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A review of mechanical properties of lead-free solders for electronic packaging

Journal of materials science, 2009-03, Vol.44 (5), p.1141-1158

2009

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Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging

Microelectronics and reliability, 2016-01, Vol.56, p.136-147

2016

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Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint

Journal of electronic materials, 2021, Vol.50 (1), p.233-248

2021

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Size Effects on Overall Deformation Behavior of SAC Samples

2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-6

2023

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First-Order Piezoresistive Coefficients of Lateral NMOS FETs on 4H Silicon Carbide

IEEE sensors journal, 2019-08, Vol.19 (15), p.6037-6045

2019

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First- and Second-Order Piezoresistive Coefficients of CMOS FETs From Strong Into Weak Inversion

IEEE sensors journal, 2019-12, Vol.19 (23), p.11309-11317

2019

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Evolution of the Creep Response of SAC305 Solder Due to Mechanical Cycling

2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-7

2023

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Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation

Journal of materials science. Materials in electronics, 2017-09, Vol.28 (18), p.13496-13506

2017

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Modeling Deformation Behavior of Multiple Grained SAC305 Solder Joints

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.1221-1228

2020

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Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

Journal of electronic packaging, 2018-12, Vol.140 (4)

2018

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Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

Materials, 2017-04, Vol.10 (5), p.451

2017

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CMOS Sensor Arrays for High Resolution Die Stress Mapping in Packaged Integrated Circuits

IEEE sensors journal, 2013-06, Vol.13 (6), p.2066-2076

2013

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Nanomechanical Characterization of Various Materials within PBGA Packages Subjected to Thermal Cycling Loading

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.1302-1310

2020

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Silicon piezoresistive stress sensors and their application in electronic packaging

IEEE sensors journal, 2001-06, Vol.1 (1), p.14-30

2001

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The Effects of Thermal Exposure on the Creep Behavior of SAC+Bi Lead-Free Solders

2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-7

2023

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Effect of Different Thermal Cycling Profiles on the Mechanical Behavior of SAC305 Lead Free Solder

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.1170-1179

2020

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Measurement of the Temperature Dependence of the Piezoresistive Coefficients of 4H Silicon Carbide

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.1296-1301

2020

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Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333]

Journal of electronic packaging, 2018-03, Vol.140 (1)

2018

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Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From 150\,^C to 125\,^C

IEEE sensors journal, 2008-08, Vol.8 (8), p.1455-1468

2008

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Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Journal of electronic packaging, 2014-12, Vol.136 (4)

2014

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Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.1211-1220

2020

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Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.1180-1190

2020

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Sound Attenuation Study of Micro-Scale Acoustic Package

International journal of acoustics and vibration, 2020-06, Vol.25 (2), p.133-140

2020

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Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.1250-1256

2021

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Microstructural Evolution of SAC305 BGA Joints during Extreme High Temperature Aging

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.1201-1210

2020

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A review of mechanical properties of lead-free solders for electronic packaging

Experimental determination of fatigue behavior of lead free solder joints in microelectronic packaging subjected to isothermal aging

Impact of Mechanical Property Degradation and Intermetallic Compound Formation on Electromigration-Oriented Failure of a Flip-Chip Solder Joint

Size Effects on Overall Deformation Behavior of SAC Samples

First-Order Piezoresistive Coefficients of Lateral NMOS FETs on 4H Silicon Carbide

First- and Second-Order Piezoresistive Coefficients of CMOS FETs From Strong Into Weak Inversion

Evolution of the Creep Response of SAC305 Solder Due to Mechanical Cycling

Effects of high temperature aging on the microstructural evolution and mechanical behavior of SAC305 solder joints using synchrotron X-ray microdiffraction and nanoindentation

Modeling Deformation Behavior of Multiple Grained SAC305 Solder Joints

Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

CMOS Sensor Arrays for High Resolution Die Stress Mapping in Packaged Integrated Circuits

Nanomechanical Characterization of Various Materials within PBGA Packages Subjected to Thermal Cycling Loading

Silicon piezoresistive stress sensors and their application in electronic packaging

The Effects of Thermal Exposure on the Creep Behavior of SAC+Bi Lead-Free Solders

Effect of Different Thermal Cycling Profiles on the Mechanical Behavior of SAC305 Lead Free Solder

Measurement of the Temperature Dependence of the Piezoresistive Coefficients of 4H Silicon Carbide

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333]

Characterization of the Temperature Dependence of the Piezoresistive Coefficients of Silicon From 150\,^C to 125\,^C

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Cyclic Stress-Strain and Constitutive Behaviors of SAC-Bi-Ni-Sb Solder Alloys During Fatigue Testing

Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling

Sound Attenuation Study of Micro-Scale Acoustic Package

Insights into the Mechanical Properties of SnAgCu Based Solder Materials Including Void Effects: An Atomistic Study

Microstructural Evolution of SAC305 BGA Joints during Extreme High Temperature Aging

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