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Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect

Advanced materials (Weinheim), 2000-12, Vol.12 (23), p.1769-1778

2000

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Designing reliable polymer coatings

Polymer engineering and science, 1996-09, Vol.36 (18), p.2375-2381

1996

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Dynamics of gel electrophoresis

Macromolecules, 1989-05, Vol.22 (3), p.1351-1355

1989

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Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric

MRS proceedings, 1997, Vol.476, Article 9

1997

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Adhesion Energy Measurements of Multilayer Low-K Dielectric Materials for ULSI Applications

MRS proceedings, 1998, Vol.511, Article 133

1998

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Dynamics of DNA during pulsed-field gel electrophoresis

Physical review letters, 1990-05, Vol.64 (19), p.2324-2327

1990

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The effect of adhesive modulus on the performance of SMC lap shear joints

Journal of adhesion science and technology, 1993-01, Vol.7 (11), p.1171-1181

1993

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Relative molecular weight distributions of cis-polybenzoxazole/polyphosphoric acid rodlike liquid crystalline polymer solutions from dilute solution rheometry

Journal of polymer science. Part B, Polymer physics, 1992-03, Vol.30 (3), p.259-264

1992

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On the Mechanical Integrity of Ultra Low Dielectric Constant Materials for Use in Ulsi Beol Structures

MRS proceedings, 2000, Vol.612, Article D1.1.1

2000

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On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Journal of electronic packaging, 2000-03, Vol.122 (1), p.28-33

2000

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Development of TiSiN diffusion barriers for Cu/SiLK metallization schemes

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407), 2000, p.40-42

2000

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Nanoscale elastic imaging: a new metrology tool for low-k dielectric integration

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407), 2000, p.96-98

2000

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Development of adhesion promoters to enhance polymer/substrate interface toughness

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405), 1999, p.53-56

1999

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Nanoscale Elastic Imaging of Aluminum/Low-k Dielectric Interconnect Structures

MRS proceedings, 2000, Vol.612, Article D10.7.1

2000

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Integration study of benzocyclobutene with CVD-based aluminum metallization

Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102), 1998, p.277-279

1998

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Characterization of the surface structural, mechanical, and thermal properties of benzocyclobutene dielectric polymers using scanned probe microscopy

Macromolecular symposia., 2001-03, Vol.167 (1), p.213-226

2001

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Interconnect Process Technology Using Perfluorocyclobutane (PFCB)

MRS proceedings, 1996, Vol.443, Article 35

1996

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Method for analyzing the critical adhesion energy of thin film coatings

MRS proceedings, 1995, Vol.356, p.515-527

1995

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Finite Element Analysis of the Mechanical Performance of Benzocyclobutene Structures in Multichip Modules

MRS proceedings, 1991, Vol.239, Article 163

1991

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X-Ray Determination of Residual Stresses of Encapsulated Thin Aluminum Lines

MRS proceedings, 1992, Vol.264, Article 243

1992

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Development of TaSiN diffusion barriers for Cu/SiLK metallization schemes

Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), 2001, p.204-206

2001

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Material and process studies in the integration of plasma-promoted chemical-vapor deposition of aluminum with benzocyclobutene low-dielectric constant polymer

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2000-01, Vol.18 (1), p.252-261

2000

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Integration of chemical vapor deposition Al interconnects in a benzocyclobutene low dielectric constant polymer matrix: A feasibility study

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, 2000-09, Vol.18 (5), p.2463-2471

2000

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Unveiling the longitudinal association between short sleep duration and the incidence of obesity: the Penn State Cohort

International Journal of Obesity, 2014-06, Vol.38 (6), p.825-832

2014

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Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461), 2001, p.60-62

2001

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Development of a Low-Dielectric-Constant Polymer for the Fabrication of Integrated Circuit Interconnect

Designing reliable polymer coatings

Dynamics of gel electrophoresis

Silk Polymer Coating with Low Dielectric Constant and High Thermal Stability for Ulsi Interlayer Dielectric

Adhesion Energy Measurements of Multilayer Low-K Dielectric Materials for ULSI Applications

Dynamics of DNA during pulsed-field gel electrophoresis

The effect of adhesive modulus on the performance of SMC lap shear joints

Relative molecular weight distributions of cis-polybenzoxazole/polyphosphoric acid rodlike liquid crystalline polymer solutions from dilute solution rheometry

On the Mechanical Integrity of Ultra Low Dielectric Constant Materials for Use in Ulsi Beol Structures

On the Mechanical Reliability of Photo-BCB-Based Thin Film Dielectric Polymer for Electronic Packaging Applications

Development of TiSiN diffusion barriers for Cu/SiLK metallization schemes

Nanoscale elastic imaging: a new metrology tool for low-k dielectric integration

Development of adhesion promoters to enhance polymer/substrate interface toughness

Nanoscale Elastic Imaging of Aluminum/Low-k Dielectric Interconnect Structures

Integration study of benzocyclobutene with CVD-based aluminum metallization

Characterization of the surface structural, mechanical, and thermal properties of benzocyclobutene dielectric polymers using scanned probe microscopy

Interconnect Process Technology Using Perfluorocyclobutane (PFCB)

Method for analyzing the critical adhesion energy of thin film coatings

Finite Element Analysis of the Mechanical Performance of Benzocyclobutene Structures in Multichip Modules

X-Ray Determination of Residual Stresses of Encapsulated Thin Aluminum Lines

Development of TaSiN diffusion barriers for Cu/SiLK metallization schemes

Material and process studies in the integration of plasma-promoted chemical-vapor deposition of aluminum with benzocyclobutene low-dielectric constant polymer

Integration of chemical vapor deposition Al interconnects in a benzocyclobutene low dielectric constant polymer matrix: A feasibility study

Unveiling the longitudinal association between short sleep duration and the incidence of obesity: the Penn State Cohort

Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

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