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Risk factors and pain status due to diabetic neuropathy in chronic long-term diabetic patients in a Chinese urban population

Chinese medical journal, 2012-12, Vol.125 (23), p.4190-4196

2012

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Multi-stage development process and model of steam chamber for SAGD production in a heavy oil reservoir with an interlayer

Scientific reports, 2024-04, Vol.14 (1), p.9959-9959, Article 9959

2024

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Influence of High-Pressure Nitrogenation on the Structural, Magnetic and Magnetocaloric Properties of La0.5Pr0.5Fe11.4Si1.6

Acta metallurgica sinica : English letters, 2015-11, Vol.28 (11), p.1382-1386

2015

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Multivariate error assessment of response time histories method for dynamic systems

Journal of Zhejiang University. A. Science, 2012-02, Vol.13 (2), p.121-131

2012

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Simulation study of evolution of helium bubbles in bulk tungsten

Fusion engineering and design, 2019-09, Vol.146, p.983-986

2019

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Well Pattern and Well Spacing Optimization of Large Volume Water Injection in a Low-Permeability Reservoir with Pressure Sensitivity

Geofluids, 2022-08, Vol.2022, p.1-9

2022

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Determination of the Initial Value Ranges of Nonlinear Solutions for a Log Ratio Bathymetric Inversion Model and Bathymetry Retrieval

IEEE journal of selected topics in applied earth observations and remote sensing, 2021, Vol.14, p.10875-10888

2021

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Individualized Chemotherapy in Advanced NSCLC Patients Based on mRNA Levels of BRCA1 and RRM1

Chinese journal of cancer research, 2012-09, Vol.24 (3), p.226-231

2012

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Through-Silicon Hole Interposers for 3-D IC Integration

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-09, Vol.4 (9), p.1407-1419

2014

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Supramolecular “Trojan Horse” for Nuclear Delivery of Dual Anticancer Drugs

Journal of the American Chemical Society, 2017-03, Vol.139 (8), p.2876-2879

2017

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Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-09, Vol.2 (9), p.1412-1419

2012

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Evaluation of Cu SnAg microbump bonding processes for 3D integration using wafer-level underfill film

Soldering & surface mount technology, 2012-01, Vol.24 (4), p.287-293

2012

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Two surface plasmon resonances effects for light through the perforated metal film

Optics communications, 2009-05, Vol.282 (10), p.2088-2092

2009

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Evaluation of Cu/Ni/SnAg microbump bonding processes for thin-chip-on-chip package using a wafer-level underfill film

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.385-391

2012

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Reliability enhancements of chip-on-chip package with layout designs of microbumps

Microelectronic engineering, 2014-05, Vol.120, p.138-145

2014

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Experimental study on the effect of different distributed interlayer on SAGD performance

Journal of petroleum science & engineering, 2022-02, Vol.209, p.109827, Article 109827

2022

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Reliability behaviors of an exposed die FCCSP on a substrate with ultra-low CTE laminate material

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2015, p.241-244

2015

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Synthesis and characterization of surface-modified Fe3O4 super-paramagnetic nanoparticles

Journal of Huazhong University of Science and Technology. Medical sciences, 2014-04, Vol.34 (2), p.270-275

2014

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Low-cost TSH (through-silicon hole) interposers for 3D IC integration

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.290-296

2014

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Performance and process characteristic of glass interposer with through-glass-via(TGV)

2013 IEEE International 3D Systems Integration Conference (3DIC), 2013, p.1-7

2013

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Investigation of the process for glass interposer

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013, p.194-197

2013

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Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.886-892

2011

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Modeling transient flow behavior of eccentric horizontal well in bi-zonal formation

Journal of petroleum science & engineering, 2022-01, Vol.208, p.109261, Article 109261

2022

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Pressure transient analysis of a fractured well in multi-region linear composite reservoirs

Journal of petroleum science & engineering, 2022-01, Vol.208, p.109262, Article 109262

2022

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Hybrid Resource Sharing Solution in Virtual Wireless Networks

2023 International Conference on Networking and Network Applications (NaNA), 2023, p.40-45

2023

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Risk factors and pain status due to diabetic neuropathy in chronic long-term diabetic patients in a Chinese urban population

Multi-stage development process and model of steam chamber for SAGD production in a heavy oil reservoir with an interlayer

Influence of High-Pressure Nitrogenation on the Structural, Magnetic and Magnetocaloric Properties of La0.5Pr0.5Fe11.4Si1.6

Multivariate error assessment of response time histories method for dynamic systems

Simulation study of evolution of helium bubbles in bulk tungsten

Well Pattern and Well Spacing Optimization of Large Volume Water Injection in a Low-Permeability Reservoir with Pressure Sensitivity

Determination of the Initial Value Ranges of Nonlinear Solutions for a Log Ratio Bathymetric Inversion Model and Bathymetry Retrieval

Individualized Chemotherapy in Advanced NSCLC Patients Based on mRNA Levels of BRCA1 and RRM1

Through-Silicon Hole Interposers for 3-D IC Integration

Supramolecular “Trojan Horse” for Nuclear Delivery of Dual Anticancer Drugs

Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film

Evaluation of Cu SnAg microbump bonding processes for 3D integration using wafer-level underfill film

Two surface plasmon resonances effects for light through the perforated metal film

Evaluation of Cu/Ni/SnAg microbump bonding processes for thin-chip-on-chip package using a wafer-level underfill film

Reliability enhancements of chip-on-chip package with layout designs of microbumps

Experimental study on the effect of different distributed interlayer on SAGD performance

Reliability behaviors of an exposed die FCCSP on a substrate with ultra-low CTE laminate material

Synthesis and characterization of surface-modified Fe3O4 super-paramagnetic nanoparticles

Low-cost TSH (through-silicon hole) interposers for 3D IC integration

Performance and process characteristic of glass interposer with through-glass-via(TGV)

Investigation of the process for glass interposer

Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture

Modeling transient flow behavior of eccentric horizontal well in bi-zonal formation

Pressure transient analysis of a fractured well in multi-region linear composite reservoirs

Hybrid Resource Sharing Solution in Virtual Wireless Networks

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