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Simple Risk Models to Predict Surgical Mortality in Acute Type A Aortic Dissection: The International Registry of Acute Aortic Dissection Score

The Annals of thoracic surgery, 2007, Vol.83 (1), p.55-61

2007

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Geographic Differences in Clinical Presentation, Treatment, and Outcomes in Type A Acute Aortic Dissection (from the International Registry of Acute Aortic Dissection)

The American journal of cardiology, 2008-12, Vol.102 (11), p.1562-1566

2008

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Boundary-Condition-Independent Reduced-Order Modeling of Heat Transfer in Complex Objects by POD-Galerkin Methodology: 1D Case Study

Journal of heat transfer, 2010-06, Vol.132 (6)

2010

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A simplified CFD modeling technique for Small Form factor Pluggable transceiver

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2010, p.1-6

2010

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Thermal analysis of opto-electronic packages - the Delphi-based compact thermal model and other modeling practices in the industry

2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2010, p.264-270

2010

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Long-term survival in patients presenting with type B: Acute Aortic Dissection insights from the International Registry of Acute Aortic Dissection

Circulation (New York, N.Y.), 2006-11, Vol.114 (21), p.2226-2231

2006

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Application of phase change materials in handheld computing devices

2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2016, p.213-217

2016

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Thermal management challenges in forced convection tablets

2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015, p.37-40

2015

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Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Journal of electronic packaging, 2011-03, Vol.133 (1)

2011

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Boundary-Condition-Independent Reduced-Order Modeling of Complex Electronic Packages by POD-Galerkin Methodology

IEEE transactions on components and packaging technologies, 2010-09, Vol.33 (3), p.588-596

2010

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Boundary-condition-independent reduced-order modeling of complex 2D objects by POD-Galerkin methodology

2009 25th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2009, p.208-215

2009

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Algorithm and VLSI architecture for high performance adaptive video scaling

IEEE transactions on multimedia, 2003-12, Vol.5 (4), p.489-502

2003

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Position, Navigation and Timing with Dedicated Metropolitan Beacon Systems

Position, Navigation, and Timing Technologies in the 21st Century, 2020, p.1225-1241

1, 2020

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Boundary-condition-independent reduced-order modeling for thermal analysis of complex electronics packages

Raghupathy, Arun Prakash

2009

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Algorithm-based low-power and high-performance multimedia signal processing

Proceedings of the IEEE, 1998-06, Vol.86 (6), p.1155-1202

1998

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Influence of temperature gradient on electromigration failures in 3D packaging

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, p.70-76

2016

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Experimental and computational evaluation of phase change materials for handheld computing

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, p.118-124

2016

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Thermal design of monocular vision system used in automotive application

2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2017, p.1-7

2017

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Boundary-Condition-Independent Reduced-Order Modeling of Heat Transfer in Complex Objects by POD-Galerkin Methodology: 1D Case Study

Journal of heat transfer, 2010-06, Vol.132 (6), p.064502 (4 )-064502 (4 )

2010

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System architecture of an adaptive reconfigurable DSP computing engine

IEEE transactions on circuits and systems for video technology, 1998-02, Vol.8 (1), p.54-73

1998

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Best engineering practice for thermal characterization of stacked dice FPGA devices

2015 International 3D Systems Integration Conference (3DIC), 2015, p.TS8.21.1-TS8.21.8

2015

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Low-power and high-speed algorithms and VLSI architectures for error control coding and adaptive video scaling

Raghupathy, Arun

1998

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VLSI implementation considerations for turbo decoding using a low latency log-MAP

1999 Digest of Technical Papers. International Conference on Consumer Electronics (Cat. No.99CH36277), 1999, p.182-183

1999

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Boundary-condition-independent reduced-order modeling for thermal analysis of complex electronics packages

Dissertation Abstracts International, 2009, Vol.70 (7), p.246-246

Raghupathy, Arun Prakash

2009

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Boundary-condition-independent reduced-order modeling of 3D objects by the POD-Galerkin methodology

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2010, p.1-10

2010

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Simple Risk Models to Predict Surgical Mortality in Acute Type A Aortic Dissection: The International Registry of Acute Aortic Dissection Score

Geographic Differences in Clinical Presentation, Treatment, and Outcomes in Type A Acute Aortic Dissection (from the International Registry of Acute Aortic Dissection)

Boundary-Condition-Independent Reduced-Order Modeling of Heat Transfer in Complex Objects by POD-Galerkin Methodology: 1D Case Study

A simplified CFD modeling technique for Small Form factor Pluggable transceiver

Thermal analysis of opto-electronic packages - the Delphi-based compact thermal model and other modeling practices in the industry

Long-term survival in patients presenting with type B: Acute Aortic Dissection insights from the International Registry of Acute Aortic Dissection

Application of phase change materials in handheld computing devices

Thermal management challenges in forced convection tablets

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Boundary-Condition-Independent Reduced-Order Modeling of Complex Electronic Packages by POD-Galerkin Methodology

Boundary-condition-independent reduced-order modeling of complex 2D objects by POD-Galerkin methodology

Algorithm and VLSI architecture for high performance adaptive video scaling

Position, Navigation and Timing with Dedicated Metropolitan Beacon Systems

Boundary-condition-independent reduced-order modeling for thermal analysis of complex electronics packages

Algorithm-based low-power and high-performance multimedia signal processing

Influence of temperature gradient on electromigration failures in 3D packaging

Experimental and computational evaluation of phase change materials for handheld computing

Thermal design of monocular vision system used in automotive application

Boundary-Condition-Independent Reduced-Order Modeling of Heat Transfer in Complex Objects by POD-Galerkin Methodology: 1D Case Study

System architecture of an adaptive reconfigurable DSP computing engine

Best engineering practice for thermal characterization of stacked dice FPGA devices

Low-power and high-speed algorithms and VLSI architectures for error control coding and adaptive video scaling

VLSI implementation considerations for turbo decoding using a low latency log-MAP

Boundary-condition-independent reduced-order modeling for thermal analysis of complex electronics packages

Boundary-condition-independent reduced-order modeling of 3D objects by the POD-Galerkin methodology

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