UB Paderborn / Katalog / Suche / in CDI

Sie befinden Sich nicht im Netzwerk der Universität Paderborn. Der Zugriff auf elektronische Ressourcen ist gegebenenfalls nur via VPN oder Shibboleth (DFN-AAI) möglich. mehr Informationen...

1 – 25 von 66.262

Sortiert nach

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints

Materials, 2022-07, Vol.15 (14), p.5086

2022

Volltextzugriff (PDF)

Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

Journal of materials science, 2020-03, Vol.55 (7), p.3107-3117

2020

Volltextzugriff (PDF)

Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles

Journal of electronic materials, 2019-04, Vol.48 (4), p.2263-2271

2019

Volltextzugriff (PDF)

Thermomigration induced microstructure and property changes in Sn-58Bi solders

Materials & design, 2019-03, Vol.166, p.107619, Article 107619

2019

Volltextzugriff (PDF)

Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2021-02, Vol.804, p.140785, Article 140785

2021

Volltextzugriff (PDF)

Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature

Materials, 2024-02, Vol.17 (5), p.1055

2024

Volltextzugriff (PDF)

Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding

Journal of materials science. Materials in electronics, 2020-09, Vol.31 (17), p.14635-14644

2020

Volltextzugriff (PDF)

Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0Ag-0.5Cu/Cu solder joints

Journal of applied physics, 2019-11, Vol.126 (18)

2019

Volltextzugriff (PDF)

Electromigration behavior of silver thin film fabricated by electron-beam physical vapor deposition

Journal of materials science, 2021-06, Vol.56 (16), p.9769-9779

2021

Volltextzugriff (PDF)

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

Materials & design, 2019-12, Vol.183, p.108144, Article 108144

2019

Volltextzugriff (PDF)

Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy

Journal of materials science, 2020-08, Vol.55 (24), p.10824-10832

2020

Volltextzugriff (PDF)

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid-Liquid System under Formic Acid Atmosphere

Materials, 2023-03, Vol.16 (6), p.2389

2023

Volltextzugriff (PDF)

Effect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder

Scientific reports, 2019-03, Vol.9 (1), p.3658-3658, Article 3658

2019

Volltextzugriff (PDF)

Effect of Cu on the interfacial reaction between Sn-based solders and FeCoNiCu alloys

Intermetallics, 2022-05, Vol.144, p.107530, Article 107530

2022

Volltextzugriff (PDF)

Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints

Metals (Basel ), 2022-01, Vol.12 (1), p.33

2022

Volltextzugriff (PDF)

Suppressed Growth of (Fe, Cr, Co, Ni, Cu)Sn2 Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu0.5 Substrate during Solid-state Aging

Scientific reports, 2019-07, Vol.9 (1), p.1-5, Article 10210

2019

Volltextzugriff (PDF)

Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy

Journal of materials science. Materials in electronics, 2019-04, Vol.30 (8), p.7423-7434

2019

Volltextzugriff (PDF)

Anisotropic Grain Growth in (111) Nanotwinned Cu Films by DC Electrodeposition

Materials, 2019-12, Vol.13 (1), p.134

2019

Volltextzugriff (PDF)

Observation of void formation patterns in SnAg films undergoing electromigration and simulation using random walk methods

Scientific reports, 2021-04, Vol.11 (1), p.8668-8668, Article 8668

2021

Volltextzugriff (PDF)

Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Journal of materials research and technology, 2022-11, Vol.21, p.2352-2361

2022

Volltextzugriff (PDF)

Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration

Journal of materials science. Materials in electronics, 2020-12, Vol.31 (23), p.21711-21722

2020

Volltextzugriff (PDF)

Effects of impurities on void formation at the interface between Sn-3.0Ag-0.5Cu and Cu electroplated films

Journal of materials science. Materials in electronics, 2021-05, Vol.32 (9), p.11944-11951

2021

Volltextzugriff (PDF)

Effect of indium addition on mechanical, thermal, and soldering properties of eutectic Sn–9Zn alloy

Materials chemistry and physics, 2024-03, Vol.315, p.128992, Article 128992

Shen, Yu-An

2024

Volltextzugriff (PDF)

Bi Dispersion Hardening in Sn-Bi Alloys by Solid-State Aging

JOM (1989), 2023-11, Vol.75 (11), p.4922-4930

Shen, Yu-An

2023

Volltextzugriff (PDF)

Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration

Scripta materialia, 2017-02, Vol.128, p.6-9

2017

Volltextzugriff (PDF)

1 – 25 von 66.262

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(55.175)
Mit Volltextzugriff
(61.386)

Publikationsform

Artikel
(59.136)
Tagungsberichte
(4.679)
Buchkapitel
(1.859)
Berichte
(206)
Dissertationen
(176)
Bücher
(76)
Reviews
(75)
magazinearticle
(53)
Texte
(1)
Webseiten
(1)

5 weitere anzeigen...

Weniger anzeigen...

Sprache

12 weitere anzeigen...

Weniger anzeigen...

Erscheinungsjahr

n.n

n.n

Thema

Science & Technology
(45.436)
Life Sciences & Biomedicine
(23.649)
Technology
(14.717)
Physical Sciences
(13.562)
Humans
(12.880)
Chemistry
(7.783)
Engineering
(7.013)
Male
(6.638)
Female
(6.637)
Materials Science
(6.140)
Animals
(6.061)
Materials Science, Multidisciplinary
(4.809)
Physics
(4.799)
Science & Technology - Other Topics
(4.339)
Middle Aged
(3.943)
Adult
(3.622)
Computer Science
(3.208)
Oncology
(3.118)
Mice
(2.972)
Chemistry, Multidisciplinary
(2.843)

15 weitere anzeigen...

Weniger anzeigen...

Kollektion

Ingenta.com
(29.238)
EZB Electronic Journals Library
(25.174)
MEDLINE
(19.262)
Elsevier ScienceDirect Journals Complete
(13.663)
IngentaConnect Journals
(12.019)
Journals@Ovid Complete
(9.240)
Elsevier Journal Backfiles on ScienceDirect (DFG Nationallizenzen)
(9.035)
Wiley-Blackwell Full Collection
(6.880)
SpringerLink Journals - AutoHoldings
(6.676)
IEEE Electronic Library (IEL)
(4.822)
Publisher website
(4.675)
Wiley Online Library Full Collection 2018
(4.454)
SpringerLINK Contemporary (Konsortium Baden-Württemberg)
(3.725)
Nature
(2.089)
Ebook Central Perpetual and DDA
(1.826)
eBooks on EBSCOhost
(1.790)
Taylor & Francis Journals
(1.601)
Taylor & Francis
(1.348)
Taylor & Francis Online
(1.345)
Nexis Uni
(1.149)

15 weitere anzeigen...

Weniger anzeigen...

Zeitschrift / Serie

Plos One
(708)
Scientific Reports
(513)
Applied Mechanics And Materials
(413)
Nature Communications
(388)
Acs Applied Materials & Interfaces
(345)
Physical Review Letters
(309)
Rsc Advances
(300)
Chinese Physics Letters
(275)
Applied Physics Letters
(264)
Cancer Research
(260)

5 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt