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ACS applied materials & interfaces, 2020-02, Vol.12 (6), p.7232-7238
2020
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-08, Vol.7 (8), p.1212-1227
2017
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Microsystems & nanoengineering, 2018-02, Vol.4 (1), p.1-10, Article 1
2018
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Langmuir, 2007-08, Vol.23 (18), p.9128-9133
2007
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2016-07, Vol.6 (7), p.1056-1065
2016
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-08, Vol.9 (8), p.1663-1663
2019
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-10
2022
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Journal of heat transfer, 2014-01, Vol.136 (1)
2014
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Optica, 2022-02, Vol.9 (2), p.251
2022
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International journal of heat and mass transfer, 2010-07, Vol.53 (15), p.3346-3356
2010
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2020-06, Vol.10 (6), p.963-973
2020
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Sensors and actuators. A. Physical., 2001-12, Vol.95 (1), p.8-16
2001
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2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.1296-1306
2019
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.423-430
2021
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Physics of fluids (1994), 1994-06, Vol.6 (6), p.2202-2220
1994
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-04, Vol.2 (4), p.668-676
2012
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2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018, p.653-663
2018
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Bell Labs technical journal, 2010-12, Vol.14 (4), p.61-72
2010
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1030-1035
2024
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Bell Labs technical journal, 2009-09, Vol.14 (3), p.7-19
2009
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13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.466-474
2012
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2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018, p.905-914
2018
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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.678-686
2017
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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.687-695
2017
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2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017, p.667-677
2017
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