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Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation

Micromachines (Basel), 2021-09, Vol.12 (9), p.1020

Seok, Seonho

2021

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FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation

Micromachines (Basel), 2023-06, Vol.14 (7), p.1312

Seok, Seonho

2023

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Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration"

Micromachines (Basel), 2022-05, Vol.13 (5), p.749

Seok, Seonho

2022

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Fabrication and Modeling of Nitride Thin-Film Encapsulation Based on Anti-Adhesion-Assisted Transfer Technique and Nitride/BCB Bilayer Wrinkling

IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-09, Vol.6 (9), p.1301-1307

Seok, Seonho

2016

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A Theoretical Study on Post-It-Like Debonding Process for BCB Cap Transfer Packaging Based on FEM Simulation

IEEE transactions on components, packaging, and manufacturing technology (2011), 2015-10, Vol.5 (10), p.1417-1422

Seok, Seonho

2015

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Autonomous Energy Harvester Based on Textile-Based Enzymatic Biofuel Cell for On-Demand Usage

Sensors (Basel, Switzerland), 2020-09, Vol.20 (17), p.5009

2020

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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Seok, Seonho

1st ed. 2018 edition., 2018

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Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical Simulation

Micromachines (Basel), 2024-04, Vol.15 (4), p.543

2024

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Direct Numerical Simulation of Surface Wrinkling for Extraction of Thin Metal Film Material Properties

Micromachines (Basel), 2023-03, Vol.14 (4), p.747

2023

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Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe

Micromachines (Basel), 2020-06, Vol.11 (6), p.605

2020

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High-Porosity Sieve-Type Neural Electrodes for Motor Function Recovery and Nerve Signal Acquisition

Micromachines (Basel), 2024-06, Vol.15 (7), p.862

2024

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MEMS Packaging Technologies and 3D Integration

Seok, Seonho

2022

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Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package

Micromachines (Basel), 2022-08, Vol.13 (8), p.1295

2022

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A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation

Micromachines (Basel), 2022-03, Vol.13 (4), p.516

2022

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Experiment and analysis of the effect of BCB sealing ring flatness on BCB cap transfer packaging

Microsystem technologies : sensors, actuators, systems integration, 2021-01, Vol.27 (1), p.263-268

Seok, Seonho

2021

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Design, Fabrication, and Characterization of a Wideband 60 GHz Bandpass Filter Based on a Flexible PerMX Polymer Substrate

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-08, Vol.3 (8), p.1384-1389

2013

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A study on effect of wafer bow in wafer-level BCB cap transfer packaging

Microsystem technologies : sensors, actuators, systems integration, 2014-02, Vol.20 (2), p.215-219

2014

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Ultralow-phase-noise oscillators based on BAW resonators

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2014-06, Vol.61 (6), p.903-912

2014

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Scotch-Tape Surface Wrinkling Based Thin-Film Material Properties Extraction

Journal of micromechanics and microengineering, 2022-02

2022

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Scotch-tape surface wrinkling based thin-film material properties extraction

Journal of micromechanics and microengineering, 2022-04, Vol.32 (4), p.45002

2022

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Design, Fabrication, and Measurement of Benzocyclobutene Polymer Zero-Level Packaging for Millimeter-Wave Applications

IEEE transactions on microwave theory and techniques, 2007-05, Vol.55 (5), p.1040-1045

2007

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BCB Cap Packaging of MEMS Switches Integrated With 100- \mu MMIC Wafer

IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-11, Vol.3 (11), p.1799-1803

2013

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Experiment and analysis of a piezoelectric energy harvester based on combined FEM modeling and spice simulation

Microsystem technologies : sensors, actuators, systems integration, 2022-08, Vol.28 (9), p.2123-2130

2022

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Development and analysis of the vertical capacitive accelerometer

Sensors and actuators. A. Physical., 2005-03, Vol.119 (1), p.8-18

2005

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Power and frequency bandwidth improvement of piezoelectric energy harvesting devices using phase-shifted synchronous electric charge extraction interface circuit

Journal of intelligent material systems and structures, 2017-12, Vol.28 (20), p.2988-2995

2017

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Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation

FEM Analysis of Buckled Dielectric Thin-Film Packaging Based on 3D Direct Numerical Simulation

Editorial for the Special Issue "MEMS Packaging Technologies and 3D Integration"

Fabrication and Modeling of Nitride Thin-Film Encapsulation Based on Anti-Adhesion-Assisted Transfer Technique and Nitride/BCB Bilayer Wrinkling

A Theoretical Study on Post-It-Like Debonding Process for BCB Cap Transfer Packaging Based on FEM Simulation

Autonomous Energy Harvester Based on Textile-Based Enzymatic Biofuel Cell for On-Demand Usage

Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Analysis of Experimental Biaxial Surface Wrinkling Pattern Based on Direct 3D Numerical Simulation

Direct Numerical Simulation of Surface Wrinkling for Extraction of Thin Metal Film Material Properties

Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe

High-Porosity Sieve-Type Neural Electrodes for Motor Function Recovery and Nerve Signal Acquisition

MEMS Packaging Technologies and 3D Integration

Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package

A Study on Biocompatible Polymer-Based Packaging of Neural Interface for Chronic Implantation

Experiment and analysis of the effect of BCB sealing ring flatness on BCB cap transfer packaging

Design, Fabrication, and Characterization of a Wideband 60 GHz Bandpass Filter Based on a Flexible PerMX Polymer Substrate

A study on effect of wafer bow in wafer-level BCB cap transfer packaging

Ultralow-phase-noise oscillators based on BAW resonators

Scotch-Tape Surface Wrinkling Based Thin-Film Material Properties Extraction

Scotch-tape surface wrinkling based thin-film material properties extraction

Design, Fabrication, and Measurement of Benzocyclobutene Polymer Zero-Level Packaging for Millimeter-Wave Applications

BCB Cap Packaging of MEMS Switches Integrated With 100- \mu MMIC Wafer

Experiment and analysis of a piezoelectric energy harvester based on combined FEM modeling and spice simulation

Development and analysis of the vertical capacitive accelerometer

Power and frequency bandwidth improvement of piezoelectric energy harvesting devices using phase-shifted synchronous electric charge extraction interface circuit

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