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2022 IEEE International Memory Workshop (IMW), 2022, p.1-4
2022
Link zum Volltext
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM), 2023, p.1-3
2023
- Link zum Volltext
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.569-578
- Coudrain, Perceval
- Chausse, P.
- Arnaud, L.
- Lattard, D.
- Guthmuller, E.
- Romano, G.
- Gueugnot, A.
- Berger, F.
- Beltritti, J.
- Mourier, T.
- Gottardi, M.
- Charbonnier, J.
- Minoret, S.
- Ribiere, C.
- Romero, G.
- Philip, P.-E.
- Exbrayat, Y.
- Scevola, D.
- Campos, D.
- Argoud, M.
- Allouti, N.
- Eleouet, R.
- Garnier, A.
- Fuguet Tortolero, C.
- Aumont, C.
- Dutoit, D.
- Legalland, C.
- Michailos, J.
- Cheramy, S.
- Simon, G.
- Vivet, P.
- Velard, R.
- Vinci, A.
- Ponthenier, F.
- Farcy, A.
- Segaud, R.
2019
- Link zum Volltext
2021 IEEE International Memory Workshop (IMW), 2021, p.1-4
- Grenouillet, L.
- Castellani, N.
- Persico, A.
- Meli, V.
- Martin, S.
- Billoint, O.
- Segaud, R.
- Bernasconi, S.
- Pellissier, C.
- Jahan, C.
- Charpin-Nicolle, C.
- Dezest, P.
- Carabasse, C.
- Besombes, P.
- Ricavy, S.
- Tran, N.-P.
- Magalhaes-Lucas, A.
- Roman, A.
- Boixaderas, C.
- Magis, T.
- Bedjaoui, M.
- Tessaire, M.
- Seignard, A.
- Mazen, F.
- Landis, S.
- Vianello, E.
- Molas, G.
- Gaillard, F.
- Arcamone, J.
- Nowak, E.
2021
Link zum Volltext
2022 IEEE International Interconnect Technology Conference (IITC), 2022, p.19-21
2022
- Link zum Volltext
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.2000-2006
2018
- Link zum Volltext
2016 IEEE International 3D Systems Integration Conference (3DIC), 2016, p.1-4
2016
Link zum Volltext
2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.796-802
2012
- Link zum Volltext
2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012, p.330-335
2012
- Link zum Volltext
2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.872-878
2013
- Link zum Volltext
2013 IEEE International Interconnect Technology Conference - IITC, 2013, p.1-3
2013
- Link zum Volltext
2013 Eurpoean Microelectronics Packaging Conference (EMPC), 2013, p.1-6
2013
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Annals of the rheumatic diseases, 2016-06, Vol.75 (Suppl 2), p.851-851
2016
Link zum Volltext
Inorganic chemistry, 2017-11, Vol.56 (21), p.13293-13299
2017
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Value in health, 2019-11, Vol.22, p.S589-S590
2019
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Value in health, 2017-10, Vol.20 (9), p.A526-A527
2017
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Annals of the rheumatic diseases, 2014-06, Vol.73 (Suppl 2), p.679-680
2014
Link zum Volltext
Value in health, 2017-10, Vol.20 (9), p.A526-A527
2017
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Revue du rhumatisme (Ed. française : 1993), 2022-12, Vol.89, p.A19-A19
2022
Link zum Volltext
Revue du rhumatisme (Ed. française : 1993), 2016-11, Vol.83, p.A61-A62
2016
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Acta acustica united with Acustica, 2003, Vol.89, p.900-907
2003
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Thin solid films, 1993-10, Vol.234 (1-2), p.503-507
1993
Link zum Volltext
Materials science & engineering. A, Structural materials : properties, microstructure and processing, 1993-08, Vol.168 (2), p.257-261
1993
Link zum Volltext
Surface science, 1988-11, Vol.206 (1-2), p.297-316
1988
Link zum Volltext
Materials science & engineering. A, Structural materials : properties, microstructure and processing, 1993, Vol.168 (2), p.257-261
1993
Link zum Volltext
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