UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Modeling of the cyclic behavior of elastic–viscoplastic composites by the additive tangent Mori–Tanaka approach and validation by finite element calculations

International journal of solids and structures, 2015-03, Vol.56-57, p.96-117

2015

Volltextzugriff (PDF)

Estimation of the size of the RVE for isotropic copper polycrystals by using elastic–plastic finite element homogenisation

Computational materials science, 2010-05, Vol.48 (3), p.447-455

2010

Volltextzugriff (PDF)

Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications

Microelectronics and reliability, 2014-01, Vol.54 (1), p.204-213

2014

Volltextzugriff (PDF)

Application of the continuum shell finite element SHB8PS to sheet forming simulation using an extended large strain anisotropic elastic–plastic formulation

Archive of applied mechanics (1991), 2012-09, Vol.82 (9), p.1269-1290

2012

Volltextzugriff (PDF)

Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation

Microelectronic engineering, 2023-03, Vol.271-272, p.111947, Article 111947

2023

Volltextzugriff (PDF)

Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging

2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 2020, p.1-5

2020

Volltextzugriff (PDF)

CTE measurements for 3D package substrates using Digital Image Correlation

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016, p.1-6

2016

Volltextzugriff (PDF)

Die thickness impact on thermo-mechanical stress in 3D packages

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2015, p.1-6

2015

Volltextzugriff (PDF)

Effects of packaging on mechanical stress in 3D-ICs

2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.354-361

2015

Volltextzugriff (PDF)

Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1704-1710

2022

Volltextzugriff (PDF)

Study of the influence of material properties and geometric parameters on warpage for Fan-Out Wafer Level Packaging

2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, p.1-6

2018

Volltextzugriff (PDF)

Finite Element Homogenization for the Determination of the RVE Size for Elastoviscoplastic Polycrystalline Materials

Particle and Continuum Aspects of Mesomechanics, 2007, p.73-82

2007

Volltextzugriff (PDF)

Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation

2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2019, p.1-7

2019

Volltextzugriff (PDF)

Nanoindentation based method to determine the thermal expansion coefficients of low-k dielectrics

Thin solid films, 2022-10, Vol.759, p.139467, Article 139467

2022

Volltextzugriff (PDF)

Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Microelectronics and reliability, 2022-11, Vol.138, p.114716, Article 114716

2022

Volltextzugriff (PDF)

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Journal of electronic packaging, 2017-03, Vol.139 (1)

2017

Volltextzugriff (PDF)

Process Challenges During CVD Oxide Deposition on the Backside of 20-\mu m Thin 300-mm Wafers Temporarily Bonded to Glass Carriers

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1584-1589

2023

Volltextzugriff (PDF)

Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up

2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.340-345

2019

Volltextzugriff (PDF)

A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.370-378

2018

Volltextzugriff (PDF)

Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, p.1333-1339

2016

Volltextzugriff (PDF)

Low Warpage Wafer Level Transfer Molding Post 3D Die to Wafer Assembly

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.843-848

2016

Volltextzugriff (PDF)

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges

2014 International 3D Systems Integration Conference (3DIC), 2014, p.1-7

2014

Volltextzugriff (PDF)

An alternative 3D packaging route through wafer reconstruction

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-6

2015

Volltextzugriff (PDF)

1 – 23 von 23

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(8)
Mit Volltextzugriff
(13)

Publikationsform

Sprache

Englisch
(23)

Erscheinungsjahr

n.n

Thema

Science & Technology
(15)
Technology
(15)
Engineering
(12)
Engineering, Electrical & Electronic
(11)
Warpage
(9)
Finite Element Analysis
(8)
Finite Element Method
(6)
Physics
(6)
Stacking
(6)
Mathematical Models
(5)
Physical Sciences
(5)
Silicon
(5)
Substrates
(5)
Temperature Measurement
(5)
Bonding
(4)
Fan-Out
(4)
Mathematical Analysis
(4)
Physics, Applied
(4)
Three-Dimensional Displays
(4)
Wafers
(4)

15 weitere anzeigen...

Weniger anzeigen...

Zeitschrift / Serie

2 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Modeling of the cyclic behavior of elastic–viscoplastic composites by the additive tangent Mori–Tanaka approach and validation by finite element calculations

Estimation of the size of the RVE for isotropic copper polycrystals by using elastic–plastic finite element homogenisation

Reliability of thermally stressed rigid–flex printed circuit boards for High Density Interconnect applications

Application of the continuum shell finite element SHB8PS to sheet forming simulation using an extended large strain anisotropic elastic–plastic formulation

Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation

Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging

CTE measurements for 3D package substrates using Digital Image Correlation

Die thickness impact on thermo-mechanical stress in 3D packages

Effects of packaging on mechanical stress in 3D-ICs

Investigating moisture diffusion in Mold Compounds (MCs) for Fan-Out-Wafer-Level-Packaging (FOWLP)

Study of the influence of material properties and geometric parameters on warpage for Fan-Out Wafer Level Packaging

Finite Element Homogenization for the Determination of the RVE Size for Elastoviscoplastic Polycrystalline Materials

Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation

Nanoindentation based method to determine the thermal expansion coefficients of low-k dielectrics

Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Process Challenges During CVD Oxide Deposition on the Backside of 20-\mu m Thin 300-mm Wafers Temporarily Bonded to Glass Carriers

Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up

A Novel Fan-Out Concept for Ultra-High Chip-to-Chip Interconnect Density with 20-µm Pitch

Thermal characterization of the inter-die thermal resistance of hybrid Cu/dielectric wafer-to-wafer bonding

Low Warpage Wafer Level Transfer Molding Post 3D Die to Wafer Assembly

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges

An alternative 3D packaging route through wafer reconstruction

Suchergebnisse filtern