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Nanoindentation based method to determine the thermal expansion coefficients of low-k dielectrics
Thin solid films, 2022-10, Vol.759, p.139467, Article 139467
2022
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Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding
Microelectronics and reliability, 2022-11, Vol.138, p.114716, Article 114716
2022
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Modeling of the cyclic behavior of elastic–viscoplastic composites by the additive tangent Mori–Tanaka approach and validation by finite element calculations
International journal of solids and structures, 2015-03, Vol.56-57, p.96-117
2015
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Process Challenges During CVD Oxide Deposition on the Backside of 20-\mu m Thin 300-mm Wafers Temporarily Bonded to Glass Carriers
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1584-1589
2023
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Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications
Microelectronics and reliability, 2014-01, Vol.54 (1), p.204-213
2014
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Application of the continuum shell finite element SHB8PS to sheet forming simulation using an extended large strain anisotropic elastic–plastic formulation
Archive of applied mechanics (1991), 2012-09, Vol.82 (9), p.1269-1290
2012
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Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.340-345
2019
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A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.370-378
2018
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Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, p.1333-1339
2016
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Low Warpage Wafer Level Transfer Molding Post 3D Die to Wafer Assembly
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.843-848
2016
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Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges
2014 International 3D Systems Integration Conference (3DIC), 2014, p.1-7
2014
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An alternative 3D packaging route through wafer reconstruction
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-6
2015
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