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Surface roughness effect on copper–alumina adhesion

Microelectronics and reliability, 2013-09, Vol.53 (9-11), p.1548-1552

2013

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Plasma Chamber Environment Control to Enhance Bonding Strength for Wafer-to-Wafer Bonding Processing

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.2008-2012

2022

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Design and Simulation of Symmetric Wafer-to-Wafer Bonding Compesating a Gravity Effect

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1480-1485

2020

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Achieving Sub-nm Copper Recess Controllability for Advanced 3D Integration: An Experimental and Atomic-scale Simulation Study on Wet Atomic Layer Etching Process

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1322-1328

2024

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A New Evaluation Method of Bonding Strength Using Atomic Force Microscopy

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023, p.350-353

2023

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Alignment Vision System for Hybrid Bonding

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023, p.409-414

2023

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Contamination-Free Cu/SiCN Hybrid Bonding Process Development for Sub- μm Pitch Devices with Enhanced Bonding Characteristics

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1390-1396

2023

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Molecular Dynamics Study on Plasma-Surface Interactions of SiCN Dielectrics for Wafer-to-Wafer Hybrid Bonding Process

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022, p.527-533

2022

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Edge Detection Algorithm for Blurred Alignment Marks in Hybrid Bonding

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 2023, p.415-420

2023

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Characteristics of Plasma Treated Surface for SiO2-Si Wafer Bonding

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 2021, p.23-27

2021

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Stress-Free Thin Die-Level De-bonding for 2.5D, 3DIC Packaging

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022, p.179-182

2022

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Finite Element Modeling for Wafer-to-Wafer Direct Bonding Behaviors and Alignment Prediction

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1256-1259

2024

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Atomistic-scale Simulations on Surface Activation Process of Dielectric Oxides for Hybrid Bonding Applications

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 2021, p.8-12

2021

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Copper contamination control in Hybrid Copper Bonding

2023 International Conference on Electronics Packaging (ICEP), 2023, p.41-42

2023

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Stress-less Dicing Solution for Thin and Large Die Handling for 2.5D/3D IC Packaging

2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 2022, p.183-186

2022

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Thin Wafer De-bonding for 3D-TSV Packaging of High Bandwidth Memory Devices using UV Irradiation

2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 2021, p.668-671

2021

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Non Conductive Film Analysis Using Cure Kinetics and Rheokinetics for Gang Bonding Process for 3DIC TSV Packaging

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.706-710

2021

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Stress Analysis and Optimization on Saddle-shape Warpage by Direct Patterning of Stressed Film

IMAPSource Proceedings, 2024-02, Vol.2023 (Symposium)

2024

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Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1879-1885

2016

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Chip level evaluation of wafer-to-wafer direct bonding strength with bending test

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.310-317

2023

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A Performance Testing Method of Bernoullie Picker for Ultra-Thin Die Handling Application

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.157-161

2022

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Modeling of Spreading Behavior of UV-Curable Dielectric Ink from its Rheological Characteristics

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.774-779

2022

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Thermal management solutions and design guidelines for silicon based photonic integrated modules

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-6

2015

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Miniaturization of bio-fluidic package for point-of-care diagnostic

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-4

2015

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An efficient single phase liquid cooling system for microelectronic devices with high power chip

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, p.1-6

2015

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Surface roughness effect on copper–alumina adhesion

Plasma Chamber Environment Control to Enhance Bonding Strength for Wafer-to-Wafer Bonding Processing

Design and Simulation of Symmetric Wafer-to-Wafer Bonding Compesating a Gravity Effect

Achieving Sub-nm Copper Recess Controllability for Advanced 3D Integration: An Experimental and Atomic-scale Simulation Study on Wet Atomic Layer Etching Process

A New Evaluation Method of Bonding Strength Using Atomic Force Microscopy

Alignment Vision System for Hybrid Bonding

Contamination-Free Cu/SiCN Hybrid Bonding Process Development for Sub- μm Pitch Devices with Enhanced Bonding Characteristics

Molecular Dynamics Study on Plasma-Surface Interactions of SiCN Dielectrics for Wafer-to-Wafer Hybrid Bonding Process

Edge Detection Algorithm for Blurred Alignment Marks in Hybrid Bonding

Characteristics of Plasma Treated Surface for SiO2-Si Wafer Bonding

Stress-Free Thin Die-Level De-bonding for 2.5D, 3DIC Packaging

Finite Element Modeling for Wafer-to-Wafer Direct Bonding Behaviors and Alignment Prediction

Atomistic-scale Simulations on Surface Activation Process of Dielectric Oxides for Hybrid Bonding Applications

Copper contamination control in Hybrid Copper Bonding

Stress-less Dicing Solution for Thin and Large Die Handling for 2.5D/3D IC Packaging

Thin Wafer De-bonding for 3D-TSV Packaging of High Bandwidth Memory Devices using UV Irradiation

Non Conductive Film Analysis Using Cure Kinetics and Rheokinetics for Gang Bonding Process for 3DIC TSV Packaging

Stress Analysis and Optimization on Saddle-shape Warpage by Direct Patterning of Stressed Film

Study on Process Induced Wafer Level Warpage of Fan-Out Wafer Level Packaging

Chip level evaluation of wafer-to-wafer direct bonding strength with bending test

A Performance Testing Method of Bernoullie Picker for Ultra-Thin Die Handling Application

Modeling of Spreading Behavior of UV-Curable Dielectric Ink from its Rheological Characteristics

Thermal management solutions and design guidelines for silicon based photonic integrated modules

Miniaturization of bio-fluidic package for point-of-care diagnostic

An efficient single phase liquid cooling system for microelectronic devices with high power chip

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