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Sequential Infiltration Synthesis for Line Edge Roughness Mitigation of EUV Resist

Journal of Photopolymer Science and Technology, 2017/12/20, Vol.30(6), pp.667-670

2017

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Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora ® LK HM

Japanese Journal of Applied Physics, 2010-04, Vol.49 (4S), p.4

2010

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Dielectric Reliability of 50 nm Half Pitch Structures in Aurora ® LK

Japanese Journal of Applied Physics, 2009-04, Vol.48 (4S), p.4

2009

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Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance

Thin solid films, 2011-03, Vol.519 (11), p.3619-3626

2011

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Integration of Porogen-Based Low-$k$ Films: Influence of Capping Layer Thickness and Long Thermal Anneals on Low-$k$ Damage and Reliability

Japanese Journal of Applied Physics, 2010-05, Vol.49 (5), p.05FD03-05FD03-4

2010

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Influence of porosity on electrical properties of low-k dielectrics

Microelectronic engineering, 2012-04, Vol.92, p.59-61

2012

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Impact of Hydrocarbon Control in Ultraviolet-Assisted Restoration Process for Extremely Porous Plasma Enhanced Chemical Vapor Deposition SiOCH Films with $k = 2.0

Japanese Journal of Applied Physics, 2012-05, Vol.51 (5), p.05EC04-05EC04-6

2012

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Characterization and optimization of porogen-based PECVD deposited extreme low- k materials as a function of UV-cure time

Surface & coatings technology, 2007-09, Vol.201 (22), p.9264-9268

2007

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Influence of the UV Cure on Advanced Plasma Enhanced Chemical Vapour Deposition Low-$k$ Materials

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5), p.05EB05-05EB05-5

2011

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The Improvement of Subthreshold Slope and Transconductance of p-Type Bulk Si Field-Effect Transistors by Solid-Source Doping

IEEE transactions on electron devices, 2017-06, Vol.64 (6), p.2492-2497

2017

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Porogen residues detection in optical properties of low- k dielectrics cured by ultraviolet radiation

Thin solid films, 2010-05, Vol.518 (15), p.4266-4272

2010

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Impact of Hydrocarbon Control in Ultraviolet-Assisted Restoration Process for Extremely Porous Plasma Enhanced Chemical Vapor Deposition SiOCH Films with k = 2.0

Japanese Journal of Applied Physics, 2012-05, Vol.51 (5S), p.5

2012

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New approach for calculation of line parameters of IC interconnects

Microelectronics international, 2001-04, Vol.18 (1), p.29-31

2001

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A robust k ∼ 2.3 SiCOH low- k film formed by porogen removal with UV-cure

Microelectronic engineering, 2007-11, Vol.84 (11), p.2575-2581

2007

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Influence of the UV Cure on Advanced Plasma Enhanced Chemical Vapour Deposition Low- k Materials

Japanese Journal of Applied Physics, 2011-05, Vol.50 (5S1), p.5

2011

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Dielectric Reliability of 50nm Half Pitch Structures in Aurora® LK

Japanese Journal of Applied Physics, 2009-04

2009

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A robust k2.3 SiCOH low-k film formed by porogen removal with UV-cure

Microelectronic engineering, 2007-11, Vol.84 (11), p.2575-2581

2007

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Optimization of low-k UV Curing: Effect of Wavelength on Critical Properties of the Dielectrics

MRS proceedings, 2009, Vol.1156 (1), Article 1156-D02-08

2009

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Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora\text{\textregistered LK HM

Jpn J Appl Phys, 2010-04, Vol.49 (4), p.04DB05-04DB05-5

2010

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Accurate analytic expressions for frequency-dependent inductance and resistance of single on-chip interconnects on conductive silicon substrate

Physics letters. A, 2002-01, Vol.293 (3), p.195-198

2002

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A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate

Microprocessors and microsystems, 2002-02, Vol.26 (1), p.45-48

2002

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Electrical characterization of low-k dielectrics and copper interconnects

De Roest, David

2003

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New analytic expressions for mutual inductance and resistance of coupled interconnects on lossy silicon substrate

2001 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (IEEE Cat. No.01EX496), 2001, p.192-200

2001

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Admittance matrix calculations of on-chip interconnects on lossy silicon substrate using multilayer Green's function

2001 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (IEEE Cat. No.01EX496), 2001, p.50-59

2001

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Sequential Infiltration Synthesis for Line Edge Roughness Mitigation of EUV Resist

Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora ® LK HM

Dielectric Reliability of 50 nm Half Pitch Structures in Aurora ® LK

Effect of ultraviolet curing wavelength on low-k dielectric material properties and plasma damage resistance

Integration of Porogen-Based Low-$k$ Films: Influence of Capping Layer Thickness and Long Thermal Anneals on Low-$k$ Damage and Reliability

Influence of porosity on electrical properties of low-k dielectrics

Impact of Hydrocarbon Control in Ultraviolet-Assisted Restoration Process for Extremely Porous Plasma Enhanced Chemical Vapor Deposition SiOCH Films with $k = 2.0

Characterization and optimization of porogen-based PECVD deposited extreme low- k materials as a function of UV-cure time

Influence of the UV Cure on Advanced Plasma Enhanced Chemical Vapour Deposition Low-$k$ Materials

The Improvement of Subthreshold Slope and Transconductance of p-Type Bulk Si Field-Effect Transistors by Solid-Source Doping

Porogen residues detection in optical properties of low- k dielectrics cured by ultraviolet radiation

Impact of Hydrocarbon Control in Ultraviolet-Assisted Restoration Process for Extremely Porous Plasma Enhanced Chemical Vapor Deposition SiOCH Films with k = 2.0

New approach for calculation of line parameters of IC interconnects

A robust k ∼ 2.3 SiCOH low- k film formed by porogen removal with UV-cure

Influence of the UV Cure on Advanced Plasma Enhanced Chemical Vapour Deposition Low- k Materials

Dielectric Reliability of 50nm Half Pitch Structures in Aurora® LK

A robust k2.3 SiCOH low-k film formed by porogen removal with UV-cure

Optimization of low-k UV Curing: Effect of Wavelength on Critical Properties of the Dielectrics

Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora\text{\textregistered LK HM

Accurate analytic expressions for frequency-dependent inductance and resistance of single on-chip interconnects on conductive silicon substrate

A CAD-oriented analytical model for frequency-dependent series resistance and inductance of microstrip on-chip interconnect on silicon substrate

Electrical characterization of low-k dielectrics and copper interconnects

New analytic expressions for mutual inductance and resistance of coupled interconnects on lossy silicon substrate

Admittance matrix calculations of on-chip interconnects on lossy silicon substrate using multilayer Green's function

The cross-national epidemiology of social anxiety disorder: Data from the World Mental Health Survey Initiative

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