UB Paderborn / Katalog / Suche / in CDI

Identification of RC networks by deconvolution: chances and limits

IEEE transactions on circuits and systems. 1, Fundamental theory and applications, 1998-03, Vol.45 (3), p.244-258

Szekely, V.

1998

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IEEE_Xplore

Courses of Action to Optimize Heavy Bearings Cages

IOP conference series. Materials Science and Engineering, 2016-11, Vol.161 (1), p.12008

Szekely, V G

2016

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Enhancing reliability with thermal transient testing

Microelectronics and reliability, 2002-04, Vol.42 (4), p.629-640

Szekely, V

2002

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Heavy Bearings Exploitation Energy and Reduction Methods

IOP conference series. Materials Science and Engineering, 2016-11, Vol.161 (1), p.12009

2016

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A new Early Bronze Age wagon model from the Carpathian Basin

World archaeology, 2011-12, Vol.43 (4), p.538-553

2011

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Thermal Measurement and Modeling of Multi-Die Packages

IEEE transactions on components and packaging technologies, 2009-06, Vol.32 (2), p.484-492

2009

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IEEE_Xplore

Blind tracing of mechanical movement in electrostatic MEMS structures

Analog integrated circuits and signal processing, 2012-04, Vol.71 (1), p.11-20

2012

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Measuring partial thermal resistances in a heat-flow path

IEEE transactions on components and packaging technologies, 2002-12, Vol.25 (4), p.547-553

2002

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IEEE_Xplore

Contactless thermal characterization of high temperature test chamber

Microsystem technologies : sensors, actuators, systems integration, 2009-08, Vol.15 (8), p.1279-1285

2009

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Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities

Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2002, p.15-20

2002

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IEEE_Xplore

Studies on the nonlinearity effects in dynamic compact model generation of packages

IEEE transactions on components and packaging technologies, 2004-03, Vol.27 (1), p.124-130

2004

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IEEE_Xplore

Heat-flux sensor to support transient thermal characterisation of IC packages

Sensors and actuators. A. Physical., 2004-10, Vol.116 (2), p.284-292

2004

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CMOS sensors for on-line thermal monitoring of VLSI circuits

IEEE transactions on very large scale integration (VLSI) systems, 1997-09, Vol.5 (3), p.270-276

1997

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IEEE_Xplore

Dynamic thermal multiport modeling of IC packages

IEEE transactions on components and packaging technologies, 2001-12, Vol.24 (4), p.596-604

2001

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IEEE_Xplore

Electro-thermal and logi-thermal simulation of VLSI designs

IEEE transactions on very large scale integration (VLSI) systems, 1997-09, Vol.5 (3), p.258-269

1997

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IEEE_Xplore

Thermal dynamics and the time constant domain

IEEE transactions on components and packaging technologies, 2000-09, Vol.23 (3), p.587-594

2000

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IEEE_Xplore

Increasing the accuracy of thermal transient measurements

IEEE transactions on components and packaging technologies, 2002-12, Vol.25 (4), p.539-546

2002

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IEEE_Xplore

Increasing the accuracy of structure function based thermal material parameter measurements

IEEE transactions on components and packaging technologies, 2005-03, Vol.28 (1), p.51-57

2005

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IEEE_Xplore

A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

IEEE transactions on components and packaging technologies, 2007-09, Vol.30 (3), p.367-374

2007

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IEEE_Xplore

Partial mummification and extraordinary context observed in perinate burials: a complex osteoarcheological study applying ICP-AES, μXRF, and macromorphological methods

Archaeological and anthropological sciences, 2018-04, Vol.10 (3), p.685-695

2018

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Evaluation of short pulse and short time thermal transient measurements

Microelectronics, 2010-09, Vol.41 (9), p.560-565

Szekely, V

2010

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Inclusion of RC compact models of packages into board level thermal simulation tools

Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2002, p.71-76

2002

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IEEE_Xplore

Foreword THERMINIC Special Section

IEEE transactions on components and packaging technologies, 2005-12, Vol.28 (4), p.591-592

2005

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IEEE_Xplore

Transient thermal characterisation of hot plates

Microsystem technologies, 2005-12, Vol.12 (1-2), p.154-159

2005

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THERMODEL: A tool for thermal model generation, and application for MEMS

Analog integrated circuits and signal processing, 2001-10, Vol.29 (1-2), p.49-59

2001

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Identification of RC networks by deconvolution: chances and limits

Courses of Action to Optimize Heavy Bearings Cages

Enhancing reliability with thermal transient testing

Heavy Bearings Exploitation Energy and Reduction Methods

A new Early Bronze Age wagon model from the Carpathian Basin

Thermal Measurement and Modeling of Multi-Die Packages

Blind tracing of mechanical movement in electrostatic MEMS structures

Measuring partial thermal resistances in a heat-flow path

Contactless thermal characterization of high temperature test chamber

Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities

Studies on the nonlinearity effects in dynamic compact model generation of packages

Heat-flux sensor to support transient thermal characterisation of IC packages

CMOS sensors for on-line thermal monitoring of VLSI circuits

Dynamic thermal multiport modeling of IC packages

Electro-thermal and logi-thermal simulation of VLSI designs

Thermal dynamics and the time constant domain

Increasing the accuracy of thermal transient measurements

Increasing the accuracy of structure function based thermal material parameter measurements

A Methodology for the Co-Simulation of Dynamic Compact Models of Packages With the Detailed Models of Boards

Partial mummification and extraordinary context observed in perinate burials: a complex osteoarcheological study applying ICP-AES, μXRF, and macromorphological methods

Evaluation of short pulse and short time thermal transient measurements

Inclusion of RC compact models of packages into board level thermal simulation tools

Foreword THERMINIC Special Section

Transient thermal characterisation of hot plates

THERMODEL: A tool for thermal model generation, and application for MEMS

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