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Comparative Analysis of Hot Carrier Degradation (HCD) in 10-nm Node nMOS/pMOS FinFET Devices
IEEE transactions on electron devices, 2020-12, Vol.67 (12), p.5396-5402
2020
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Enhanced Reliability of 7-nm Process Technology Featuring EUV
IEEE transactions on electron devices, 2019-12, Vol.66 (12), p.5399-5403
2019
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FEOL Self-heating and BEOL Joule-heating Effects of FinFET Technology and Its Implications for Reliability Prediction
2020 IEEE International Integrated Reliability Workshop (IIRW), 2020, p.1-5
2020
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Combination of ultraviolet exposure and thermal post-treatment to obtain high quality HfO2 thin films
Ceramics international, 2021-04, Vol.47 (7), p.9643-9650
2021
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Machine Learning Based V-ramp VBD Predictive Model Using OCD-measured Fab Parameters for Early Detection of MOL Reliability Risk
2023 IEEE International Reliability Physics Symposium (IRPS), 2023, p.1-4
2023
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Time Dependent Variability in Advanced FinFET Technology for End-of-Lifetime Reliability Prediction
2021 IEEE International Reliability Physics Symposium (IRPS), 2021, p.1-6
2021
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Electrical Characteristics of Bulk FinFET According to Spacer Length
Electronics (Basel), 2020-08, Vol.9 (8), p.1283
2020
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Chip to Package Interaction Risk Assessment of FCBGA Devices using FEA Simulation, Meta-Modeling and Multi-Objective Genetic Algorithm Optimization Technique
2021 IEEE International Reliability Physics Symposium (IRPS), 2021, p.1-6
2021
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Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology
2020 IEEE International Reliability Physics Symposium (IRPS), 2020, p.1-5
2020
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Soft-Error Susceptibility in Flip-Flop in EUV 7 nm Bulk-FinFET Technology
2021 IEEE International Reliability Physics Symposium (IRPS), 2021, p.1-7
2021
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PCB Strip Scale Numerical Study on Vacuum Molded Underfill Void Entrapment in FC-POP Devices
2019 IEEE International Integrated Reliability Workshop (IIRW), 2019, p.1-5
2019
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Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET
2020 IEEE International Reliability Physics Symposium (IRPS), 2020, p.1-5
2020
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Systematic Study of Process Impact on FinFET Reliability
2021 IEEE International Reliability Physics Symposium (IRPS), 2021, p.1-5
2021
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Reliability on EUV Interconnect Technology for 7nm and beyond
2020 IEEE International Reliability Physics Symposium (IRPS), 2020, p.1-4
2020
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Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM
2020 IEEE International Reliability Physics Symposium (IRPS), 2020, p.1-4
2020
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Enhanced Reliability of 7nm Process Technology featuring EUV
2019 Symposium on VLSI Technology, 2019, p.T16-T17
2019
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Trap Density Modulation for IO FinFET NBTI Improvement
2020 IEEE International Reliability Physics Symposium (IRPS), 2020, p.1-5
2020
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8LPP Logic Platform Technology for Cost-Effective High Volume Manufacturing
2018 IEEE Symposium on VLSI Technology, 2018, p.217-218
2018
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Reliability of Advanced FinFET Technology Nodes Beyond Planar: Invited
2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2020, p.1-4
2020
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Reliability on Evolutionary FinFET CMOS Technology and Beyond
2020 IEEE International Electron Devices Meeting (IEDM), 2020, p.9.3.1-9.3.4
2020
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In-situ Electrothermal TEM Investigation of Electromigration in fully Embedded Cu/Co Interconnects
2020 IEEE International Interconnect Technology Conference (IITC), 2020, p.127-129
2020
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Modeling gate-pitch scaling impact on stress-induced mobility and external resistance for 20nm-node MOSFETs
2010 International Conference on Simulation of Semiconductor Processes and Devices, 2010, p.79-82
2010
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Formation of Tisi 2 Thin Films from Chemical Vapor Deposition Using TiI 4
MRS proceedings, 1998, Vol.514, Article 345
1998
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Formation of Tisi2 Thin Films from Chemical Vapor Deposition Using TiI4
MRS proceedings, 1998, Vol.514
1998
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Parametric Study on the Void Risk in FC-POP Molded Underfill Process Using a Novel Porous Media, Two-Phase, Compressible Flow Simulation Method
IEEE transactions on device and materials reliability, 2020-06, Vol.20 (2), p.286-292
2020
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