UB Paderborn / Katalog / Suche / in CDI

1 – 25 von 206

Sortiert nach

Thermoelastic damping in micro-scale circular plate resonators

Journal of sound and vibration, 2010-02, Vol.329 (3), p.328-337

2010

Volltextzugriff (PDF)

Morphology control of hybrid Cu–Cu2O nanostructures fabricated by electrochemical migration

Materials letters, 2019-02, Vol.236, p.420-423

2019

Volltextzugriff (PDF)

Suitable passivation thickness on a metal line to prevent electromigration damage

Materials letters, 2016-12, Vol.184, p.219-222

2016

Volltextzugriff (PDF)

Fabrication of large-scale Ag micro/nanostructures using electrochemical migration

Micro & nano letters, 2018-07, Vol.13 (7), p.923-926

2018

Volltextzugriff (PDF)

Controlling surface morphology of Sn thin-film to enhance cycling performance in lithium ion batteries

Materials research bulletin, 2017-03, Vol.87, p.155-160

2017

Volltextzugriff (PDF)

Growth of Ag micro/nanoparticles using stress migration from multilayered metallic structure

Applied surface science, 2015-10, Vol.351, p.1011-1015

2015

Volltextzugriff (PDF)

Simplified processes using conductive passivation film for the fabrication of Al micro-wires by electromigration

Materials letters, 2014-02, Vol.116, p.278-281

2014

Volltextzugriff (PDF)

Characterization of the electrical and thermal properties of a metallic thin-film line

Microsystem technologies : sensors, actuators, systems integration, 2018-09, Vol.24 (9), p.3907-3913

2018

Volltextzugriff (PDF)

Buried structure for increasing fabrication performance of micromaterial by electromigration

Japanese Journal of Applied Physics, 2016-06, Vol.55 (6S1), p.6-06GH01

2016

Volltextzugriff (PDF)

Analysis of the temperature field near a corner composed of dissimilar metals subjected to a current flow

International journal of heat and mass transfer, 2012-10, Vol.55 (21-22), p.6090-6096

2012

Volltextzugriff (PDF)

Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders

Journal of electronic materials, 2014-11, Vol.43 (11), p.4179-4185

2014

Volltextzugriff (PDF)

Forming long Ag thin wires by using stress migration

Materials letters, 2016-05, Vol.171, p.72-74

2016

Volltextzugriff (PDF)

Influence of a hot and humid environment on thermal transport across the interface between a Ag thin-film line and a substrate

Applied surface science, 2016-04, Vol.368, p.267-271

2016

Volltextzugriff (PDF)

Diffusion–fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing

Materials letters, 2012-07, Vol.79, p.139-141

2012

Volltextzugriff (PDF)

Theoretical consideration of electromigration damage around a right-angled corner in a passivated line composed of dissimilar metals

Microsystem technologies : sensors, actuators, systems integration, 2017-10, Vol.23 (10), p.4523-4530

2017

Volltextzugriff (PDF)

Influence of local thermal dissipation on electromigration in an Al thin-film line

Microelectronics and reliability, 2016-10, Vol.65, p.178-183

2016

Volltextzugriff (PDF)

Controlling Ag whisker growth using very thin metallic films

Scripta materialia, 2010-08, Vol.63 (3), p.289-292

2010

Volltextzugriff (PDF)

Rapid and mass growth of stress-induced nanowhiskers on the surfaces of evaporated polycrystalline Cu films

Scripta materialia, 2007-06, Vol.56 (12), p.1031-1034

2007

Volltextzugriff (PDF)

Growth of copper microflowers assisted by electromigration under a low current density and subsequent stress-induced migration

Materials letters, 2012-07, Vol.79, p.270-272

2012

Volltextzugriff (PDF)

Comparison of stress migration and electromigration in the fabrication of thin Al wires

Thin solid films, 2012-02, Vol.520 (9), p.3448-3452

2012

Volltextzugriff (PDF)

Numerical analysis of the electrical failure of a metallic nanowire mesh due to Joule heating

