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A generalized dynamic model for spindle vibration influencing surface topography in different ultra-precision machining processes

International journal of advanced manufacturing technology, 2018-05, Vol.96 (5-8), p.2471-2478

2018

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Investigation of Noise Sources in Fractional-Slot Concentrated Winding Motors Considering High-Order Radial/Tangential Electromagnetic Force Combination and Modulation

IEEE access, 2023-01, Vol.11, p.1-1

2023

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Microstructure Evolution and Mechanical Properties of AZ31 Alloy with Accumulative Roll Bonding

Materials transactions, 2020-05, Vol.61 (5), p.893-902

2020

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High Temperature Wear Behaviors of Laser Cladded NiCrBSi Coatings

Ji guang yu guang dian zi jin zhan, 2019, Vol.56 (10), p.101601

2019

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High-Temperature Wear Behavior of Laser-Cladding Stellite 6 Coating

Ji guang yu guang dian zi jin zhan, 2019-07, Vol.56 (14), p.141403

2019

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A hybrid microchannel heat sink with ultra-low pressure drop for hotspot thermal management

International journal of heat and mass transfer, 2023-09, Vol.211, p.124201, Article 124201

2023

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Influence of rolling temperature on microstructural evolution and mechanical behavior of AZ31 alloy with accumulative roll bonding

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2019-04, Vol.754, p.112-120

2019

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An efficient Green's function-based Bayesian optimization method for the thermal optimization of multi-chips on a silicon interposer

International communications in heat and mass transfer, 2024-04, Vol.153, p.107379, Article 107379

2024

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Thermal analysis of GaN HEMTs using nongray multi-speed phonon lattice Boltzmann method under Joule heating effect

Microelectronics, 2024-09, Vol.151, p.106366, Article 106366

2024

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An innovative manifold microchannel heat sink for thermal management of high-power chips with multiple hotspots

Numerical heat transfer. Part A, Applications, 2024-07, p.1-22

2024

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Thermal transport mechanism of 4H–SiC/SiO2 heterostructures: a molecular dynamics study

Physica scripta, 2024-01, Vol.99 (1)

2024

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Thermal transport mechanism of 4H–SiC/SiO 2 heterostructures: a molecular dynamics study

Physica scripta, 2024-01, Vol.99 (1), p.15936

2024

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Quantitative assessment of thermal resistance in graphene field-effect transistors based on a phonon hydrodynamics and van der Waals coupling approach

International communications in heat and mass transfer, 2024-09, Vol.157, p.107716, Article 107716

2024

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A universal and efficient equivalent modeling method for thermal analysis of 3D ICs containing tapered TSVs

International communications in heat and mass transfer, 2022-07, Vol.136, p.106161, Article 106161

2022

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Rapid heat source layout optimization in three‐dimensional integrated circuits using artificial neural network reduced‐order model in combination with Bayesian optimization

Heat transfer (Hoboken, N.J. Print), 2024-05

2024

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Pressure-dependence of mechanical and thermodynamic properties of Al3Zr in Al-Li alloys from first-principles calculations

Philosophical magazine (Abingdon, England), 2019-04, Vol.99 (8), p.971-991

2019

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Thermal modeling and analysis of 3-D integrated circuits with irregular structure

Thermal science, 2023, Vol.27 (5 Part B), p.4193-4207

2023

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Pressure-dependence of mechanical and thermodynamic properties of Al 3 Zr in Al–Li alloys from first-principles calculations

Philosophical magazine (Abingdon, England), 2019-04, Vol.99 (8), p.971-991

2019

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Analysis of dynamic characteristics of bubble rise under a free surface

Canadian journal of physics, 2020-11, Vol.98 (11), p.981-992

2020

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Non-fourier phonon heat transport in graphene nanoribbon field effect transistors based on modified phonon hydrodynamic lattice Boltzmann method

Microelectronics, 2024-03, Vol.145, p.106104, Article 106104

2024

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Optimizing Heat Source Arrangement for 3D ICs with irregular structures using machine learning methods

2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023, p.1-6

2023

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Guide pair vibration characteristics for the on-line detection equipment of auto staping parts

2010 International Conference on Mechanic Automation and Control Engineering, 2010, p.474-478

2010

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Mechanism Simulation Based on ADAMS and Structure Optimization for Automobile Punching Parts On-Line Detector

Advanced materials research, 2011, Vol.211-212, p.619-623

2011

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A Universal and Efficient Equivalent Modeling Method for Thermal Analysis of 3D ICs Containing Tapered TSVs

SSRN Electronic Journal

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A finite element method with grouped smooth constraints

Sixth International Conference on Electrical Machines and Systems, 2003. ICEMS 2003, 2003, Vol.2, p.837-840 vol.2

2003

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A generalized dynamic model for spindle vibration influencing surface topography in different ultra-precision machining processes

Investigation of Noise Sources in Fractional-Slot Concentrated Winding Motors Considering High-Order Radial/Tangential Electromagnetic Force Combination and Modulation

Microstructure Evolution and Mechanical Properties of AZ31 Alloy with Accumulative Roll Bonding

High Temperature Wear Behaviors of Laser Cladded NiCrBSi Coatings

High-Temperature Wear Behavior of Laser-Cladding Stellite 6 Coating

A hybrid microchannel heat sink with ultra-low pressure drop for hotspot thermal management

Influence of rolling temperature on microstructural evolution and mechanical behavior of AZ31 alloy with accumulative roll bonding

An efficient Green's function-based Bayesian optimization method for the thermal optimization of multi-chips on a silicon interposer

Thermal analysis of GaN HEMTs using nongray multi-speed phonon lattice Boltzmann method under Joule heating effect

An innovative manifold microchannel heat sink for thermal management of high-power chips with multiple hotspots

Thermal transport mechanism of 4H–SiC/SiO2 heterostructures: a molecular dynamics study

Thermal transport mechanism of 4H–SiC/SiO 2 heterostructures: a molecular dynamics study

Quantitative assessment of thermal resistance in graphene field-effect transistors based on a phonon hydrodynamics and van der Waals coupling approach

A universal and efficient equivalent modeling method for thermal analysis of 3D ICs containing tapered TSVs

Rapid heat source layout optimization in three‐dimensional integrated circuits using artificial neural network reduced‐order model in combination with Bayesian optimization

Pressure-dependence of mechanical and thermodynamic properties of Al3Zr in Al-Li alloys from first-principles calculations

Thermal modeling and analysis of 3-D integrated circuits with irregular structure

Pressure-dependence of mechanical and thermodynamic properties of Al 3 Zr in Al–Li alloys from first-principles calculations

Analysis of dynamic characteristics of bubble rise under a free surface

Non-fourier phonon heat transport in graphene nanoribbon field effect transistors based on modified phonon hydrodynamic lattice Boltzmann method

Optimizing Heat Source Arrangement for 3D ICs with irregular structures using machine learning methods

Guide pair vibration characteristics for the on-line detection equipment of auto staping parts

Mechanism Simulation Based on ADAMS and Structure Optimization for Automobile Punching Parts On-Line Detector

A Universal and Efficient Equivalent Modeling Method for Thermal Analysis of 3D ICs Containing Tapered TSVs

A finite element method with grouped smooth constraints

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