UB Paderborn / Katalog / Suche / in CDI

Water‐Triggered Self‐Healing of Ti3C2Tx MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process

Small (Weinheim an der Bergstrasse, Germany), 2024-05, Vol.20 (20), p.e2306434-n/a

2024

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Low-melting metal thermal interface material for high-power package application

Journal of the Korean Physical Society, 2023-09, Vol.83 (6), p.444-454

2023

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Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications

Applied surface science, 2020-06, Vol.515, p.146060, Article 146060

2020

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Synergistic effect of Indium and Gallium co-doping on growth behavior and physical properties of hydrothermally grown ZnO nanorods

Scientific reports, 2017-02, Vol.7 (1), p.41992-41992, Article 41992

2017

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Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Applied surface science, 2019-11, Vol.495, p.143487, Article 143487

2019

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Electronic textiles: New age of wearable technology for healthcare and fitness solutions

Materials today bio, 2023-04, Vol.19, p.100565-100565, Article 100565

2023

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Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications

Journal of materials science. Materials in electronics, 2020-09, Vol.31 (18), p.15048-15060

2020

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Effect of surface finish metallization on mechanical strength of Ag sintered joint

Microelectronic engineering, 2018-10, Vol.198, p.15-21

2018

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Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging

Journal of materials science. Materials in electronics, 2020-11, Vol.31 (22), p.19852-19874

2020

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Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints

Journal of alloys and compounds, 2015-04, Vol.627, p.276-280

2015

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Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

Crystals (Basel), 2024-05, Vol.14 (5), p.465

2024

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A UV-responsive pressure sensitive adhesive for damage-free fabrication of an ultrathin imperceptible mechanical sensor with ultrahigh optical transparency

Journal of materials chemistry. A, Materials for energy and sustainability, 2019, Vol.7 (39), p.22588-22595

2019

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Design and fabrication of screen-printed silver circuits for stretchable electronics

Microelectronic engineering, 2014-05, Vol.120, p.216-220

2014

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Hydrothermally Grown In-doped ZnO Nanorods on p-GaN Films for Color-tunable Heterojunction Light-emitting-diodes

Scientific reports, 2015-05, Vol.5 (1), p.10410, Article 10410

2015

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Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

Surface and interface analysis, 2018-11, Vol.50 (11), p.1046-1050

2018

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Interfacial reaction in steel–aluminum joints made by friction stir welding

Scripta materialia, 2006-08, Vol.55 (4), p.355-358

2006

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Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles

Journal of electronic materials, 2019-03, Vol.48 (3), p.1746-1753

2019

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Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

Journal of materials science. Materials in electronics, 2020-07, Vol.31 (13), p.10170-10176

2020

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Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing

Journal of alloys and compounds, 2005-03, Vol.390 (1), p.212-219

2005

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Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Journal of materials science. Materials in electronics, 2020-12, Vol.31 (24), p.22926-22932

2020

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Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints

Journal of materials science. Materials in electronics, 2018-03, Vol.29 (6), p.4724-4731

2018

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Advances in Silver Nanowires‐Based Composite Electrodes: Materials Processing, Fabrication, and Applications

Advanced materials technologies, 2023-10, Vol.8 (19)

2023

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Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions

Journal of electronic materials, 2020-02, Vol.49 (2), p.1527-1533

2020

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Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish

Journal of electronic materials, 2020-10, Vol.49 (10), p.6073-6079

2020

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Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials, 2021-01, Vol.14 (2), p.335

2021

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Water‐Triggered Self‐Healing of Ti3C2Tx MXene Standalone Electrodes: Systematic Examination of Factors Affecting the Healing Process

Low-melting metal thermal interface material for high-power package application

Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications

Synergistic effect of Indium and Gallium co-doping on growth behavior and physical properties of hydrothermally grown ZnO nanorods

Effect of epoxy content in Ag nanoparticle paste on the bonding strength of MLCC packages

Electronic textiles: New age of wearable technology for healthcare and fitness solutions

Fast formation of Ni–Sn intermetallic joints using Ni–Sn paste for high-temperature bonding applications

Effect of surface finish metallization on mechanical strength of Ag sintered joint

Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn–58Bi solder joints during aging

Interfacial reaction and intermetallic compound formation of Sn–1Ag/ENIG and Sn–1Ag/ENEPIG solder joints

Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation

A UV-responsive pressure sensitive adhesive for damage-free fabrication of an ultrathin imperceptible mechanical sensor with ultrahigh optical transparency

Design and fabrication of screen-printed silver circuits for stretchable electronics

Hydrothermally Grown In-doped ZnO Nanorods on p-GaN Films for Color-tunable Heterojunction Light-emitting-diodes

Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

Interfacial reaction in steel–aluminum joints made by friction stir welding

Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles

Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

Effects of intermetallic compound on the electrical and mechanical properties of friction welded Cu/Al bimetallic joints during annealing

Mechanical properties and microstructural evolution of solder alloys fabricated using laser-assisted bonding

Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints

Advances in Silver Nanowires‐Based Composite Electrodes: Materials Processing, Fabrication, and Applications

Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions

Mechanical Properties of Cu-Core Solder Balls with ENEPIG Surface Finish

Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

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