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Electrothermal Simulation of Self-Heating in DMOS Transistors up to Thermal Runaway

IEEE transactions on electron devices, 2013-02, Vol.60 (2), p.699-707

2013

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Automotive 130 nm smart-power-technology including embedded flash functionality

2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs, 2011, p.20-23

2011

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Direct Writing of Fiber Bragg Grating in Microstructured Polymer Optical Fiber

IEEE photonics technology letters, 2012-07, Vol.24 (13), p.1148-1150

2012

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On the Origin of Thermal Runaway in a Trench Power MOSFET

IEEE transactions on electron devices, 2011-10, Vol.58 (10), p.3477-3484

2011

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Terahertz quasi-time-domain spectroscopy imaging

Applied Optics, 2011-05, Vol.50 (13), p.1884

2011

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Electrothermal Simulation of Self-Heating in DMOS Transistors up to Thermal Runaway : ADVANCED MODELING OF POWER DEVICES AND THEIR APPLICATIONS

IEEE transactions on electron devices, 2013, Vol.60 (2), p.699-707

2013

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Power-cycling of DMOS-switches triggers thermo-mechanical failure mechanisms

ESSDERC 2007 - 37th European Solid State Device Research Conference, 2007, p.139-142

2007

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Avalanche Breakdown Delay in ESD Protection Diodes

IEEE transactions on electron devices, 2010-10, Vol.57 (10), p.2470-2476

2010

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High voltage robustness of mold compounds under different environmental conditions

2015 IEEE International Reliability Physics Symposium, 2015, p.CP.5.1-CP.5.6

2015

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Experimental and Theoretical Analyses of the Electrical SOA of Rugged p-Channel LDMOS

IEEE electron device letters, 2010-12, Vol.31 (12), p.1440-1442

2010

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Hybrid continuous wave terahertz spectroscopy

Optics express, 2010-07, Vol.18 (15), p.15887-15892

2010

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Accurate Temperature Measurements of DMOS Power Transistors up to Thermal Runaway by Small Embedded Sensors

IEEE transactions on semiconductor manufacturing, 2012-08, Vol.25 (3), p.294-302

2012

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On-wafer measurement of the reverse-recovery time of integrated diodes by Transmission-Line-Pulsing (TLP)

Microelectronics and reliability, 2011-08, Vol.51 (8), p.1309-1314

2011

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Enhancement of the Electrical Safe Operating Area of Integrated DMOS Transistors With Respect to High-Energy Short Duration Pulses

IEEE transactions on electron devices, 2010-11, Vol.57 (11), p.3044-3049

2010

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Measurement and Simulation of Self-Heating in DMOS Transistors up to Very High Temperatures

2008 20th International Symposium on Power Semiconductor Devices and IC's, 2008, p.209-212

2008

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Measurement and modeling of the electron impact-ionization coefficient in silicon up to very high temperatures

IEEE transactions on electron devices, 2005-10, Vol.52 (10), p.2290-2299

2005

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Key Technologies for System-Integration in the Automotive and IndustrialApplications

IEEE transactions on power electronics, 2005-05, Vol.20 (3), p.537

2005

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Quantitative internal thermal energy mapping of semiconductor devices under short current stress using backside laser interferometry

IEEE transactions on electron devices, 2002-11, Vol.49 (11), p.2070-2079

2002

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Small embedded sensors for accurate temperature measurements in DMOS power transistors

2010 International Conference on Microelectronic Test Structures (ICMTS), 2010, p.3-7

2010

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A failure levels study of non-snapback ESD devices for automotive applications

2010 IEEE International Reliability Physics Symposium, 2010, p.458-465

2010

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Polymeric THz 2D Photonic Crystal Filters Fabricated by Fiber Drawing

IEEE transactions on terahertz science and technology, 2012-03, Vol.2 (2), p.203-207

2012

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Investigation and improvement of DMOS switches under fast electro-thermal cycle stress

Solid-state electronics, 2008-09, Vol.52 (9), p.1353-1358

2008

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Last Metal Copper Metallization for Power Devices : Advanced semiconductor manufacturing conference

IEEE transactions on semiconductor manufacturing, 2008, Vol.21 (3), p.358-362

2008

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Key technologies for system-integration in the automotive and Industrial Applications

IEEE transactions on power electronics, 2005-05, Vol.20 (3), p.537-549

2005

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Last Metal Copper Metallization for Power Devices

IEEE transactions on semiconductor manufacturing, 2008-08, Vol.21 (3), p.358-362

2008

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Electrothermal Simulation of Self-Heating in DMOS Transistors up to Thermal Runaway

Automotive 130 nm smart-power-technology including embedded flash functionality

Direct Writing of Fiber Bragg Grating in Microstructured Polymer Optical Fiber

On the Origin of Thermal Runaway in a Trench Power MOSFET

Terahertz quasi-time-domain spectroscopy imaging

Electrothermal Simulation of Self-Heating in DMOS Transistors up to Thermal Runaway : ADVANCED MODELING OF POWER DEVICES AND THEIR APPLICATIONS

Power-cycling of DMOS-switches triggers thermo-mechanical failure mechanisms

Avalanche Breakdown Delay in ESD Protection Diodes

High voltage robustness of mold compounds under different environmental conditions

Experimental and Theoretical Analyses of the Electrical SOA of Rugged p-Channel LDMOS

Hybrid continuous wave terahertz spectroscopy

Accurate Temperature Measurements of DMOS Power Transistors up to Thermal Runaway by Small Embedded Sensors

On-wafer measurement of the reverse-recovery time of integrated diodes by Transmission-Line-Pulsing (TLP)

Enhancement of the Electrical Safe Operating Area of Integrated DMOS Transistors With Respect to High-Energy Short Duration Pulses

Measurement and Simulation of Self-Heating in DMOS Transistors up to Very High Temperatures

Measurement and modeling of the electron impact-ionization coefficient in silicon up to very high temperatures

Key Technologies for System-Integration in the Automotive and IndustrialApplications

Quantitative internal thermal energy mapping of semiconductor devices under short current stress using backside laser interferometry

Small embedded sensors for accurate temperature measurements in DMOS power transistors

A failure levels study of non-snapback ESD devices for automotive applications

Polymeric THz 2D Photonic Crystal Filters Fabricated by Fiber Drawing

Investigation and improvement of DMOS switches under fast electro-thermal cycle stress

Last Metal Copper Metallization for Power Devices : Advanced semiconductor manufacturing conference

Key technologies for system-integration in the automotive and Industrial Applications

Last Metal Copper Metallization for Power Devices

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