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Synthesis and Characterization of Polymer Electrolyte Using Deep Eutectic Solvents and Electrospun Poly(vinyl alcohol) Membrane

Industrial & engineering chemistry research, 2016-08, Vol.55 (30), p.8341-8348

2016

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High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Journal of electronic materials, 2012-09, Vol.41 (9), p.2631-2658

2012

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Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012-08, Vol.551, p.160-168

2012

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A review on thermoelectric renewable energy: Principle parameters that affect their performance

Renewable & sustainable energy reviews, 2014-02, Vol.30, p.337-355

2014

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Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing

Journal of electronic materials, 2013-03, Vol.42 (3), p.470-484

2013

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Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloy

Soldering & surface mount technology, 2012-01, Vol.24 (4), p.257-266

2012

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Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

Journal of electronic materials, 2012-08, Vol.41 (8), p.2073-2082

2012

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The bulk alloy microstructure and mechanical properties of Sn–1Ag–0.5Cu–xAl solders (x = 0, 0.1 and 0.2 wt. %)

Journal of materials science. Materials in electronics, 2012-11, Vol.23 (11), p.1988-1997

2012

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The viability of alternative and nontoxic chlorine containing compounds for thermal treatment of ultrathin CdTe (≤1.0 μm) films

International journal of energy research, 2021-07, Vol.45 (9), p.13771-13785

2021

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Effects of aging on Sn-1Ag-0.5Cu solder alloys containing 0.1 wt.% and 0.5 wt.% Al

Journal of alloys and compounds, 2014-01, Vol.582, p.437-446

2014

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Microstructural stability of Sn–1Ag–0.5Cu–xAl (x=1, 1.5, and 2wt.%) solder alloys and the effects of high-temperature aging on their mechanical properties

Materials characterization, 2013-04, Vol.78, p.129-143

2013

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Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn–1Ag–0.5Cu solder alloys

Journal of alloys and compounds, 2015-02, Vol.622, p.184-188

2015

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Novel Fe-containing Sn–1Ag–0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products

Microelectronics and reliability, 2012-11, Vol.52 (11), p.2701-2708

2012

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Enhance protection of electronic appliances through multivariate modelling and optimization of ceramic core materials in varistor devices

RSC advances, 2015-01, Vol.5 (27), p.21384-21395

2015

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Interfacial reactions between Cu substrate and Sn–1Ag–0.5Cu solder containing 0.1 wt% Al by dipping method

Journal of materials science. Materials in electronics, 2015-10, Vol.26 (10), p.8229-8239

2015

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SYNTHESIS OF Cu2ZnSnS4 BY MECHANICAL ALLOYING METHOD FOR THERMOELECTRIC APPLICATION

Acta Metallurgica Slovaca (Online), 2019-01, Vol.25 (3), p.174-179

2019

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Enhancement of electronic protection to reduce e-waste

Journal of Industrial and Engineering Chemistry, 2015, 29(0), , pp.400-407

2015

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Effects of aging on Sn–1Ag–0.5Cu solder alloys containing 0.1wt.% and 0.5wt.% Al

Journal of alloys and compounds, 2014-01, Vol.582, p.437-446

2014

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Scheduling the blended solution as industrial CO2 absorber in separation process by back-propagation artificial neural networks

Spectrochimica acta. Part A, Molecular and biomolecular spectroscopy, 2015-11, Vol.150, p.892-901

2015

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Study on coarsening of Ag sub(3)Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys

Journal of alloys and compounds, 2015-02, Vol.622, p.184-188

2015

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CHARACTERISATION OF COPPER NANOPARTICLE INK PRINTED FSS FOR CELLULAR SIGNALS SUPPRESSION

Progress in electromagnetics research. Letters, 2016, Vol.60, p.101-106

2016

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Electrical Resistivity of Fe-Bearing Sn1Ag0.5Cu Lead-Free Solder Alloys

Advanced materials research, 2014-02, Vol.895, p.575-579

2014

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Electro-Optic Potential of Room and High Temperature Polymer Stabilised Blue Phase Liquid Crystal

Advanced materials research, 2014-02, Vol.895, p.186-189

2014

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Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods

Procedia technology, 2015, Vol.20, p.9-14

2015

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Conductivity Studies on the Effect of a Nematic Liquid Crystal on Polyvinyl Alcohol-Based Electrolytes

Advanced materials research, 2014-02, Vol.895, p.142-146

2014

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Synthesis and Characterization of Polymer Electrolyte Using Deep Eutectic Solvents and Electrospun Poly(vinyl alcohol) Membrane

High-Reliability Low-Ag-Content Sn-Ag-Cu Solder Joints for Electronics Applications

Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications

A review on thermoelectric renewable energy: Principle parameters that affect their performance

Effect of Ag Content and the Minor Alloying Element Fe on the Mechanical Properties and Microstructural Stability of Sn-Ag-Cu Solder Alloy Under High-Temperature Annealing

Effect of minor additions of Fe on bulk alloy microstructure and tensile properties of the low Ag-content Sn-1Ag-0.5Cu solder alloy

Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

The bulk alloy microstructure and mechanical properties of Sn–1Ag–0.5Cu–xAl solders (x = 0, 0.1 and 0.2 wt. %)

The viability of alternative and nontoxic chlorine containing compounds for thermal treatment of ultrathin CdTe (≤1.0 μm) films

Effects of aging on Sn-1Ag-0.5Cu solder alloys containing 0.1 wt.% and 0.5 wt.% Al

Microstructural stability of Sn–1Ag–0.5Cu–xAl (x=1, 1.5, and 2wt.%) solder alloys and the effects of high-temperature aging on their mechanical properties

Study on coarsening of Ag3Sn intermetallic compound in the Fe-modified Sn–1Ag–0.5Cu solder alloys

Novel Fe-containing Sn–1Ag–0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products

Enhance protection of electronic appliances through multivariate modelling and optimization of ceramic core materials in varistor devices

Interfacial reactions between Cu substrate and Sn–1Ag–0.5Cu solder containing 0.1 wt% Al by dipping method

SYNTHESIS OF Cu2ZnSnS4 BY MECHANICAL ALLOYING METHOD FOR THERMOELECTRIC APPLICATION

Enhancement of electronic protection to reduce e-waste

Effects of aging on Sn–1Ag–0.5Cu solder alloys containing 0.1wt.% and 0.5wt.% Al

Scheduling the blended solution as industrial CO2 absorber in separation process by back-propagation artificial neural networks

Study on coarsening of Ag sub(3)Sn intermetallic compound in the Fe-modified Sn-1Ag-0.5Cu solder alloys

CHARACTERISATION OF COPPER NANOPARTICLE INK PRINTED FSS FOR CELLULAR SIGNALS SUPPRESSION

Electrical Resistivity of Fe-Bearing Sn1Ag0.5Cu Lead-Free Solder Alloys

Electro-Optic Potential of Room and High Temperature Polymer Stabilised Blue Phase Liquid Crystal

Wetting Characteristics of Al-containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate using Wetting Balance and Spread area Methods

Conductivity Studies on the Effect of a Nematic Liquid Crystal on Polyvinyl Alcohol-Based Electrolytes

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