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Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Acta materialia, 2007-05, Vol.55 (8), p.2805-2814

2007

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Effects of Sn grain structure on the electromigration of Sn–Ag solder joints

Journal of materials research, 2012-04, Vol.27 (8), p.1131-1141

2012

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Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Journal of applied physics, 2006-10, Vol.100 (8)

2006

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Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints

Microelectronics and reliability, 2009-03, Vol.49 (3), p.253-263

2009

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Characterization of the Viscoelasticity of Molding Compounds in the Time Domain

Journal of electronic materials, 2010-04, Vol.39 (4), p.419-425

2010

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A Comprehensive Study of Solder Joint Reliability Dependent on Temperature Cycling Profiles and Material Selections with Emphasis on an Improved Solder Fatigue Lifetime Model

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1291-1296

2023

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Photovoltaic characteristics of organic solar cells using Zn–porphyrin derivatives with controlled π-conjugation structures

Synthetic metals, 2012-06, Vol.162 (9-10), p.813-819

2012

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An Unsymmetrically [pi]-Extended Porphyrin-Based Single-Crystal Field-Effect Transistor and Its Anisotropic Carrier-Transport Behavior

Chemistry : a European journal, 2013-02, Vol.19 (7), p.2247

2013

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Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Journal of materials science. Materials in electronics, 2007-03, Vol.18 (1-3), p.247-258

2007

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Kinetic study of intermetallic growth and its reliability implications in Pb-free Sn-based microbumps in 3D integration

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1953-1958

2013

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Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints

2006 IEEE International Reliability Physics Symposium Proceedings, 2006, p.250-255

2006

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Mechanism of void formation in Cu post solder joint under electromigration

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.135-141

2015

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Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.319-325

2012

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Thermally Robust 3‑D Co-DpyDtolP-MOF with Hexagonally Oriented Micropores: Formation of Polyiodine Chains in a MOF Single Crystal

Crystal growth & design, 2015-01, Vol.15 (1), p.268-277

2015

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Semiconducting π-extended porphyrin dimer and its characteristics in OFET and OPVC

Synthetic metals, 2015-07, Vol.205, p.206-211

2015

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Verification of ball-on-ring test using finite element analysis

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010, p.1-6

2010

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Effective thermally activated delayed fluorescence emitter and its performance in OLED device

Synthetic metals, 2015-11, Vol.209, p.99-104

2015

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Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints

2007 Proceedings 57th Electronic Components and Technology Conference, 2007, p.1442-1449

2007

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Preparation of new semiconducting tetraphenylethynyl porphyrin derivatives and their high-performing organic field-effect transistors

Synthetic metals, 2016-10, Vol.220, p.20-24

2016

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Effect of backside scratch direction on the Si die strength

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010, p.1-6

2010

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Effects of UBM thickness, contact trace structure and solder joint scaling on electromigration reliability of Pb-free solder joints

2008 58th Electronic Components and Technology Conference, 2008, p.354-359

2008

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Dramatic enhancement of carrier mobility via effective secondary structural arrangement resulting from the substituents in a porphyrin transistor

Chemical communications (Cambridge, England), 2013-05, Vol.49 (38), p.3994-3996

2013

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Incorporation of various alcohol substituents to a metalloporphyrin platform for dramatic changes in morphologies of microcrystals

Inorganic chemistry communications, 2016-07, Vol.69, p.40-44

2016

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Gas Sorption Properties of Isostructural Co-MOFs Containing Dipyridylporphyrin Linkers with Different Substituents at the 10,20-meso-Positions

European journal of inorganic chemistry, 2015-06, Vol.2015 (18), p.2989-2995

2015

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An Unsymmetrically π-Extended Porphyrin-Based Single-Crystal Field-Effect Transistor and Its Anisotropic Carrier-Transport Behavior

Chemistry : a European journal, 2013-02, Vol.19 (7), p.2247-2251

2013

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Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing

Effects of Sn grain structure on the electromigration of Sn–Ag solder joints

Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints

Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints

Characterization of the Viscoelasticity of Molding Compounds in the Time Domain

A Comprehensive Study of Solder Joint Reliability Dependent on Temperature Cycling Profiles and Material Selections with Emphasis on an Improved Solder Fatigue Lifetime Model

Photovoltaic characteristics of organic solar cells using Zn–porphyrin derivatives with controlled π-conjugation structures

An Unsymmetrically [pi]-Extended Porphyrin-Based Single-Crystal Field-Effect Transistor and Its Anisotropic Carrier-Transport Behavior

Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

Kinetic study of intermetallic growth and its reliability implications in Pb-free Sn-based microbumps in 3D integration

Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints

Mechanism of void formation in Cu post solder joint under electromigration

Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect

Thermally Robust 3‑D Co-DpyDtolP-MOF with Hexagonally Oriented Micropores: Formation of Polyiodine Chains in a MOF Single Crystal

Semiconducting π-extended porphyrin dimer and its characteristics in OFET and OPVC

Verification of ball-on-ring test using finite element analysis

Effective thermally activated delayed fluorescence emitter and its performance in OLED device

Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder Joints

Preparation of new semiconducting tetraphenylethynyl porphyrin derivatives and their high-performing organic field-effect transistors

Effect of backside scratch direction on the Si die strength

Effects of UBM thickness, contact trace structure and solder joint scaling on electromigration reliability of Pb-free solder joints

Dramatic enhancement of carrier mobility via effective secondary structural arrangement resulting from the substituents in a porphyrin transistor

Incorporation of various alcohol substituents to a metalloporphyrin platform for dramatic changes in morphologies of microcrystals

Gas Sorption Properties of Isostructural Co-MOFs Containing Dipyridylporphyrin Linkers with Different Substituents at the 10,20-meso-Positions

An Unsymmetrically π-Extended Porphyrin-Based Single-Crystal Field-Effect Transistor and Its Anisotropic Carrier-Transport Behavior

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