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Annals of oncology, 2023-03, Vol.34 (3), p.262-274
- Psyrri, A.
- Fayette, J.
- Harrington, K.
- Gillison, M.
- Ahn, M.-J.
- Takahashi, S.
- Weiss, J.
- Machiels, J.-P.
- Baxi, S.
- Vasilyev, A.
- Karpenko, A.
- Dvorkin, M.
- Hsieh, C.-Y.
- Thungappa, S.C.
- Segura, P.P.
- Vynnychenko, I.
- Haddad, R.
- Kasper, S.
- Mauz, P.-S.
- Baker, V.
- He, P.
- Evans, B.
- Wildsmith, S.
- Olsson, R.F.
- Yovine, A.
- Kurland, J.F.
- Morsli, N.
- Seiwert, T.Y.
2023
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European journal of clinical investigation, 2005-07, Vol.35 (7), p.421-424
- Alvarez de Cienfuegos, G.
- Badimon, L.
- Barja, G.
- Battino, M.
- Blanco, A.
- Bonanome, A.
- Colomer, R.
- Corella-Piquer, D.
- Covas, I.
- Chamorro-Quiros, J.
- Escrich, E.
- Gaforio, J.J.
- Garcia Luna, P.P.
- Hidalgo, L.
- Kafatos, A.
- Kris-Etherton, P.M.
- Lairon, Denis
- Lamuela-Raventos, R.
- Lopez-Miranda, J.
- Lopez-Segura, F.
- Martinez-Gonzalez, M.A.
- Mata, P.
- Mataix, J.
- Ordovas, José
- Osada, J.
- Pacheco-Reyes, R.
- Perucho, M.
- Pineda-Priego, M.
- Quiles, J.L.
- Ramirez-Tortosa, M.C.
- Ruiz-Gutierrez, V.
- Sanchez-Rovira, P.
- Solfrizzi, V.
- Soriguer-Escofet, F.
- de La Torre-Fornell, R.
- Trichopoulos, A.
- Villalba-Montoro, J.M.
- Villar-Ortiz, J.R.
- Visioli, Francesco
- Perez-Jimenez, F.
2005
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Assembly automation, 2011-01, Vol.31 (1), p.38-46
2011
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The Journal of urology, 1988-06, Vol.139 (6), p.1272-1274
1988
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Polyphenols - Properties, Recovery, and Applications, 2018, p.1-1
2018
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Polyphenols, 2018, p.393-427
2018
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2008 2nd Electronics System-Integration Technology Conference, 2008, p.365-370
2008
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2009 11th Electronics Packaging Technology Conference, 2009, p.260-266
2009
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2006 8th Electronics Packaging Technology Conference, 2006, p.843-848
2006
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2008 2nd Electronics System-Integration Technology Conference, 2008, p.1305-1310
2008
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2008 2nd Electronics System-Integration Technology Conference, 2008, p.1097-1102
2008
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Role of CAD Post-Processing in a Quality Tool for Low Volume High-Complexity Electronics Manufacture
2008
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2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007, 2007, p.1-6
2007
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