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INCOBAT: Innovative Cost Efficient Management System for Next Generation High Voltage Batteries

1, 2017

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On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Micromachines (Basel), 2020-05, Vol.11 (6), p.564

2020

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Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Microelectronic engineering, 2015-04, Vol.137, p.101-104

2015

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Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques

AIP Conference Proceedings, 2014, Vol.1601 (1), p.147

2014

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Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor

Microelectronics and reliability, 2022-10, Vol.137, p.114742, Article 114742

2022

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Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

Journal of electronic packaging, 2019-09, Vol.141 (3)

2019

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INCOBAT

Armengaud, Eric

1, 2017

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Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Journal of electronic packaging, 2018-03, Vol.140 (1)

2018

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Building reliable FE simulation models for a better behavior prediction of power electronic systems

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-8

2022

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Digital Twin-Based Lifetime Estimation of SiC Power Modules

2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD), 2024, p.478-481

2024

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Reliability testing of integrated low-temperature PVD PZT films

Microelectronics and reliability, 2018-09, Vol.88-90, p.835-839

2018

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Machine learning based meta-models for sensorless thermal load prediction

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.1045-1051

2021

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New Insight Into Defects and Degradation Kinetics in Lead Zirconate Titanate

2020 Joint Conference of the IEEE International Frequency Control Symposium and International Symposium on Applications of Ferroelectrics (IFCS-ISAF), 2020, p.1-3

2020

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Modelling the Lifetime of Heavy Wire-bonds in Power Devices - Concepts, Limitations and Challenges

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.670-678

2021

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An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages

Microelectronics and reliability, 2016-07, Vol.62, p.18-25

2016

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Leakage Current in Low-Temperature PVD PZT Films

2019 IEEE International Symposium on Applications of Ferroelectrics (ISAF), 2019, p.1-4

2019

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Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019, p.709-716

2019

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Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation

Microsystem technologies : sensors, actuators, systems integration, 2016-03, Vol.22 (3), p.569-575

2016

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Physics of Degradation based Surrogate Model using Deep Learning for Lifetime Prognostics of Solder Joints in Microelectronics

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022, p.759-762

2022

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Smart Features Integrated for Prognostics Health Management Assure the Functional Safety of the Electronics Systems at the High Level Required in Fully Automated Vehicles

Advanced Microsystems for Automotive Applications 2017, p.167-178

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The effects of underfill on the reliability of flip chip solder joints

Journal of electronic materials, 1999-09, Vol.28 (9), p.1017-1022

1999

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Characterization of partial discharge performance of die attach adhesives

Materials today : proceedings, 2017, Vol.4 (7), p.7137-7142

2017

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Technologies for the integration of miniaturised silicon sensor systems in fibre-reinforced composites

Technologies for Lightweight Structures (TLS), 2019-01, Vol.1 (2)

2019

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Next Generation Drivetrain Concept Featuring Self-learning Capabilities Enabled by Extended Information Technology Functionalities

Advanced Microsystems for Automotive Applications 2016, p.217-224

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Affordable and Safe High Performance Vehicle Computers with Ultra-Fast On-Board Ethernet for Automated Driving

Advanced Microsystems for Automotive Applications 2018, p.56-68

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INCOBAT: Innovative Cost Efficient Management System for Next Generation High Voltage Batteries

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Design for reliability of BEoL and 3-D TSV structures – A joint effort of FEA and innovative experimental techniques

Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor

Investigation of Active Power Cycling Combined With Passive Thermal Cycles on Discrete Power Electronic Devices

INCOBAT

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Building reliable FE simulation models for a better behavior prediction of power electronic systems

Digital Twin-Based Lifetime Estimation of SiC Power Modules

Reliability testing of integrated low-temperature PVD PZT films

Machine learning based meta-models for sensorless thermal load prediction

New Insight Into Defects and Degradation Kinetics in Lead Zirconate Titanate

Modelling the Lifetime of Heavy Wire-bonds in Power Devices - Concepts, Limitations and Challenges

An in-situ numerical–experimental approach for fatigue delamination characterization in microelectronic packages

Leakage Current in Low-Temperature PVD PZT Films

Comparisons of Solder Joints Fatigue Life Predictions and Several Long-Term Testing Results

Investigating fracture strength of poly-silicon membranes using microscopic loading tests and numerical simulation

Physics of Degradation based Surrogate Model using Deep Learning for Lifetime Prognostics of Solder Joints in Microelectronics

Smart Features Integrated for Prognostics Health Management Assure the Functional Safety of the Electronics Systems at the High Level Required in Fully Automated Vehicles

The effects of underfill on the reliability of flip chip solder joints

Characterization of partial discharge performance of die attach adhesives

Technologies for the integration of miniaturised silicon sensor systems in fibre-reinforced composites

Next Generation Drivetrain Concept Featuring Self-learning Capabilities Enabled by Extended Information Technology Functionalities

Affordable and Safe High Performance Vehicle Computers with Ultra-Fast On-Board Ethernet for Automated Driving

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