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Applications of vaporizable dielectric fluid cooling for IGBT power semiconductors

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2011, p.253-264

Saums, David L

2011

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Recent Developments in CTE-Matched Composite Thermal Materials

IMAPSource Proceedings, 2023-11, Vol.2022 (HiTEN)

Saums, David L.

2023

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Mechanical Cycling Reliability Testing of Thermal Interface Materials for Semiconductor Test

2019 35th Semiconductor Thermal Measurement, Modeling and Management Symposium (SEMI-THERM), 2019, p.38-44

2019

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Developments in selective high thermal conductivity orientation in CTE-compatible substrate and package component materials

Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545), 2004, p.38-45

Saums, D.L.

2004

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Development and application of copper-graphite composite thermal core materials for high reliability RF system PCBs

2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2014, p.247-251

2014

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Development, testing, and application of metallic TIMs for harsh environments and non-flat surfaces

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.1380-1287

2017

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Challenges in thermal interface material testing

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006, p.42-49

2006

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Metallic TIM testing and selection for Harsh environment applications for GaN RF semiconductors

2016 IEEE International Symposium on Phased Array Systems and Technology (PAST), 2016, p.1-9

2016

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Metallic thermal interface material testing and selection for IC, power, and RF semiconductors

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), 2016, p.1-11

2016

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Metallic TIM Testing and Selection for IC, Power, and RF Semiconductors

International Symposium on Microelectronics, 2016-10, Vol.2016 (1), p.490-497

2016

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Cooling of an IGBT Drive System with Vaporizable Dielectric Fluid (VDF)

2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2008, p.9-15

2008

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Metallic TIM Testing and Selection for Harsh Environment Applications for GaN RF Semiconductors

IMAPS other content, 2016, Vol.2016 (HiTEC), p.79-86

2016

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Developments for copper-graphite CTE-matched thermal cores for high-reliability GaN systems

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM), 2016, p.1-3

2016

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Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems

IMAPS other content, 2016, Vol.2016 (HiTEC), p.73-78

2016

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Application of conduction-cooled PCBs and composite materials in an aerospace system

2016 IEEE International Symposium on Phased Array Systems and Technology (PAST), 2016, p.1-9

2016

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Diamond pins utilized as thermal vias for high heat flux spreading in CTE-compatible lids and substrates for semiconductor packaging

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium, 2006, p.162-172

2006

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Demands keep IC packaging in a state of flux

Electronic design, 2004-01, Vol.52 (1), p.78

Saums, David L

2004

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Retooling to meet advanced electronic-system needs

Electronic Design, 2004-01, Vol.52 (1), p.71-72

2004

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Critical assessment of automated flow cytometry data analysis techniques

Nature methods, 2013-03, Vol.10 (3), p.228-238

2013

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Equalization of four cardiovascular risk algorithms after systematic recalibration: individual-participant meta-analysis of 86 prospective studies

European heart journal, 2019-02, Vol.40 (7), p.621-631

2019

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Measures of chronic kidney disease and risk of incident peripheral artery disease: a collaborative meta-analysis of individual participant data

The lancet. Diabetes & endocrinology, 2017-09, Vol.5 (9), p.718-728

2017

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Cardiovascular Risk Factors Associated With Venous Thromboembolism

JAMA cardiology, 2019-02, Vol.4 (2), p.163

2019

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Applications of vaporizable dielectric fluid cooling for IGBT power semiconductors

Recent Developments in CTE-Matched Composite Thermal Materials

Mechanical Cycling Reliability Testing of Thermal Interface Materials for Semiconductor Test

Developments in selective high thermal conductivity orientation in CTE-compatible substrate and package component materials

Development and application of copper-graphite composite thermal core materials for high reliability RF system PCBs

Development, testing, and application of metallic TIMs for harsh environments and non-flat surfaces

Challenges in thermal interface material testing

Metallic TIM testing and selection for Harsh environment applications for GaN RF semiconductors

Metallic thermal interface material testing and selection for IC, power, and RF semiconductors

Metallic TIM Testing and Selection for IC, Power, and RF Semiconductors

Cooling of an IGBT Drive System with Vaporizable Dielectric Fluid (VDF)

Metallic TIM Testing and Selection for Harsh Environment Applications for GaN RF Semiconductors

Developments for copper-graphite CTE-matched thermal cores for high-reliability GaN systems

Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability and High-Temperature RF Systems

Application of conduction-cooled PCBs and composite materials in an aerospace system

Diamond pins utilized as thermal vias for high heat flux spreading in CTE-compatible lids and substrates for semiconductor packaging

Demands keep IC packaging in a state of flux

Retooling to meet advanced electronic-system needs

Adiposity and risk of decline in glomerular filtration rate: meta-analysis of individual participant data in a global consortium

Critical assessment of automated flow cytometry data analysis techniques

Equalization of four cardiovascular risk algorithms after systematic recalibration: individual-participant meta-analysis of 86 prospective studies

Measures of chronic kidney disease and risk of incident peripheral artery disease: a collaborative meta-analysis of individual participant data

Cardiovascular Risk Factors Associated With Venous Thromboembolism

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