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Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect

Journal of electronic materials, 2005-11, Vol.34 (11), p.1363-1367

2005

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TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface

Journal of electronic materials, 2009-12, Vol.38 (12), p.2579-2584

2009

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Artificial insect wings of diverse morphology for flapping-wing micro air vehicles

Bioinspiration & biomimetics, 2009-09, Vol.4 (3), p.036002-036002

2009

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Effects of nitrogen doping on optical properties of TiO2 thin films

Applied physics. A, Materials science & processing, 2005-11, Vol.81 (7), p.1411-1417

2005

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Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging

Philosophical magazine letters, 2011-06, Vol.91 (6), p.410-417

2011

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Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints

Journal of electronic materials, 2012-09, Vol.41 (9), p.2487-2494

2012

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Segregant-induced cavitation of Sn/Cu reactive interface

Scripta materialia, 2005-09, Vol.53 (6), p.631-634

2005

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Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process

Microelectronics and reliability, 2013-06, Vol.53 (6), p.899-905

2013

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Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2011-01, Vol.528 (3), p.1467-1471

2011

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Pinning of grain boundaries by second phase particles in equal-channel angularly pressed Cu–Fe–P alloy

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2006-09, Vol.431 (1), p.86-91

2006

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Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates

Acta materialia, 2009-09, Vol.57 (16), p.4697-4706

2009

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First principles calculation of elastic and lattice constants of orthorhombic Cu3Sn crystal

Journal of alloys and compounds, 2008-10, Vol.466 (1-2), p.517-520

2008

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Effects of Zn addition on electromigration behavior of Sn–1Ag–0.5Cu solder interconnect

Journal of materials science. Materials in electronics, 2013, Vol.24 (1), p.211-216

2013

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Enhanced rate-dependent tensile deformation in equal channel angularly pressed Sn–Ag–Cu alloy

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2009-02, Vol.502 (1), p.153-158

2009

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Current-induced phase partitioning in eutectic indium-tin Pb-Free solder interconnect

Journal of electronic materials, 2007-10, Vol.36 (10), p.1372-1377

2007

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Controlling intermetallic compound formation reaction between Sn and Ni–P by Zn addition

Journal of alloys and compounds, 2009-06, Vol.479 (1), p.505-510

2009

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Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading

Journal of electronic materials, 2012-04, Vol.41 (4), p.741-747

2012

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Mechanical fatigue of Sn-rich Pb-free solder alloys

Journal of materials science. Materials in electronics, 2007-03, Vol.18 (1-3), p.211-227

2007

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Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating

Journal of materials science. Materials in electronics, 2011-09, Vol.22 (9), p.1234-1238

2011

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Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints

Journal of electronic materials, 2009-11, Vol.38 (11), p.2398-2404

2009

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Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings

Journal of electronic materials, 2009-12, Vol.38 (12), p.2506-2515

2009

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Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect

Journal of electronic materials, 2009-03, Vol.38 (3), p.425-429

2009

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Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate

Journal of electronic materials, 2010-03, Vol.39 (3), p.333-337

2010

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Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces

Journal of electronic materials, 2009-12, Vol.38 (12), p.2470-2478

2009

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Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints

Scripta materialia, 2008-03, Vol.58 (5), p.409-412

2008

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Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect

TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface

Artificial insect wings of diverse morphology for flapping-wing micro air vehicles

Effects of nitrogen doping on optical properties of TiO2 thin films

Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging

Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints

Segregant-induced cavitation of Sn/Cu reactive interface

Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process

Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current

Pinning of grain boundaries by second phase particles in equal-channel angularly pressed Cu–Fe–P alloy

Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates

First principles calculation of elastic and lattice constants of orthorhombic Cu3Sn crystal

Effects of Zn addition on electromigration behavior of Sn–1Ag–0.5Cu solder interconnect

Enhanced rate-dependent tensile deformation in equal channel angularly pressed Sn–Ag–Cu alloy

Current-induced phase partitioning in eutectic indium-tin Pb-Free solder interconnect

Controlling intermetallic compound formation reaction between Sn and Ni–P by Zn addition

Surface Morphology of Sn-Rich Solder Interconnects After Electrical Loading

Mechanical fatigue of Sn-rich Pb-free solder alloys

Evolution of solder wettability with growth of interfacial compounds on tinned FeNi plating

Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints

Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings

Effects of Electromigration on Interfacial Reactions in the Ni/Sn-Zn/Cu Solder Interconnect

Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate

Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces

Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints

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