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Phenolic Compounds in Extracts of Hibiscus acetosella (Cranberry Hibiscus) and Their Antioxidant and Antibacterial Properties

Molecules (Basel, Switzerland), 2020-09, Vol.25 (18), p.4190

2020

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Comparative Study on Phenolic Compounds and Antioxidant Activities of Hop ( Humulus lupulus L.) Strobile Extracts

Plants (Basel), 2022-01, Vol.11 (1), p.135

2022

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Whitening Activity of Acteoside from Stachys sieboldii Fermented with Hericium erinaceus Mycelia on Melanocytes

Fermentation (Basel), 2023-08, Vol.9 (8), p.697

2023

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Changes in Functionality of Tenebrio molitor Larvae Fermented by Cordyceps militaris Mycelia

Foods, 2022-08, Vol.11 (16), p.2477

2022

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Cytotoxicity, metabolic enzyme inhibitory, and anti‐inflammatory effect of Lentinula edodes fermented using probiotic lactobacteria

Journal of food biochemistry, 2021-08, Vol.45 (8), p.e13838-n/a

2021

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An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

Journal of electronic materials, 2009-02, Vol.38 (2), p.257-265

2009

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Assessment of in vitro antimicrobial and antioxidant activities of Broussonetia × hanjiana M. Kim

Research on Crops, 2024-03, Vol.25 (ISSUE 1 (MARCH) 2024)

2024

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Evaluation of in vitro antimicrobial activity of Camellia sinensis leaves collected at different time of harvest

Research on Crops, 2023-06, Vol.24 (ISSUE 2 (JUNE))

2023

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Comparison of In vitro Antimicrobial and Antioxidant Activity of Acorus gramineus and Acorus calamus

Research journal of pharmacy and technology, 2023-01, Vol.16 (1), p.13-17

2023

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Verification of the Functional Antioxidant Activity and Antimelanogenic Properties of Extracts of Poria cocos Mycelium Fermented with Freeze-Dried Plum Powder

International journal of biomaterials, 2019-01, Vol.2019 (2019), p.1-8

2019

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Comparison of mineral and hazardous heavy metal contents in Lentinula edodes produced from Korea and China

Korean Journal of Food Preservation, 2021-08, Vol.28 (5), p.699-703

2021

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Comparison of in vitro antioxidant capacities of Phragmites communis Trin. and Phragmites japonica Steud

Korean Journal of Food Preservation, 2023, Vol.30 (6), p.960-968

2023

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Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies

Materials transactions, 2009-09, Vol.50 (9), p.2291-2296

2009

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Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures

Applied physics letters, 2009-07, Vol.95 (2)

2009

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Chemical Composition and Antibacterial Activity of Essential Oils Extracted from Wild and Planted Thuja orientalis Leaves in Korea

Journal of essential oil-bearing plants (Dehra Dun), 2019-09, Vol.22 (5), p.1407-1415

2019

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The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

Microelectronics and reliability, 2009-03, Vol.49 (3), p.288-295

2009

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Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

Journal of electronic materials, 2010-12, Vol.39 (12), p.2643-2652

2010

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Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applications

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1043-1047

2023

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The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

Journal of electronic materials, 2009-12, Vol.38 (12), p.2461-2469

2009

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Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Journal of electronic materials, 2006-11, Vol.35 (11), p.1975-1981

2006

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Wettability and interfacial reactions of Sn-based Pb-free solders with Cu– xZn alloy under bump metallurgies

Journal of alloys and compounds, 2009-04, Vol.474 (1), p.510-516

2009

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Extremely Large 3.5D Heterogeneous Integration for the Next-Generation Packaging Technology

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.893-898

2023

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Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

JOM (1989), 2010-07, Vol.62 (7), p.22-29

2010

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CoW Package Solution for Improving Thermal Characteristic of TSV-SiP for AI-Inference

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.1115-1118

2021

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Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM

Journal of electronic materials, 2009, Vol.38 (1), p.39-45

2009

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Phenolic Compounds in Extracts of Hibiscus acetosella (Cranberry Hibiscus) and Their Antioxidant and Antibacterial Properties

Comparative Study on Phenolic Compounds and Antioxidant Activities of Hop ( Humulus lupulus L.) Strobile Extracts

Whitening Activity of Acteoside from Stachys sieboldii Fermented with Hericium erinaceus Mycelia on Melanocytes

Changes in Functionality of Tenebrio molitor Larvae Fermented by Cordyceps militaris Mycelia

Cytotoxicity, metabolic enzyme inhibitory, and anti‐inflammatory effect of Lentinula edodes fermented using probiotic lactobacteria

An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate

Assessment of in vitro antimicrobial and antioxidant activities of Broussonetia × hanjiana M. Kim

Evaluation of in vitro antimicrobial activity of Camellia sinensis leaves collected at different time of harvest

Comparison of In vitro Antimicrobial and Antioxidant Activity of Acorus gramineus and Acorus calamus

Verification of the Functional Antioxidant Activity and Antimelanogenic Properties of Extracts of Poria cocos Mycelium Fermented with Freeze-Dried Plum Powder

Comparison of mineral and hazardous heavy metal contents in Lentinula edodes produced from Korea and China

Comparison of in vitro antioxidant capacities of Phragmites communis Trin. and Phragmites japonica Steud

Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies

Enhancement of heterogeneous nucleation of β-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures

Chemical Composition and Antibacterial Activity of Essential Oils Extracted from Wild and Planted Thuja orientalis Leaves in Korea

The evolution of microstructure and microhardness of Sn–Ag and Sn–Cu solders during high temperature aging

Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C

Die to Wafer Hybrid Cu Bonding for Fine Pitch 3D-IC Applications

The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy

Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering

Wettability and interfacial reactions of Sn-based Pb-free solders with Cu– xZn alloy under bump metallurgies

Extremely Large 3.5D Heterogeneous Integration for the Next-Generation Packaging Technology

Electromigration performance of Pb-free solder joints in terms of solder composition and joining path

CoW Package Solution for Improving Thermal Characteristic of TSV-SiP for AI-Inference

Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM

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