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Invited Article: A materials investigation of a phase-change micro-valve for greenhouse gas collection and other potential applications

Review of scientific instruments, 2012-03, Vol.83 (3), p.031301-031301-11

2012

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Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder-Part I: As-cast condition

Journal of electronic materials, 2004-11, Vol.33 (11), p.1389-1400

2004

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Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties

Journal of electronic materials, 2020, Vol.49 (1), p.152-172

2020

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Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

Journal of electronic materials, 2004-09, Vol.33 (9), p.991-1004

2004

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Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2010-12, Vol.41 (12), p.3042-3052

2010

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Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II: Aged condition

Journal of electronic materials, 2004-12, Vol.33 (12), p.1473-1484

2004

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Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder

Journal of electronic materials, 2003-03, Vol.32 (3), p.142-151

2003

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Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

Journal of electronic materials, 2010, Vol.39 (1), p.97-104

2010

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Dissolution and Interface Reactions between Palladium and Tin(Sn)-Based Solders: Part II. 63Sn-37Pb Alloy

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2010-12, Vol.41 (12), p.3053-3064

2010

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Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders

Journal of materials science. Materials in electronics, 2007-03, Vol.18 (1-3), p.93-119

2007

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The compression stress-strain behavior of Sn-Ag-Cu solder

JOM (1989), 2003-06, Vol.55 (6), p.50-55

2003

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Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated Kovar substrates

Journal of electronic materials, 2005-03, Vol.34 (3), p.299-310

2005

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Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-plated Kovar

Journal of electronic materials, 2003-04, Vol.32 (4), p.254-260

2003

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Validation of the dynamic recrystallization (DRX) mechanism for whisker and hillock growth on thin films

Journal of electronic materials, 2015-05, Vol.44 (10)

2015

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Creep Behavior of a Sn-Ag-Bi Pb-Free Solder

Materials, 2012-11, Vol.5 (11), p.2151-2175

2012

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Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth in Thin Films

2014

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Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth in Thin Films

2014

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Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders: Lead-free electronic solders

Journal of materials science. Materials in electronics, 2007, Vol.18 (1-3), p.93-119

2007

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Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples

IEEE transactions on components, packaging, and manufacturing technology. Part A, 1997-12, Vol.20 (4), p.478-490

1997

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Solder bond applications in a piezoelectric sensor assembly

Proceedings of the 45th Annual Symposium on Frequency Control 1991, 1991, p.266-280

1991

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Development of Sn-Based, Low Melting Temperature Pb-Free Solder Alloys

Materials transactions, 2004, Vol.45 (3), p.765-775

2004

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Kinetics of Pb-rich Phase Particle Coarsening in Sn–Pb Solder Under Isothermal Annealing–cooling Rate Dependence

Journal of materials research, 2005-06, Vol.20 (6), p.1563-1573

2005

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Compression Creep Behavior of the 95.5Sn-(4.3, 3.9, 3.8)Ag-(0.2, 0.6, 0.7)Cu Solders

MRS proceedings, 2006, Vol.968, Article 0968-V04-02

2006

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Invited Article: A materials investigation of a phase-change micro-valve for greenhouse gas collection and other potential applications

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder-Part I: As-cast condition

Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties

Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder

Dissolution and Interface Reactions between Palladium and Tin (Sn)-Based Solders: Part I. 95.5Sn-3.9Ag-0.6Cu Alloy

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II: Aged condition

Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder

Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

Dissolution and Interface Reactions between Palladium and Tin(Sn)-Based Solders: Part II. 63Sn-37Pb Alloy

Compression stress–strain and creep properties of the 52In–48Sn and 97In–3Ag low-temperature Pb-free solders

The compression stress-strain behavior of Sn-Ag-Cu solder

Solderability testing of Sn-Ag-XCu Pb-free solders on copper and Au-Ni-plated Kovar substrates

Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-plated Kovar

Validation of the dynamic recrystallization (DRX) mechanism for whisker and hillock growth on thin films

Creep Behavior of a Sn-Ag-Bi Pb-Free Solder

Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth in Thin Films

Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth in Thin Films

Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders: Lead-free electronic solders

Intermetallic compound layer development during the solid state thermal aging of 63Sn-37Pb solder/Au-Pt-Pd thick film couples

Solder bond applications in a piezoelectric sensor assembly

Development of Sn-Based, Low Melting Temperature Pb-Free Solder Alloys

Kinetics of Pb-rich Phase Particle Coarsening in Sn–Pb Solder Under Isothermal Annealing–cooling Rate Dependence

Compression Creep Behavior of the 95.5Sn-(4.3, 3.9, 3.8)Ag-(0.2, 0.6, 0.7)Cu Solders

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