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Recent progress of residual stress measurement methods: A review

Chinese journal of aeronautics, 2021-02, Vol.34 (2), p.54-78

2021

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Changes in surface layer of silicon wafers from diamond scratching

CIRP annals, 2015, Vol.64 (1), p.349-352

2015

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A novel approach of mechanical chemical grinding

Journal of alloys and compounds, 2017-12, Vol.726, p.514-524

2017

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A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut

Scientific reports, 2015-11, Vol.5 (1), p.16395-16395, Article 16395

2015

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A novel approach of high-performance grinding using developed diamond wheels

International journal of advanced manufacturing technology, 2017-08, Vol.91 (9-12), p.3315-3326

2017

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Study using ReaxFF-MD on the CMP process of fused glass in pure H2O/aqueous H2O2

Applied surface science, 2021-08, Vol.556, p.149756, Article 149756

2021

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A new polishing method for complex structural parts: Moist particle electrolyte electrochemical mechanical polishing (MPE-ECMP)

Electrochemistry communications, 2023-05, Vol.150, p.107475, Article 107475

2023

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Atomistic mechanisms of Cu CMP in aqueous H2O2: Molecular dynamics simulations using ReaxFF reactive force field

Computational materials science, 2018-12, Vol.155, p.476-482

2018

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On-line prediction of ultrasonic elliptical vibration cutting surface roughness of tungsten heavy alloy based on deep learning

Journal of intelligent manufacturing, 2022-03, Vol.33 (3), p.675-685

2022

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Effects of pressure and slurry on removal mechanism during the chemical mechanical polishing of quartz glass using ReaxFF MD

Applied surface science, 2020-03, Vol.505, p.144610, Article 144610

2020

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Novel localized vibration-assisted magnetic abrasive polishing method using loose abrasives for V-groove and Fresnel optics finishing

Optics express, 2018-04, Vol.26 (9), p.11608-11619

2018

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Study on chemical effects of H2O2 and glycine in the Copper CMP process using ReaxFF MD

Applied surface science, 2020-04, Vol.508, p.145262, Article 145262

2020

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Effect of surface hydroxylation on ultra-precision machining of quartz glass

Applied surface science, 2020-01, Vol.501, p.144170, Article 144170

2020

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Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high volume fraction

International journal of advanced manufacturing technology, 2017-11, Vol.93 (5-8), p.2827-2839

2017

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Recent progress in flexible supporting technology for aerospace thin-walled parts: A review

Chinese journal of aeronautics, 2022-03, Vol.35 (3), p.10-26

2022

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Experimental Study on Ultrasonic Assisted Turning of GH4068 Superalloy

Materials, 2023-05, Vol.16 (9), p.3554

2023

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Mechanical model of thrust force and torque in longitudinal-torsional coupled ultrasonic-assisted drilling of CFRP

International journal of advanced manufacturing technology, 2022-03, Vol.119 (1-2), p.189-202

2022

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Effect of grain size on subsurface characterization of pure iron subjected to orthogonal cutting

International journal of advanced manufacturing technology, 2022-06, Vol.120 (9-10), p.5793-5806

2022

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Solid-state phase transformation-induced residual stress in selective laser melting of martensitic stainless steel

International journal of advanced manufacturing technology, 2022-06, Vol.120 (9-10), p.6747-6760

2022

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Effect of Fiber Type and Content on Mechanical Property and Lapping Machinability of Fiber-Reinforced Polyetheretherketone

Polymers, 2022-03, Vol.14 (6), p.1079

2022

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Mechanism of gradient strengthening layer formation based on microstructure and microhardness of Inconel 718 grinding surface

International journal of advanced manufacturing technology, 2022-05, Vol.120 (3-4), p.2363-2372

2022

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The mechanical properties of the scratched surface for silica glass by molecular dynamics simulation

Journal of non-crystalline solids, 2015-07, Vol.420, p.1-6

2015

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Effect of Fiber Type and Content on Surface Quality and Removal Mechanism of Fiber-Reinforced Polyetheretherketone in Ultra-Precision Grinding

Polymers, 2022-10, Vol.14 (19), p.4223

2022

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Photoelectrochemically combined mechanical polishing of n-type gallium nitride wafer by using metal nanoparticles as photocathodes

International journal of advanced manufacturing technology, 2019-12, Vol.105 (11), p.4483-4489

2019

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Error Analysis of Normal Surface Measurements Based on Multiple Laser Displacement Sensors

Sensors (Basel, Switzerland), 2024-04, Vol.24 (7), p.2059

2024

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Recent progress of residual stress measurement methods: A review

Changes in surface layer of silicon wafers from diamond scratching

A novel approach of mechanical chemical grinding

A novel approach of high speed scratching on silicon wafers at nanoscale depths of cut

A novel approach of high-performance grinding using developed diamond wheels

Study using ReaxFF-MD on the CMP process of fused glass in pure H2O/aqueous H2O2

A new polishing method for complex structural parts: Moist particle electrolyte electrochemical mechanical polishing (MPE-ECMP)

Atomistic mechanisms of Cu CMP in aqueous H2O2: Molecular dynamics simulations using ReaxFF reactive force field

On-line prediction of ultrasonic elliptical vibration cutting surface roughness of tungsten heavy alloy based on deep learning

Effects of pressure and slurry on removal mechanism during the chemical mechanical polishing of quartz glass using ReaxFF MD

Novel localized vibration-assisted magnetic abrasive polishing method using loose abrasives for V-groove and Fresnel optics finishing

Study on chemical effects of H2O2 and glycine in the Copper CMP process using ReaxFF MD

Effect of surface hydroxylation on ultra-precision machining of quartz glass

Characterization of material removal in ultrasonically assisted grinding of SiCp/Al with high volume fraction

Recent progress in flexible supporting technology for aerospace thin-walled parts: A review

Experimental Study on Ultrasonic Assisted Turning of GH4068 Superalloy

Mechanical model of thrust force and torque in longitudinal-torsional coupled ultrasonic-assisted drilling of CFRP

Effect of grain size on subsurface characterization of pure iron subjected to orthogonal cutting

Solid-state phase transformation-induced residual stress in selective laser melting of martensitic stainless steel

Effect of Fiber Type and Content on Mechanical Property and Lapping Machinability of Fiber-Reinforced Polyetheretherketone

Mechanism of gradient strengthening layer formation based on microstructure and microhardness of Inconel 718 grinding surface

The mechanical properties of the scratched surface for silica glass by molecular dynamics simulation

Effect of Fiber Type and Content on Surface Quality and Removal Mechanism of Fiber-Reinforced Polyetheretherketone in Ultra-Precision Grinding

Photoelectrochemically combined mechanical polishing of n-type gallium nitride wafer by using metal nanoparticles as photocathodes

Error Analysis of Normal Surface Measurements Based on Multiple Laser Displacement Sensors

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