free solder

Cu Pillar flip chip assembly: Chip attach process failure mode study

Surface displacements and energy release rates for constant stress drop slip zones in joined elastic quarter spaces

Effective package-on-package warpage DOE design with analytical method

Flip chip assembly with advanced RDL technology

Constitutive model and numerical analysis for high lead solders

Organic Substrate Technologies for Fingerprint Sensors

Evaluation of raw substrate variation from different suppliers and processes and their impact on package warpage

Enhancing overall system functionality and performance with the right packaging solutions

A constitutive model for a high lead solder

Strip grinding introduction for thin PoP

A study on an Ultra Thin PoP using through mold via technology

A fatigue theory for solders

Cu Pillar Bump Design Parameters for Flip Chip Integration

PoP Package Warpage Contributors' Characterization and Impact Analysis

Genome-scale detection of hypermethylated CpG islands in circulating cell-free DNA of hepatocellular carcinoma patients

Thermomechanical fatigue life prediction for several solders

Adopt Advanced RDL Rule to Apply Flip Chip Technology for Next Generation Si Node: Feasibility Study

Damage Characterization and its Incorporation into the Constitutive Model for Several Solders in Electronic Packaging

Damage based fatigue criterion for solders in electronic packaging

Constitutive model and numerical analysis for high lead solder interconnects

Monolithic nanoporous Ni Fe alloy by dealloying laser processed Ni Fe Al as electrocatalyst toward oxygen evolution reaction

The Application of Convolutional Neural Networks (CNNs) to Recognize Defects in 3D-Printed Parts

Active Fault Exploration and Seismic Hazard Assessment in Fuzhou City

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