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Convergent Validity of Behavioural and Subjective Sensitivity in Relation to Autistic Traits

Journal of autism and developmental disorders, 2022-02, Vol.52 (2), p.758-770

2022

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Quantum cascade laser based monitoring of CF2 radical concentration as a diagnostic tool of dielectric etching plasma processes

Applied physics letters, 2015-01, Vol.106 (3)

2015

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Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure

Acta materialia, 2007-02, Vol.55 (4), p.1407-1414

2007

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Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials

Microelectronic engineering, 2012-04, Vol.92, p.53-58

2012

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Modeling and simulation of the interplay between contact metallization and stress liner technologies for strained silicon

Microelectronic engineering, 2013-07, Vol.107, p.161-166

2013

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Study of nano-mechanical properties for thin porous films through instrumented indentation : SiO2 low dielectric constant films as an example

Microelectronic engineering, 2008-10, Vol.85 (10), p.2172-2174

2008

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Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics

Microelectronic engineering, 2007-11, Vol.84 (11), p.2606-2609

2007

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Thermal conductivity of ultra low- k dielectrics

Microelectronic engineering, 2003-11, Vol.70 (2), p.280-284

2003

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Modeling of TDDB in advanced Cu interconnect systems under BTS conditions

Microelectronic engineering, 2012-04, Vol.92, p.107-110

2012

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Determination of Young's modulus and yield stress of porous low-k materials by nanoindentation

Surface & coatings technology, 2006-12, Vol.201 (7), p.4305-4310

2006

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Cu/barrier CMP on porous low- k based interconnect schemes

Microelectronic engineering, 2006-11, Vol.83 (11), p.2218-2224

2006

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Fault tolerant three-phase AC motor drive topologies: a comparison of features, cost, and limitations

IEEE transactions on power electronics, 2004-07, Vol.19 (4), p.1108-1116

2004

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The current limits of the laser-acoustic test method to characterize low- k films

Microelectronic engineering, 2005-12, Vol.82 (3), p.393-398

2005

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Characterization of thin-film aerogel porosity and stiffness with laser-generated surface acoustic waves

Thin solid films, 2001-06, Vol.388 (1), p.1-4

2001

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Competitive Impact of Nanotube Assembly and Contact Electrodes on the Performance of CNT-based FETs

Journal of physical chemistry. C, 2016-05, Vol.120 (18), p.10020-10026

2016

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Interaction between carbon nanotubes and metals: Electronic properties, stability, and sensing

Microelectronic engineering, 2015-04, Vol.137, p.124-129

2015

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Ultra thin CVD TiN layers as diffusion barrier films on porous low-k materials

Microelectronic engineering, 2004-10, Vol.76 (1-4), p.82-88

2004

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Different SiH4 treatments of CVD TiN barrier layers

Microelectronic engineering, 2005-12, Vol.82 (3-4), p.618-622

2005

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Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation

Microelectronic engineering, 2007-11, Vol.84 (11), p.2587-2594

2007

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SiO2 aerogel ultra low k dielectric patterning using different hard mask concepts and stripping processes

Microelectronic engineering, 2004-10, Vol.76 (1-4), p.8-15

2004

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Impact of reducing resist stripping processes at elevated temperature on ULK and HM materials

Microelectronic engineering, 2005-12, Vol.82 (3), p.427-433

2005

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Development of different copper seed layers with respect to the copper electroplating process

Microelectronic engineering, 2000, Vol.50 (1), p.433-440

2000

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Fault detection and fault-tolerant control of interior permanent-magnet motor drive system for electric vehicle

IEEE transactions on industry applications, 2005-01, Vol.41 (1), p.46-51

2005

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On treatment of ultra-low-k SiCOH in CF4 plasmas: correlation between the concentration of etching products and etching rate

Applied physics. B, Lasers and optics, 2015-04, Vol.119 (1), p.219-226

2015

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Novel low- k polycyanurates for integrated circuit (IC) metallization

Microelectronic engineering, 2005-12, Vol.82 (3), p.356-361

2005

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Convergent Validity of Behavioural and Subjective Sensitivity in Relation to Autistic Traits

Quantum cascade laser based monitoring of CF2 radical concentration as a diagnostic tool of dielectric etching plasma processes

Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure

Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials

Modeling and simulation of the interplay between contact metallization and stress liner technologies for strained silicon

Study of nano-mechanical properties for thin porous films through instrumented indentation : SiO2 low dielectric constant films as an example

Thermal stability and gap-fill properties of spin-on MSQ low-k dielectrics

Thermal conductivity of ultra low- k dielectrics

Modeling of TDDB in advanced Cu interconnect systems under BTS conditions

Determination of Young's modulus and yield stress of porous low-k materials by nanoindentation

Cu/barrier CMP on porous low- k based interconnect schemes

Fault tolerant three-phase AC motor drive topologies: a comparison of features, cost, and limitations

The current limits of the laser-acoustic test method to characterize low- k films

Characterization of thin-film aerogel porosity and stiffness with laser-generated surface acoustic waves

Competitive Impact of Nanotube Assembly and Contact Electrodes on the Performance of CNT-based FETs

Interaction between carbon nanotubes and metals: Electronic properties, stability, and sensing

Ultra thin CVD TiN layers as diffusion barrier films on porous low-k materials

Different SiH4 treatments of CVD TiN barrier layers

Evaluation of Air Gap structures produced by wet etch of sacrificial dielectrics: Critical processes and reliability of Air Gap formation

SiO2 aerogel ultra low k dielectric patterning using different hard mask concepts and stripping processes

Impact of reducing resist stripping processes at elevated temperature on ULK and HM materials

Development of different copper seed layers with respect to the copper electroplating process

Fault detection and fault-tolerant control of interior permanent-magnet motor drive system for electric vehicle

On treatment of ultra-low-k SiCOH in CF4 plasmas: correlation between the concentration of etching products and etching rate

Novel low- k polycyanurates for integrated circuit (IC) metallization

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