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Multi-scale modelling of moisture diffusion coupled with stress distribution in CFRP laminated composites

Composite structures, 2016-03, Vol.138, p.295-304

2016

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Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

Journal of alloys and compounds, 2005-09, Vol.400 (1), p.136-144

2005

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Dissolution of electroless Ni metallization by lead-free solder alloys

Journal of alloys and compounds, 2005-02, Vol.388 (1), p.75-82

2005

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Effects of hygrothermal stress on the failure of CFRP composites

Composite structures, 2015-12, Vol.133, p.1024-1035

2015

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Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology

Microelectronic engineering, 2008, Vol.85 (1), p.238-244

2008

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Study of anisotropic conductive adhesive joint behavior under 3-point bending

Microelectronics and reliability, 2005-03, Vol.45 (3), p.589-596

2005

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3D FEA modelling of laminated composites in bending and their failure mechanisms

Composite structures, 2015-01, Vol.119, p.693-708

2015

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The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing

Soldering & surface mount technology, 2005-01, Vol.17 (2), p.40-48

2005

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The effects of unequal compressive/tensile moduli of composites

Composite structures, 2015-08, Vol.126, p.207-215

2015

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Modeling the diffusion of solid copper into liquid solder alloys

Thin solid films, 2009, Vol.517 (5), p.1686-1689

2009

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Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Journal of alloys and compounds, 2006-01, Vol.407 (1), p.208-214

2006

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Damage predictions in a chip resistor solder joint on flexible circuit board

Microelectronic engineering, 2010-10, Vol.87 (10), p.1889-1895

2010

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Effect of 9 wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads

Journal of alloys and compounds, 2005-06, Vol.396 (1), p.217-223

2005

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Effect of adding 0.3wt% Ni into the Sn–0.7wt% Cu solder

Journal of alloys and compounds, 2007-07, Vol.438 (1-2), p.122-128

2007

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Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder

Journal of alloys and compounds, 2007, Vol.438 (1), p.116-121

2007

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Effect of adding 0.3 wt% Ni into the Sn–0.7 wt% Cu solder

Journal of alloys and compounds, 2007, Vol.438 (1), p.122-128

2007

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Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Journal of alloys and compounds, 2006-01, Vol.407 (1-2), p.208-214

2006

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Effect of 9wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads

Journal of alloys and compounds, 2005-06, Vol.396 (1-2), p.217-223

2005

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Effect of adding 0.3wt% Ni into the Sn–0.7wt%Cu solder

Journal of alloys and compounds, 2007-07, Vol.438 (1-2), p.116-121

2007

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The effect of curing on the performance of ACF bonded chiponflex assemblies after thermal ageing

Soldering & surface mount technology, 2005-06, Vol.17 (2), p.40-48

2005

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Failure mechanisms of ACF joints under isothermal ageing

Microelectronics, 2008-09, Vol.39 (9), p.1101-1107

2008

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Modelling of jet-impingement cooling for power electronics

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2009, p.1-5

2009

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Modeling the Effect of Lead-free Soldering on Flexible Substrates

2006 International Conference on Electronic Materials and Packaging, 2006, p.1-5

2006

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Thermal-Mechanical Analysis of Flexible Substrates during Lead-Free Solder Reflow

2006 1st Electronic Systemintegration Technology Conference, 2006, Vol.2, p.1007-1011

2006

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Fusion of optimized moment based and Gabor texture features for better texture classification

8th International Multitopic Conference, 2004. Proceedings of INMIC 2004, 2004, p.41-48

2004

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Multi-scale modelling of moisture diffusion coupled with stress distribution in CFRP laminated composites

Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

Dissolution of electroless Ni metallization by lead-free solder alloys

Effects of hygrothermal stress on the failure of CFRP composites

Role of bonding time and temperature on the physical properties of coupled anisotropic conductive–nonconductive adhesive film for flip chip on glass technology

Study of anisotropic conductive adhesive joint behavior under 3-point bending

3D FEA modelling of laminated composites in bending and their failure mechanisms

The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing

The effects of unequal compressive/tensile moduli of composites

Modeling the diffusion of solid copper into liquid solder alloys

Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Damage predictions in a chip resistor solder joint on flexible circuit board

Effect of 9 wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads

Effect of adding 0.3wt% Ni into the Sn–0.7wt% Cu solder

Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder

Effect of adding 0.3 wt% Ni into the Sn–0.7 wt% Cu solder

Effect of adding 1wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

Effect of 9wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads

Effect of adding 0.3wt% Ni into the Sn–0.7wt%Cu solder

The effect of curing on the performance of ACF bonded chiponflex assemblies after thermal ageing

Failure mechanisms of ACF joints under isothermal ageing

Modelling of jet-impingement cooling for power electronics

Modeling the Effect of Lead-free Soldering on Flexible Substrates

Thermal-Mechanical Analysis of Flexible Substrates during Lead-Free Solder Reflow

Fusion of optimized moment based and Gabor texture features for better texture classification

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