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A review of industrial big data for decision making in intelligent manufacturing

Engineering science and technology, an international journal, 2022-05, Vol.29, p.101021, Article 101021

2022

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Study on the flow and heat dissipation of water-based alumina nanofluids in microchannels

Case studies in thermal engineering, 2020-12, Vol.22, p.100746, Article 100746

2020

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Link-Correlation-Aware Opportunistic Routing in Low-Duty-Cycle Wireless Networks

Sensors (Basel, Switzerland), 2021-06, Vol.21 (11), p.3840

2021

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Detection and Diagnosis of Multi-Fault for through Silicon Vias in 3D IC

Journal of electronic testing, 2020-12, Vol.36 (6), p.771-783

2020

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TSV Manufacturing Fault Modeling and Diagnosis Based on Multi-Tone Dither

Journal of advanced computational intelligence and intelligent informatics, 2019-01, Vol.23 (1), p.42-51

2019

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Sexual spores in edible mushroom: bioactive components, discharge mechanisms and effects on fruiting bodies quality

Food science and human wellness, 2023-11, Vol.12 (6), p.2111-2123

2023

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Truth Discovery of Multi-Source Text Data

IEICE Transactions on Information and Systems, 2019/11/01, Vol.E102.D(11), pp.2249-2252

2019

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Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure

Journal of electronic testing, 2017-08, Vol.33 (4), p.491-499

2017

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Integrated Collaborative Filtering for Implicit Feedback Incorporating Covisitation

IEICE Transactions on Information and Systems, 2017/07/01, Vol.E100.D(7), pp.1530-1533

2017

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Wafer map failure pattern recognition based on deep convolutional neural network

Expert systems with applications, 2022-12, Vol.209, p.118254, Article 118254

2022

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Analysis for Modeling Electromagnetic Characteristics of Via in High-Speed Printed Circuit Board

INTERNATIONAL JOURNAL ON Advances in Information Sciences and Service Sciences, 2013-04, Vol.5 (7), p.589-596

2013

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A sensitivity analysis on thermal conductivity of Al2O3-H2O nanofluid: A case based on molecular dynamics and support vector regression method

Journal of molecular liquids, 2024-01, Vol.393, p.123652, Article 123652

2024

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AI classification of wafer map defect patterns by using dual-channel convolutional neural network

Engineering failure analysis, 2021-12, Vol.130, p.105756, Article 105756

2021

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Spreading of droplet impact on ribbed superhydrophobic surfaces with varying structure height

Colloids and surfaces. A, Physicochemical and engineering aspects, 2025-01, Vol.704, p.135397, Article 135397

2025

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Improving Physical Layer Security for Distributed Antenna Systems With a Friendly Jammer

IEEE transactions on communications, 2024-08, Vol.72 (8), p.4756-4773

2024

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A task scheduling model integrating micro-breaks for optimisation of job-cycle time in human-robot collaborative assembly cells

International journal of production research, 2022-08, Vol.60 (15), p.4766-4777

2022

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Study on the Thermal Transient Response of TSV Considering the Effect of Electronic-Thermal Coupling

JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, 2015, 15(3), 63, pp.356-364

2015

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Optimal design of a 4 × 4 MMI thermal optical switch with trapezoidal air trenches

Applied optics (2004), 2023-02, Vol.62 (6), p.1521

2023

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Study on the crosstalk characteristic of non-ideal interconnect structure

International journal of materials and structural integrity, 2013, Vol.7 (1/2/3), p.144

2013

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Research of the bending loss of S-shaped waveguides with offsets and trenches

Journal of modern optics, 2021-09, Vol.68 (15), p.811-816

2021

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Effect of parameters-dependent viscosity and thermal conductivity on the thermo-hydraulic performance of Al2O3-based nanofluids in a rectangular micro-channel

Thermal science, 2024, Vol.28 (5 Part A), p.3849-3863

2024

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Three-dimensional polymer mode (de)multiplexer with cascaded tapered couplers for on-board optical interconnects

Applied optics (2004), 2021-08, Vol.60 (23), p.6791

2021

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TSV fault contactless testing method based on group delay

International journal of electronics, 2021-09, Vol.108 (9), p.1570-1589

2021

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Experimental study of convective heat transfer in Fe3O4-H2O nanofluids in a grid-shaped micro-channel under magnetic field

Thermal science, 2023, Vol.27 (1 Part A), p.289-297

2023

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Research on Cloud Manufacturing Multi-granular Resource Access Control based on Capacity Constraint

INTERNATIONAL JOURNAL ON Advances in Information Sciences and Service Sciences, 2011-06, Vol.3 (5), p.79-86

2011

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A review of industrial big data for decision making in intelligent manufacturing

Study on the flow and heat dissipation of water-based alumina nanofluids in microchannels

Link-Correlation-Aware Opportunistic Routing in Low-Duty-Cycle Wireless Networks

Detection and Diagnosis of Multi-Fault for through Silicon Vias in 3D IC

TSV Manufacturing Fault Modeling and Diagnosis Based on Multi-Tone Dither

Sexual spores in edible mushroom: bioactive components, discharge mechanisms and effects on fruiting bodies quality

Truth Discovery of Multi-Source Text Data

Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure

Integrated Collaborative Filtering for Implicit Feedback Incorporating Covisitation

Wafer map failure pattern recognition based on deep convolutional neural network

Analysis for Modeling Electromagnetic Characteristics of Via in High-Speed Printed Circuit Board

A sensitivity analysis on thermal conductivity of Al2O3-H2O nanofluid: A case based on molecular dynamics and support vector regression method

AI classification of wafer map defect patterns by using dual-channel convolutional neural network

Spreading of droplet impact on ribbed superhydrophobic surfaces with varying structure height

Improving Physical Layer Security for Distributed Antenna Systems With a Friendly Jammer

A task scheduling model integrating micro-breaks for optimisation of job-cycle time in human-robot collaborative assembly cells

Study on the Thermal Transient Response of TSV Considering the Effect of Electronic-Thermal Coupling

Optimal design of a 4 × 4 MMI thermal optical switch with trapezoidal air trenches

Study on the crosstalk characteristic of non-ideal interconnect structure

Research of the bending loss of S-shaped waveguides with offsets and trenches

Effect of parameters-dependent viscosity and thermal conductivity on the thermo-hydraulic performance of Al2O3-based nanofluids in a rectangular micro-channel

Three-dimensional polymer mode (de)multiplexer with cascaded tapered couplers for on-board optical interconnects

TSV fault contactless testing method based on group delay

Experimental study of convective heat transfer in Fe3O4-H2O nanofluids in a grid-shaped micro-channel under magnetic field

Research on Cloud Manufacturing Multi-granular Resource Access Control based on Capacity Constraint

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