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1, 2021
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Micromachines (Basel), 2023-12, Vol.15 (1), p.69
2023
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Scientific reports, 2018-12, Vol.8 (1), p.18031-11, Article 18031
2018
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IEEE access, 2020, Vol.8, p.35455-35468
2020
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Japanese Journal of Applied Physics, 2010-06, Vol.49 (6), p.06GN12-06GN12-4
2010
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IEEJ transactions on electrical and electronic engineering, 2009-05, Vol.4 (3), p.339-344
2009
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1213-1218
2023
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2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2011, p.125-130
2011
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2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012, p.8-13
2012
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2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2010, p.25-32
2010
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IEEE transactions on electronics packaging manufacturing, 2010-07, Vol.33 (3), p.212-220
2010
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-05, Vol.11 (5), p.875-878
2021
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IEEJ transactions on electrical and electronic engineering, 2009-05, Vol.4 (3), p.339-344
2009
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IEEE sensors journal, 2019-09, Vol.19 (18), p.7868-7874
2019
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1175-1180
- Chen, Qianwen
- Belyansky, Michael
- Sulehria, Yasir
- Horibe, Akihiro
- Qin, Liqiao
- Pujari, Ruturaj
- Perfecto, Eric
- Lie, Fee Li
- Butt, Shahid
- Polomoff, Nick
- Miyazawa, Risa
- Kohara, Sayuri
- Farooq, Mukta
- Hisada, Takashi
- Oakley, Jennifer
- Skordas, Spyridon
- Fan, Susan
- Sakuma, Katsuyuki
- Knickerbocker, John
- Mcherron, Dale
- Tamura, Takeshi
- Ishii, Takayuki
- Jaipan, Panupong
- Nishimura, Satoshi
- Son, Ilseok
- Maeda, Yohei
- Koga, Takashi
- Klein, Joseph
- Tashiro, Kei
- Arkalgud, Sitaram
- Kondo, Yoshihiro
2023
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-04, Vol.13 (4), p.1-1
2023
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2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.318-324
2015
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Japanese Journal of Applied Physics, 1998, Vol.37 (Part 1, No. 3B), p.1217-1221
1998
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Japanese Journal of Applied Physics, 2000, Vol.39 (Part 1, No. 4B), p.2473-2477
2000
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3D Integration in VLSI Circuits, 2018, p.117-143
1, 2018
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-05, Vol.4 (5), p.762-768
2014
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Journal of micromechanics and microengineering, 2011-03, Vol.21 (3), p.035024
2011
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Japanese Journal of Applied Physics, 1999, Vol.38 (Part 1, No. 4B), p.2406-2410
1999
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Journal of the Japan Society for Precision Engineering, 2013/08/05, Vol.79(8), pp.714-718
2013
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