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Scientific Bulletin. Series C, Electrical Engineering and Computer Science, 2020-01 (2), p.190
2020
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Scientific Bulletin. Series C, Electrical Engineering and Computer Science, 2020-01 (4), p.161
2020
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Innovative Security Solutions for Information Technology and Communications, p.209-224
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2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2023, p.173-176
2023

2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2020, p.314-317
2020

Scientific Bulletin. Series C, Electrical Engineering and Computer Science, 2023-01 (2), p.245
2023
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2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2019, p.304-307
2019

2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2020, p.211-214
2020

2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2019, p.106-109
2019

2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging​ (SIITME), 2018, p.23-30
2018
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, p.585-588
2022
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2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging​ (SIITME), 2018, p.161-164
2018
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2021 IEEE Global Engineering Education Conference (EDUCON), 2021, p.1443-1448
2021

2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2023, p.194-198
2023

2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2023, p.189-193
2023

2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2021, p.77-80
2021

Scientific Bulletin. Series C, Electrical Engineering and Computer Science, 2018-01 (2), p.97
2018
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2023 46th International Spring Seminar on Electronics Technology (ISSE), 2023, p.1-5
2023
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2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2022, p.209-213
2022

2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), 2022, p.504-508
2022
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2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME), 2023, p.142-146
2023

2020 43rd International Spring Seminar on Electronics Technology (ISSE), 2020, p.1-6
2020
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