Nanoscale research letters, 2013-08, Vol.8 (1), p.370-370, Article 370

2013

Volltextzugriff (PDF)

Consistent melting behavior induced by Joule heating between Ag microwire and nanowire meshes

Nanoscale research letters, 2014-05, Vol.9 (1), p.239-239, Article 239

2014

Volltextzugriff (PDF)

Fabrication of Multiple Al Micro-Materials by Electromigration Using a Comb Pattern and a Conductive Passivation Film

Advanced materials research, 2014-03, Vol.909, p.36-40

2014

Volltextzugriff (PDF)

Fabrication of aluminum microwires through artificial weak spots in a thick film using stress-induced migration

AIMS materials science, 2018-01, Vol.5 (4), p.591-602

2018

Volltextzugriff (PDF)

Analyzing electromigration near a right-angled corner composed of dissimilar metals by investigating the effect of material combination on atomic flux divergence

Japanese Journal of Applied Physics, 2014-07, Vol.53 (7), p.75504-1-075504-7

2014

Volltextzugriff (PDF)

1 – 25 von 206

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(102)
Mit Volltextzugriff
(205)

Publikationsform

Artikel
(201)
Tagungsberichte
(5)

Sprache

Englisch
(171)
Japanisch
(146)

Erscheinungsjahr

n.n

Thema

Science & Technology
(91)
Technology
(75)
Physics
(63)
Materials Science
(55)
Physical Sciences
(47)
Physics, Applied
(45)
Materials Science, Multidisciplinary
(43)
Engineering
(35)
Exact Sciences And Technology
(30)
Condensed Matter Physics
(24)
Fracture
(23)
Electromigration
(21)
General Materials Science
(18)
Nondestructive Inspection
(17)
Engineering, Electrical & Electronic
(16)
Engineering, Mechanical
(16)
Mechanical Engineering
(16)
Applied Sciences
(14)
Mechanics Of Materials
(14)
Fundamental Areas Of Phenomenology
(13)

15 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Thermoelastic damping in micro-scale circular plate resonators

Morphology control of hybrid Cu–Cu2O nanostructures fabricated by electrochemical migration

Suitable passivation thickness on a metal line to prevent electromigration damage

Fabrication of large-scale Ag micro/nanostructures using electrochemical migration

Controlling surface morphology of Sn thin-film to enhance cycling performance in lithium ion batteries

Growth of Ag micro/nanoparticles using stress migration from multilayered metallic structure

Simplified processes using conductive passivation film for the fabrication of Al micro-wires by electromigration

Characterization of the electrical and thermal properties of a metallic thin-film line

Buried structure for increasing fabrication performance of micromaterial by electromigration

Analysis of the temperature field near a corner composed of dissimilar metals subjected to a current flow

Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders

Forming long Ag thin wires by using stress migration

Influence of a hot and humid environment on thermal transport across the interface between a Ag thin-film line and a substrate

Diffusion–fatigue interaction effect on hillock formation in aluminum thin films under thermal cycle testing

Theoretical consideration of electromigration damage around a right-angled corner in a passivated line composed of dissimilar metals

Influence of local thermal dissipation on electromigration in an Al thin-film line

Controlling Ag whisker growth using very thin metallic films

Rapid and mass growth of stress-induced nanowhiskers on the surfaces of evaporated polycrystalline Cu films

Growth of copper microflowers assisted by electromigration under a low current density and subsequent stress-induced migration

Comparison of stress migration and electromigration in the fabrication of thin Al wires

Numerical analysis of the electrical failure of a metallic nanowire mesh due to Joule heating

Consistent melting behavior induced by Joule heating between Ag microwire and nanowire meshes

Fabrication of Multiple Al Micro-Materials by Electromigration Using a Comb Pattern and a Conductive Passivation Film

Fabrication of aluminum microwires through artificial weak spots in a thick film using stress-induced migration

Analyzing electromigration near a right-angled corner composed of dissimilar metals by investigating the effect of material combination on atomic flux divergence

Suchergebnisse filtern