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Glucose as an eco-friendly reducing agent for a one-pot multicomponent synthesis of quinoxalines

Synthetic communications, 2023-03, Vol.53 (5), p.414-425

2023

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An efficient four-component protocol for synthesis of poly-substituted pyridines with SiO2 as a robust recyclable catalyst

Synthetic communications, 2024-04, Vol.54 (7), p.526-535

2024

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Fractal analysis of intermetallic compounds in Sn–Ag, Sn–Ag–Bi, and Sn–Ag–Cu diffusion couples

Materials letters, 2006-04, Vol.60 (8), p.1089-1094

2006

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Identification, synthesis, isolation and spectral characterization of potential impurities of montelukast sodium

Journal of pharmaceutical and biomedical analysis, 2008-11, Vol.48 (3), p.708-715

2008

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Surgical Management of Aggressive Central Giant Cell Granuloma of Maxilla through Le Fort I Access Osteotomy

Journal of clinical imaging science, 2012-05, Vol.2 (1), p.28, Article 28

2012

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An efficient four-component protocol for synthesis of poly-substituted pyridines with SiO 2 as a robust recyclable catalyst

Synthetic communications, 2024-04, Vol.54 (7), p.526-535

2024

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Thin Memory Chip Fabrication for Multi-stack Hybrid Bonding Applications

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022, p.589-593

2022

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Design and Development of Multi-Die Laterally Placed and Vertically Stacked Embedded Micro-Wafer-Level Packages

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-01, Vol.1 (1), p.52-59

2011

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Impulsivity as predictor of severity of suicidal intent in attempted suicidal patients at general hospital setting.

Archives of Mental Health, 2017, Vol.18 (2), p.89-94

2017

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Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications

Journal of materials science. Materials in electronics, 2009, Vol.20 (1), p.74-86

2009

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Non-destructive testing of a high dense small dimension through silicon via (TSV) array structures by using 3D X-ray computed tomography method (CT scan)

2010 12th Electronics Packaging Technology Conference, 2010, p.462-466

2010

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Advanced System in Package Enabled by Wafer Level Heterogeneous Integration of Chiplets

2022 International Electron Devices Meeting (IEDM), 2022, p.3.1.1-3.1.4

2022

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Withdrawal notice to: “Heavy metal ions and dyes removal from aqueous solution using aloevera-based biosorbent: A systematic review” [Environ. Res. 216 (2023) 114669]

Environmental research, 2023-01, Vol.216 (Pt 4), p.114971-114971, Article 114971

2023

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Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-09, Vol.1 (9), p.1336-1344

2011

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Context aware power management in smart grids using load balancing approach

International journal of advanced intelligence paradigms, 2018, Vol.11 (3/4), p.335

2018

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Fake News Detection and Analysis Using Online Machine Learning Techniques

Proceedings of the 2nd International Conference on Cognitive and Intelligent Computing, 2023, p.47-55

2023

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Hexagonal Microstrip Patch Antenna with Defective Ground Structure for Wideband Applications

Tui jin ji shu, 2023-11, Vol.44 (4), p.4016-4023

Upender Rao B, N. V. Koteswara Rao, P. Chandra Sekhar

2023

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Chip to chip hermetic bonding and multi-chip stacking using CuSn bonding technology

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.135-138

2013

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Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behavior of Multilayered Low-k Stack

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-01, Vol.2 (1), p.3-12

2012

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Introducing novel film type adhesives into thin wafer handling technology for 3D TSV packaging applications

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.710-713

2013

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Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-01, Vol.2 (1), p.13-22

2012

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Evaluation of Polymer Materials for Hybrid Bonding Application

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022, p.357-360

2022

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Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-03, Vol.1 (3), p.299-309

2011

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Impact of Packaging Design on Reliability of Large Die Cu/Low- \kappa (BD) Interconnect

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-05, Vol.2 (5), p.807-816

2012

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Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-03, Vol.1 (3), p.279-290

2011

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Glucose as an eco-friendly reducing agent for a one-pot multicomponent synthesis of quinoxalines

An efficient four-component protocol for synthesis of poly-substituted pyridines with SiO2 as a robust recyclable catalyst

Fractal analysis of intermetallic compounds in Sn–Ag, Sn–Ag–Bi, and Sn–Ag–Cu diffusion couples

Identification, synthesis, isolation and spectral characterization of potential impurities of montelukast sodium

Surgical Management of Aggressive Central Giant Cell Granuloma of Maxilla through Le Fort I Access Osteotomy

An efficient four-component protocol for synthesis of poly-substituted pyridines with SiO 2 as a robust recyclable catalyst

Thin Memory Chip Fabrication for Multi-stack Hybrid Bonding Applications

Design and Development of Multi-Die Laterally Placed and Vertically Stacked Embedded Micro-Wafer-Level Packages

Impulsivity as predictor of severity of suicidal intent in attempted suicidal patients at general hospital setting.

Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications

Non-destructive testing of a high dense small dimension through silicon via (TSV) array structures by using 3D X-ray computed tomography method (CT scan)

Advanced System in Package Enabled by Wafer Level Heterogeneous Integration of Chiplets

Withdrawal notice to: “Heavy metal ions and dyes removal from aqueous solution using aloevera-based biosorbent: A systematic review” [Environ. Res. 216 (2023) 114669]

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Context aware power management in smart grids using load balancing approach

Fake News Detection and Analysis Using Online Machine Learning Techniques

Hexagonal Microstrip Patch Antenna with Defective Ground Structure for Wideband Applications

Chip to chip hermetic bonding and multi-chip stacking using CuSn bonding technology

Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behavior of Multilayered Low-k Stack

Introducing novel film type adhesives into thin wafer handling technology for 3D TSV packaging applications

Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material

Evaluation of Polymer Materials for Hybrid Bonding Application

Development of a Cu/Low- k Stack Die Fine Pitch Ball Grid Array (FBGA) Package for System in Package Applications

Impact of Packaging Design on Reliability of Large Die Cu/Low- \kappa (BD) Interconnect

Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package

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